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- Flash Memory
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the highest-capacity mobile DRAM – the industry’s first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) package – optimized for tomorrow’s premium smartphones. Featuring higher capacity than most ultra-thin notebooks, the new mobile DRAM will enable smartphone users to take full advantage of all the features in next-generation smartphones.
“With mass production of the new LPDDR4X, Samsung is now providing a comprehensive lineup of advanced memory to power the new era of smartphones, from 12GB mobile DRAM to 512GB eUFS 3.0 storage,” said Sewon Chun, executive vice president of Memory Marketing at Samsung Electronics. “Moreover, with the LPDDR4X, we’re strengthening our position as the premium mobile memory maker best positioned to accommodate rapidly growing demand from global smartphone manufacturers.”
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- Flash Memory
Western Digital Corp., a global data infrastructure leader, is accelerating the NVMe transition of value-PC storage by adding an NVMe model to its award-winning WD Blue solid state drive (SSD) portfolio, the WD Blue SN500 NVMe SSD. The new SSD delivers three times the performance of its SATA counterpart1 while maintaining the reliability the WD Blue product line is known for. For content creators and PC enthusiasts, the WD Blue SN500 NVMe SSD is optimized for multitasking and resource-heavy applications, providing near-instant access to files and programs.
Leveraging the scalable in-house SSD architecture of the highly acclaimed WD Black SN750 NVMe SSD, the new WD Blue SN500 NVMe SSD is also built on Western Digital’s own 3D NAND technology, firmware and controller, and delivers sequential read and write speeds up to 1,700MB/s and 1,450MB/s respectively (for 500GB model) with efficient power consumption as low as 2.7W. Demands on storage are continuing to grow and client workloads are evolving, the WD Blue SN500 NVMe SSD features high sustained write performance over SATA as well as other emerging technologies on the market today to give that performance edge.
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- Flash Memory
Toshiba Memory America, Inc., the U.S.-based subsidiary of Toshiba Memory Corporation, announced availability of its XD5 Series NVMe SSD platform in a 2.5-inch, 7mm low-profile form factor that is optimized for low-latency and performance consistency in read-intensive workloads. Developed for both data center and cloud environments, the new 2.5-inch form factor XD5 Series is ideal for NoSQL databases, large-scale-out data mining and analysis, and streaming applications. The XD5 Series is also well-suited for Open Compute Project (OCP) applications and systems.
Built on 64-layer BiCS FLASH™ TLC (3-bit-per-cell) 3D flash memory, and featuring a PCIe® Gen3x4 interface, the new XD5 SSD 2.5-inch option delivers sequential read performance up to 2,700 megabytes per second (MB/s) and sequential write performance up to 895MB/s with low active power consumption of 7 watts. At one drive write per day4 (DWPD), the XD5 Series can write nearly 4 terabytes (TB) of random data daily for five years at a consistent performance rate. Random read/write performance is specified at 250,000/21,000 Input/Output Operations per Second (IOPS) respectively, making the XD5 Series a predictable and reliable solution for read-intensive or heavy transactional workloads.
The XD5 2.5-inch Series expands Toshiba Memory’s broad data center SSD portfolio and complements the previously released M.2 22100 form factor which supports 1,920 gigabyte (GB) and 3,840GB capacities. The flash memory and controllers leveraged within the XD5 Series offer high reliability, data protection, end-to-end error detection and power-loss protection, and the product is backed by a five-year limited warranty.
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- Duplicators
Vinpower Digital, a recognized global manufacturer and distributor of digital duplication equipment and accessories, has recently finalized the acquisition of the complete digital duplication product line from the world renowned ACARD Technology Corporation, a Taiwan publicly traded company in the OTC market. With the acquisition of ACARD’s proprietary native SATA IC’s and storage CPU / SOC technology, in addition to other related IP’s, Vinpower will position itself as the leading global manufacturer of digital duplication and storage related hardware and accessories. Plus, for those who have purchased ACARD products previously, Vinpower is committed to providing worldwide technical support for ACARD’s existing global customer base.
To accommodate the expansive global duplication marketplace, Vinpower Digital has announced it will utilize the extensive technology and IP’s acquired from ACARD to advance development in its own market leading duplication and storage hardware. In utilizing ACARD’s proprietary CPU / SOC, will allow Vinpower to quickly develop and release duplication and storage products for nearly any storage technology available now or will be introduced in the future at a much lower price point than existing development techniques used by other manufacturers. The ACARD CPU / SOC includes added storage interfaces and the ability to implement virtually unlimited internal and/or external daisy chain functionality, expanding the size and scope of any storage hardware Vinpower develops in the future.
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- Other
The USB Promoter Group today announced the pending release of the USB4 specification, a major update to deliver the next generation USB architecture that compliments and builds on the existing USB 3.2 and USB 2.0 architectures. The USB4 architecture is based on the Thunderbolt protocol specification recently contributed by Intel Corporation. It doubles the bandwidth of USB and enables multiple simultaneous data and display protocols.
The new USB4 architecture defines a method to share a single high-speed link with multiple end device types dynamically that best serves the transfer of data by type and application. As the USB Type-C™ connector has evolved into the role as the external display port of many host products, the USB4 specification provides the host the ability to optimally scale allocations for display data flow. Even as the USB4 specification introduces a new underlying protocol, compatibility with existing USB 3.2, USB 2.0 and Thunderbolt 3 hosts and devices is supported; the resulting connection scales to the best mutual capability of the devices being connected.
“The primary goal of USB is to deliver the best user experience combining data, display and power delivery over a user-friendly and robust cable and connector solution,” said Brad Saunders, USB Promoter Group Chairman. “The USB4 solution specifically tailors bus operation to further enhance this experience by optimizing the blend of data and display over a single connection and enabling the further doubling of performance.”
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- Network Storage
QNAP Systems, Inc. today officially launched the TS-2888X, an AI-Ready NAS specifically optimized for AI model training. Built using powerful Intel Xeon W processors with up to 18 cores and employing a flash-optimized hybrid storage architecture for IOPS-intensive workloads, the TS-2888X also supports installing up to 4 high-end graphics cards and runs QNAP’s AI developer package “QuAI”. The TS-2888X packs everything required for machine learning AI, greatly reducing latency, accelerating data transfer, and eliminating performance bottlenecks caused by network connectivity to expedite AI implementation.
Conventional AI workstations usually have massive price tags, and the complexity of configuring hardware and software is an obstacle for most data scientists and developers. The use of public clouds for storage and training may also raise concerns when using sensitive data. QNAP’s TS-2888X introduces an all-in-one AI solution that integrates huge storage potential, powerful computing, a ready-to-use AI environment, and comprehensive data protection to supplement AI workflows. It not only serves as a Training Server for AI models, but can also serve as an Inference Server, thereby further lowering the R&D entry barrier, making AI development more feasible and easily accessible.
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- Flash Memory
Micron Technology, Inc. today added a new cost-efficient solid-state drive (SSD) to its client computing portfolio. The Micron 1300 SSD makes flash storage accessible to more users, enabling its adoption in a broader set of personal computing devices for a better mobile computing experience. Consumers who are eager to move from rotating media to solid state drives value fast performance, quick startup, and reliability -- whether for desktop, mobile or workstation PCs. SSDs address these needs better than power-hungry hard disk drives (HDDs), yet their higher prices have kept users from shifting to SSDs. Micron redesigned the 1300 SSD series to close the price gap.
"The deployment of advanced 3D NAND technologies has led the client SSD market to branch into value and higher-performance storage segments," said Gregory Wong, president of Forward Insights. "Micron's latest client SSD solutions provide a coherent migration path from HDD to value-oriented SSDs."
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- Flash Memory
Western Digital Corp. today announced two new additions to its broad portfolio of NVMe-based systems, platforms, SSDs, and memory drives for data center and cloud customers. With a full portfolio covering applications from edge-to-core, these additions are the Western Digital Ultrastar DC SN630 NVMe SSD and the Western Digital CL SN720 NVMe SSD. Each leverages the power of Western Digital’s vertical integration capabilities, including internally developed controller and firmware architectures, and 64-layer 3D NAND technology. As a replacement for lower-performing SATA SSDs, these new NVMe drives meet the insatiable need for performance, scalability, endurance and low total cost of ownership (TCO) for public and private cloud deployments, hyperscale cloud environments, and next-generation workloads at the edge.
IT managers face challenges such as managing multiple workload types, scaling at optimal TCO, and controlling server sprawl. Due to its inherent scalability and performance benefits, NVMe is quickly becoming the de facto standard for everything from traditional scale-up database applications to emerging edge computing architectures.
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- Flash Memory
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) 3.0 for next-generation mobile devices. In line with the latest eUFS 3.0 specification, the new Samsung memory delivers twice the speed of the previous eUFS storage (eUFS 2.1), allowing mobile memory to support seamless user experiences in future smartphones with ultra-large high-resolution screens.
“Beginning mass production of our eUFS 3.0 lineup gives us a great advantage in the next-generation mobile market to which we are bringing a memory read speed that was before only available on ultra-slim laptops,” said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. “As we expand our eUFS 3.0 offerings, including a 1-Terabyte (TB) version later this year, we expect to play a major role in accelerating momentum within the premium mobile market.”
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- Network Storage
QNAP Systems, Inc. today unveiled the new dual-port 25GbE QXG-25G2SF-CX4 and 10GbE QXG-10G2SF-CX4 network NICs. Featuring Mellanox ConnectX-4 Lx SmartNIC controllers, these cards can greatly boost file transfer speeds and also support iSER (iSCSI Extension for RDMA) to optimize VMware virtualization. Both cards are PCIe Gen3 ×8 and can be installed in a Windows®/Linux® PC or compatible QNAP NAS.
“Cloud, big data, high-speed storage, virtualization, and AI are strongly pushing 25GbE into the mainstream,” said Dan Lin, Product Manager of QNAP, adding “QNAP now provides users with a scalable solution for adopting 25GbE infrastructure by leveraging the industry-leading Mellanox Ethernet solution to deliver a next-gen 25GbE NIC for NAS, servers and workstations."
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