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Lexar, a leading brand of flash memory solution, proudly unveils the world’s fastest Lexar® Professional CFexpress Type B Card DIAMOND Series and Lexar Professional CFexpress Type A Card GOLD Series at the National Association of Broadcasters (NAB) event this week in Las Vegas, Nevada.
From field to post production, Lexar aims to provide our users products that offer unmatched quality, performance, reliability and compatibility to dramatically accelerate workflow from start to finish.
To meet the demand of high-performance memory solution needed for professional filmmakers and content creators, the Lexar® Professional CFexpress™ Type B Card DIAMOND Series provides unmatched read speeds of up to 1900MB/s, dramatically accelerating your post-production workflow for enhanced productivity. And with blazing-fast write speeds of up to 1700MB/s, quickly capture smooth RAW 8K, 6K and 4K video with ease. It is also backwards compatible with select XQD® cameras.
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For many years, TEAMGROUP has been developing high-quality products for industrial use and automation applications. In response to the growing market for 5G applications, the company this year is focusing on the new market demands of 5G infrastructure, AloT edge computing, and autonomous driving, as well as in-vehicle computing and environmental safety control applications. Today, TEAMGROUP is announcing its 745 SSD Series, which features the 5th generation BiCS NAND flash memory. It's a comprehensive industrial solution that comes with high capacities, low latencies, and high durability for the various application of industrial market.
The TEAMGROUP 745 SSD Series uses the new 112-layer 3D TLC and the latest 5th generation BiCS NAND flash memory, giving it approximately 40% more capacity and 50% better I/O performance than BiCS4 SSDs. This makes it fully suitable for the high-capacity, low-latency transmission requirements of edge computing. To meet the needs of a wide range of industrial applications, the 745 SSD Series is available in a variety of form factors with mainstream specifications, including models with SATA and PCIe Gen3x4 interfaces and capacities from 128GB to 2TB, offering the industry a variety of professional options. The 745 SSD Series is also equipped with SLC cache technology, which improves SSD read and write efficiency and supports high AI load for smart manufacturing and autonomous driving, while the AES 256-bit encryption prevents data security concerns and ensures safety and stability of the SSD.
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Transcend Information, Inc. (Transcend), a leading brand of digital storage and multimedia products, released a 1TB JetDrive Lite 330 expansion card which is exclusively designed for MacBook Pro 2021. Its tiny design and high capacity expands the storage space of the MacBook Pro in a snap, increasing users’ efficiency by backing up digital files.
The latest MacBook Pro models released in 2021 are equipped with an SD card slot, fulfilling the wishes of consumers out there. Transcend's JetDrive Lite 330 expansion card seamlessly integrates with the MacBook®, offering consumers another affordable option to expand their Mac internal storage capacity. Built with high-quality NAND flash, the JetDrive Lite 330 delivers impeccable R/W speeds of up to 95/75 MB/s. Multiple capacities from 128GB to 1TB are available for consumers to choose from based on their needs, ideal for Time Machine® backups and iTunes® libraries. More space can be saved from the internal drive to allow 3D rendering, graphic design, or software development.
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SMART Modular Technologies, Inc. (“SMART”), a division of SGH and a global leader in memory solutions, solid-state drives, and hybrid storage products, announces its new SMART Kestral™ PCIe Optane™ Memory Add-in-Card (AIC), which is able to add up to 2TB of Optane Memory expansion on a PCIe-Gen4-x16 or PCIe-Gen3-x16 interface independent of the motherboard CPU. SMART’s Kestral AICs accelerate selected algorithms by offloading software-defined storage functions from the host CPU to the Intel FPGA on the AIC.
SMART’s Kestral memory AICs are ideal for hyperscale, data center, and other similar environments that run large memory applications, and would benefit from memory acceleration or system acceleration through computational storage.
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ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces the ADATA SE880 external solid state drive (SSD). This latest external SSD from ADATA supports USB 3.2 Gen2 x2, is equipped with a Type-C port, and delivers read performance of up to 2000 MB/s. This is all packed into an ultra-compact form factor that is smaller than an AirPods case. These attributes make it perfect for content creators and console gamers on the go.
Speed Ahead with USB 3.2 Gen2 x2
The SE880 supports USB 3.2 Gen2 x2 and is capable of delivering transmission speeds of 20 Gb/s. This is two times faster than USB 3.2 Gen 2x1 and four times faster than USB 3.2 Gen 1x1. This allows the SE880 to achieve read/Write speeds of up to 2000MB/s, which is roughly twenty times faster than ordinary external hard drives. This incredible speed offers the ultimate convenience for creators, allowing them to access and edit large files directly on the SE880, doing away with the need to transfer files onto their PC beforehand. The SE880 comes in 500GB and 1TB variants.
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MSI is launching a new blazing fast model to its SSD product line – SPATIUM M480 PCIe 4.0 NVMe M.2 PLAY, exceeding all performance requirements for PlayStation 5 use. MSI SSDs enhances our company’s identity as a high-performance PC brand by expanding our ecosystem and covering the high-performance storage category. These SSDs are built with high-quality, high-density 3D NAND flash that delivers great performance with up to 7000MB/sec read. On SPATIUM M480 PLAY, the sleek dual finish aluminum heatsink is designed to fit the PlayStation 5. This improves heat-dissipation to sustain transfer speeds across all platforms for professionals, content creators, and gamers. Other performance-improving technologies include DRAM cache buffer and an SLC cache.
SPATIUM M480 PLAY – EXPANDING THE GAME LIBRARY ON PlayStation 5.
SPATIUM M480 PLAY is the optimal product made for console gaming in the SPATIUM lineup with four storage capacities – 500GB, 1TB, 2TB, and 4TB. This brings next-level storage performance to players for PlayStation 5, content creators, and PC gamers. Expanding the storage device on the PS5 is a simple upgrade that allows for lightning-fast save and load times for large game files.
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SMART Modular Technologies, Inc. (“SMART”), a division of SGH and a global leader in memory solutions, solid-state drive (SSD) and hybrid storage products announces the next generation of its DuraFlash™ ME2 family of SATA SSD products, which includes industry-standard M.2 2242, M.2 2280, mSATA, Slim SATA and 2.5” form factors. These SSDs are available in both industrial and commercial temperature grades and have versions that implement SMART’s SafeDATA™ power-loss, data-protection technology for graceful handling of power fluctuations and sudden power loss events.
The new ME2 SSDs incorporate the latest generation 3D NAND-technology and SMART Modular’s proprietary NVMSentry™ firmware to deliver high performance SSD products with endurance up to one drive writes per day (DWPD) for five years using JEDEC JESD219A enterprise endurance workload. The new NAND device offers better cost per bit over previous 64-layer and 96-layer NAND generations without sacrificing performance and reliability.
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Samsung Electronics and Western Digital today announced that they have signed a memorandum of understanding (MOU) for a unique collaboration to standardize and drive broad adoption of next-generation data placement, processing and fabrics (D2PF) storage technologies. The companies will initially focus on aligning their efforts and creating a vigorous ecosystem for Zoned Storage solutions. These steps will enable the industry to focus on countless applications that ultimately create greater value for customers.
This marks the first time that both Samsung and Western Digital have come together as technology leaders to create widespread alignment and stimulate awareness for important storage technologies. Focusing on enterprise and cloud applications, the partnership is expected to spur a range of collaborations around technology standardization and software development for D2PF technologies like Zoned Storage. With this collaboration, end-users can have confidence that these emerging storage technologies will have support from multiple device vendors as well as from vertically integrated hardware and software companies.
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KIOXIA America, Inc. today announced that it has started sampling new Automotive Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. The new lineup utilizes KIOXIA cutting-edge BiCS FLASH™ 3D flash memory and is available in capacities from 64 gigabytes (GB) to 512GB to support the various requirements of evolving automotive applications that elevate driver experiences.
The storage requirements for automotive applications continue to increase as infotainment systems and ADAS in cars become more sophisticated. UFS is well-suited to support the high-performance and density needs of these applications. The new devices support a wide temperature range (-40°C to +105°C), meet AEC-Q100 Grade2 requirements and offer enhanced reliability capabilities that increasingly complex automotive applications require.
The sequential read and write performance of the Automotive UFS Ver. 3.1 device is significantly improved by approximately 2.2x and 6x respectively, over previous generation devices. These performance gains contribute to faster system startup and OTA (Over-the-Air) updates.
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As industries compete to capitalize on the abundance of data generated by intelligent, connected devices, implementation of an intelligent data strategy has become even more critical. Edge computing has played an instrumental role to address this demand, but the edge itself has continued to evolve with the ever-growing need for even more demanding, real-time computing. Rugged edge computing enables applications that require real-time, low latency data processing and storage to function reliably in volatile environments that are not friendly to regular systems.
Trends and technologies such as Industry 4.0, AIoT, and 5G are driving the need for improved intelligence at the rugged edge. Businesses and organizations want more computing power at the edge because of the benefits it provides to their operations. NVM Express (NVMe) is an essential enabling technology for rugged edge computing, reducing latency and accelerating data processing to the point where connected devices can operate anywhere to perform machine learning, artificial intelligence, and inference computing. Real-time data access and analytics are turning rugged edge computing into a competitive necessity across all sectors and industries.
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