To meet the demand for high-speed storage driven by big data, TEAMGROUP is utilizing its years of experience in computer storage solutions to launch the newest PCIe Gen5 SSD this year. In light of the generational advancements of PCIe5.0, the company is actively committed to developing products using cutting-edge technologies. With its expertise in R&D and dedication to product excellence, the company is excited to enter the next era of SSD storage solutions and to deliver spectacular new products to the world.

teamgroup gen5 ssd

TEAMGROUP is releasing its first PCIe Gen5 SSD under its gaming sub-brand T-FORCE as part of the CARDEA series. It is capable of maximum sequential read speeds of over 13,000MB/s and write speeds exceeding 12,000MB/s, and together with a maximum storage capacity of 4TB, it will be the highest performance PCIe Gen5 flagship SSD on the market when launched. The T-FORCE PCIe Gen5 SSD will support the latest NVMe 2.0 and will be enhanced using proprietary technology to improve durability and product lifespan. The new hardware and support will enable its Gen5 SSDs to fully meet the needs of the gaming computing market, video streaming, augmented reality (AR), virtual reality (VR), and other next-gen digital domains.

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Transcend Information, Inc. (Transcend), a leading manufacturer of embedded memory products, recently released its industrial-grade 112-layer PCIe M.2 SSDs. Coming with a M.2 2280 form factor and up to 2TB capacity, this new series of SSDs is embedded with high-speed PCIe Gen4 x4 and PCIe Gen3 x4 interfaces. Leveraging advanced technologies and manufacturing process, Transcend enhances the drive performance and reliability, offering another durable storage solution for AI, 5G communication, enterprise servers, and IPC.

transcend 112 layer pcie ssds

112-layer 3D NAND: Leap to the next-gen performance
Thanks to the new generation of 3D NAND flash technology, memory cells can be vertically stacked to 112 layers, and the storage density per cell reaches 1Tb, a two-fold increase compared to 96-layer SSDs. 112-layer 3D NAND also delivers higher transfer speeds, 50% higher throughput than its predecessor. Transcend’s 112-layer 3D NAND SSDs offer an endurance rating of 3K P/E cycles, and are able to operate securely under an extended temperature range (-20°C~-75°C). All drives have undergone robust tests to ensure that optimal reliability can fully support heavy industrial workloads.

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With COVID-19 ravaging the world, healthcare capacities and health issues of countries worldwide are now a global focus, accelerating the development and progress of eHealth. In the next decade, smart health and healthcare will be a spotlight of the healthcare domain. In response to development trends, TEAMGROUP is launching industrial memory cards in line with the eHealth industry demands and is working with strategic partners from different fields to accelerate the digital transformation of healthcare systems.

teamgroup industrial memory cards

TEAMGROUP's Industrial Business Division aims to spotlight the needs of the eHealth industry by offering industrial memory cards that are low power consumption and has high write-in durability. These memory cards support recording data for 14 consecutive days, guaranteeing that all ECG records are written in and stored into the memory cards. TEAMGROUP’s Industrial memory cards is a great and innovative diagnostic tool for cardiologists, inject new blood into the field of eHealth.

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kioxia ufs qlcContinuing to lead the way forward for UFS technology, KIOXIA America, Inc. today announced the launch of its Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology. For applications needing high density, such as cutting-edge smartphones, KIOXIA QLC technology enables the capability to achieve the highest densities available in a single package.

The new 512 Gigabyte QLC UFS PoC (Proof of Concept) devices utilize the company’s 1 Terabit BiCS FLASH™ 3D flash memory with QLC technology, for potential larger Terabyte scale QLC UFS density offerings in the future. The new device is designed to meet the increasing performance and density requirements of mobile applications driven by higher resolution images, 5G networks, 4K plus video and the like.

“KIOXIA has been at the forefront of UFS memory since 2013 when we were the first to sample the technology1, and we continue to update our lineup of managed flash solutions that make an improved user experience a reality,” noted Scott Beekman, vice president, Memory Business Unit, for KIOXIA America, Inc. “QLC UFS is another compelling solution to add to this broad lineup.”

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PATRIOT, a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, is pleased to announce the PATRIOT P400 PCIe Gen4x4 NVMe m.2 SSD with capacities of 512GB and 1TB. The PATRIOT P400 was built using the latest PCIe Gen4x4 NVMe controller and best-in-class components to deliver faster data access, multi-application processing, and quick transfer speeds up to 5000MB/s in sequential. The PATRIOT P400 can offer double the transfer speeds compared to standard PCIe 3x4 solutions with lower power consumption making it the best solution for laptop battery efficiency. In addition, the exclusive thin graphene heatshield provides outstanding heat dissipation, especially in systems with limited space.

patriot p400 pcie gen4 ssd

"The PATRIOT P400 M.2 is designed to be an ideal solution for budget-minded users looking to achieve a cost-efficient storage solution with PCI Express gen4x4 performance. Our design team has created an excellent thermal solution using a slim graphene heatshield which can avoid any physical interference when using this drive-in system with limited space, such as a thin laptop.” Said Roger Shinmoto, the vice president of PATRIOT MEMORY.

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The all-new XPOWER XS70 PCIe 4.0 SSD from Silicon Power (SP) is about to take gaming to new highs with its thrilling performance and unique design that’ll give hardcore gamers the boost to take on opponents for hours on end.

silicon power xpower xs70 pcie ssd

The PCIe 4.0 That Crushes The Competition
With a standard data transfer rate that's 2x faster than the 3.0 version, the XS70 PCIe Gen 4x4 with 3D NAND flash memory and NVMe 1.4 support is exactly what serious gamers need to crush the competition. Mind-blowing continuous read and write speeds up to 7,300MB/s and 6,800MB/s, respectively, enable the XS70 to push the limits of what an SSD can do so you can break new records.

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Micron Technology, Inc., today announced it has begun volume shipments of the world's first 176-layer QLC NAND SSD. Built with the most advanced NAND architecture, Micron’s 176-layer QLC NAND delivers the industry’s leading storage density and optimized performance for a broad range of data-rich applications. Designed for use cases spanning client and data center environments, Micron’s transformative new NAND technology is now available with the introduction of the Micron 2400 SSD, the world’s first 176-layer PCIe Gen4 QLC SSD for client applications. The new 176-layer QLC NAND will also be incorporated into select Micron Crucial consumer SSDs, and available as a component for system designers.

Micron’s groundbreaking 176-layer QLC NAND provides a layer count and density unprecedented in QLC NAND flash and follows Micron’s delivery of the industry’s first 176-layer TLC NAND. Additionally, Micron’s 176-layer QLC NAND enables 33% higher I/O speed1 and 24% lower read latency2 than Micron’s prior generation solution. Its replacement-gate architecture is the only mass production QLC flash storage that combines charge trap with a CMOS-under-array design. These improvements are driving adoption of QLC SSDs in the client PC market, which is expected to triple QLC adoption by 2023, exceeding 35%, and reaching nearly 80% bit share in 2025.

"Micron’s 2400 SSD builds upon our 176-layer NAND industry leadership to drive the transition to QLC-based storage for the client market,” said Jeremy Werner, corporate vice president and general manager of Micron’s Storage Business Unit. “Furthering our market leadership, we expect the new 2400 PCIe Gen4 SSD will significantly accelerate the adoption of QLC in client devices as it enables broader design options and more affordable capacity."

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Phison Electronics Corp., a global leader in NAND flash controller integrated circuits and storage solutions, today announced that its SD Express storage solution is the first product to pass the SD Association’s SD Express/UHS-II Verification Program (SVP). This verification indicates that these products meet interface standards, providing confidence to both consumers and businesses that it will operate and perform properly.

According to the SD Association, “PCIe and UHS-II are both high differential interfaces and meeting their specifications demanding requirements is extremely important to assure proper operation and interoperability.” The Association officially launched the SVP program at the end of 2021, becoming the notary unit that leads the compatibility verification between the host system and the SD memory card manufacturer to positively assist in the development of the product ecosystem. As the world's leading supplier of SD card controllers and solutions, Phison Electronics has pledged to support the SD Association's SVP program and to work with Phison's global brand customers in launching the latest SD Express storage solutions that meet the SVP verification requirements.

As image quality of video continues to improve, user requirements for removable storage devices are increasing not only in capacity but also in transmission speeds required of the interfaces. The speed of SD cards indicated by the SD Logo are generally affirmed with the guarantee of the "minimum writing speed," largely because the general host system does not have high requirements for the read speed of removable storage devices. It only needs to roughly pre-read and confirm the correctness of the photo or video file data with more sophisticated edits or modifications moved to the PC for execution.

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Leading global memory brand TEAMGROUP today announced the worldwide release of the T-FORCE DELTA TUF Gaming Alliance RGB DDR5 DESKTOP MEMORY and T-FORCE CARDEA Z440 TUF Gaming Alliance PCIe 4.0 M.2 SSD at the end of this month. The first batch will be available on the North American Amazon store. Created in collaboration with ASUS TUF Gaming Alliance, the two products combine military gaming style and top-notch performance. The addition of the co-branded series to the hardcore gaming alliance means higher quality products and more pleasing, cohesive setups for the gaming enthusiast market.

teamgroup T FORCE DELTA TUF Gaming Alliance RGB DDR5 desktop Memory

The T-FORCE DELTA TUF Gaming Alliance RGB DDR5 DESKTOP MEMORY is the first ASUS TUF Gaming Alliance certified and rigorously tested DDR5 RGB gaming overclocking memory. The design merges stealth fighter-inspired aesthetics with TUF Gaming Alliance's unique gaming elements to create a distinctive look that features an ultra-wide 120° angle heat spreader and striking RGB lighting. It supports ASUS Aura Sync lighting control software, allowing gamers to adjust its RGB effects however they like to create custom and eye-catching gaming rigs. The product's first release will have speeds of 5,200MHz and come in a 2X16GB dual-channel kit.

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This week at CES 2022, KIOXIA America, Inc. will demonstrate its innovative flash memory technology and spotlight several different applications for attendees, including its new BG5 Series of solid state drives (SSDs).

kioxia ces 2022

Designed to bring a suitable balance of performance, cost and power to everyday gamers and PC users, the KIOXIA BG5 Series is built with a PCIe interface (16GT/s x4 lanes) and accelerated by the company’s fifth-generation BiCS FLASH™ 3D flash memory technology. These attributes make BG5 drives suitable for thin, light and performance-oriented systems such as ultra-thin PCs, IoT embedded devices and server boot in data centers.

KIOXIA will also showcase its latest flash memory solutions, including advances to BiCS FLASH, the company’s cutting-edge 3D flash memory technology, and the most recent generation of its automotive UFS devices.

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