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Micron Technology, Inc., today announced that it has begun volume production of the world’s first 232-layer NAND, built with industry-leading innovations to drive unprecedented performance for storage solutions. It features the industry’s highest areal density and delivers higher capacity and improved energy efficiency over previous generations of Micron NAND, to enable best-in-class support of the most data-intensive use cases from client to cloud.
“Micron’s 232-layer NAND is a watershed moment for storage innovation as first proof of the capability to scale 3D NAND to more than 200 layers in production,” said Scott DeBoer, executive vice president of technology and products at Micron. “This groundbreaking technology required extensive innovation, including advanced process capabilities to create high aspect ratio structures, novel materials advancements and leading-edge design enhancements that build on our market-leading 176-layer NAND technology.”
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In another move that delivers next-generation levels of performance to enterprise data centers, Kioxia Corporation today announced that its KIOXIA CM7 series enterprise NVMe™ SSDs are now shipping to select customers. Optimized for the needs of high-performance, highly efficient servers and storage, the KIOXIA CM7 series family is designed with PCIe 5.0 technology in Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S and 2.5-inch form factors.
Having introduced the industry’s first EDSFF drives designed with PCIe 5.0 technology last year, the addition of the KIOXIA CM7 series family expands KIOXIA’s leadership position and allows OEM customers to deliver best-in-class sequential read 14 GB/s performance to end users.
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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully developed a second generation of its pioneering SmartSSD.
The new proprietary computational storage incorporates data processing functionality within a high-performance SSD. Unlike existing SSDs, Samsung’s SmartSSD can process data directly, thereby minimizing data transfers between the CPU, GPU and RAM. This technology can avoid the bottlenecks that often occur when moving data between storage devices and CPUs, resulting in markedly improved system performance and much higher energy efficiency.
The SmartSSD is playing an increasingly important role, especially with the growth of next-generation technologies such as AI, machine learning and 5G/6G, which require large amounts of data processing.
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In recent years, consumer storage products have seen rapid developments. This year, the industry will officially be entering the first year of Gen5 SSDs. In response to risen temperatures caused by the high transfer speeds of PCIe Gen 5 SSDs, T-FORCE, the gaming sub-brand of TEAMGROUP, has launched the world's first all-in-one ARGB liquid cooling system to reduce heat generated by both the CPU and SSD, allowing PCIe Gen5 SSDs to maintain optimal temperatures and stable, high-speed operations for sustained periods. With the new cooling solution, consumers can fully experience the efficient storage performance of next-generation SSDs without any compromises.
Beginning in the 2000s, as the consumer market demanded higher read and write speeds for storage devices, solid-state drives (SSDs) began to replace mechanical hard drives (HDDs) in large numbers. SATA SSDs eventually became the go-to choice for storage upgrades. With the demand for high-speed storage driven by big data and the spread of transmission technology, PCIe became the standard interface for high-speed transmission. In the past few years, read speeds of PCIe SSDs have increased from 3,500MB/s in Gen3 to 7,000MB/s in Gen4. PCIe Gen5 SSDs now have over 12,000MB/s read and write speeds. The large leaps in transfer speeds of each successive generation of SSDs have led to increased power wattage, which in turn have resulted in higher operating temperatures. When SSDs experience rising operating temperatures at high transfer speeds, an automatic throttling mechanism is activated to protect components from damage caused by the high temperatures. With power consumption of approximately 12W on a PCIe Gen4 SSD running at 7,000MB/s, the controller temperature can reach over 110℃. When PCIe Gen5 SSDs have speeds of over 12,000MB/s and consume 14W or above, one can expect controller temperatures to rise sharply. Therefore, TEAMGROUP is committed to providing the best thermal solutions for stable, high-speed operation of SSDs over sustained periods.
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Kanguru announces a new FIPS 140-2 Certified External Solid-State Drive with enhanced security. The new Defender SSD350 hardware encrypted solid state drive series provides organizations with data protection at its best.
The TAA Compliant, Defender SSD350 family of solid-state drives is ideal for high-security environments, including government, defense, healthcare, financial institutions, energy/utilities and other security-conscious organizations that rely on benchmark FIPS 140-2 Certification and military-grade, hardware encryption to meet strict security demands. Designed and built under the independent and rigorous testing verification process conducted by the National Institute of Standards for Technology (NIST), the Defender SSD350 provides organizations with exceptional data security and value.
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Western Digital Corp. and Sony Interactive Entertainment LLC ("SIE") teamed up to deliver the industry's first official PlayStation-licensed M.2 SSD for PlayStation 5 (PS5) to gamers across the globe. The WD_BLACK SN850 NVMe SSD for PS5 Consoles enables players to expand the high-speed storage capacity of their PS5 console and gives them peace of mind knowing that their new and favorite titles are stored on a drive that's been battletested to take on the most intensive PS5 gameplay.
Optimized for the newest-generation console, Western Digital validated drive performance through multiple scenarios to ensure the drive has been fully tested for the PS5. This process included hundreds of hours spent rigorously testing some of the most graphic-rich titles across various genres to ensure that with games stored on the drive, gameplay is fast, smooth and visually immersive.
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Kingston Digital, Inc., the flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announces the addition of the DataTraveler Max Type-A. It joins DataTraveler Max, the USB Type-C model, to complete the Kingston DT Max series of next-gen, high performance USB flash drives. Both drives leverage the latest USB 3.2 Gen 2 standard.
The DataTraveler Max (DT Max) series delivers record-breaking speeds up to 1,000MB/s read and 900MB/s write to make them some of the fastest USB drives on the market and the first of its kind. DT Max is designed with portability and convenience in mind. DT Max Type-A features a merlot and black design with Type-A connector, while the original DT Max features an all-black design with Type-C connector to differentiate the drives at first glance. The unique ridged casing protects the connector when it is not in use and is easy to move in a single motion. Seamlessly transfer and store large digital files such as HD photos, 4K/8K videos, music and more with top speeds and high capacities up to 1TB3. The addition of a keyring loop and LED status indicator makes the drive ideal for users who need storage on-the-go.
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Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced the release of IronKey™ Locker+ 50 (LP50) USB Flash drive that provides consumer-grade security with AES hardware-encryption in XTS mode to safeguard against BadUSB with digitally-signed firmware and Brute Force password attacks.
Kingston IronKey Locker+ 50 offers multi-password, Admin and User, option with Complex or Passphrase modes. Complex mode allows for passwords from 6-16 characters using 3 out of 4 character sets, while new passphrase mode allows for a numeric PIN, sentence, or even a list of words from 10 to 64 characters long; along with support for international characters. To reduce failed login attempts during password entry, the “eye” symbol can be enabled to reveal what has been typed. But should a User password be forgotten; the Admin password can be used to access the data on the drive or reset the User password.
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ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products today announces the industrial-grade ADATA 31C series 112-layer 3D NAND (BiCS5) solid state drives (SSD) utilizing the SATA III interface. They include the ISSS31C 2.5-inch, IM2S31C8 M.2 2280, and IM2S31C4 M.2 2242 SSDs. All three SSDs are designed to be energy efficient, feature high capacities, and are well suited for high-load industrial systems relating to industrial computing, embedded devices, automation, networking, transportation, and other fields.
The industrial-grade ISSS31C 2.5-inch, IM2S31C8 M.2 2280, and IM2S31C4 M.2 2242 SSDs are all equipped with 112-layer 3D TLC (BiCS5) flash memory developed by WDC and KIOXIA and come with a maximum capacity of 2TB. They have undergone rigorous temperature verification and testing to ensure they can operate optimally in a wide range of temperatures (from -40 °C to 85 °C) to ensure excellent quality, reliability, and durability.
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Transcend Information, Inc. (Transcend), a leading brand of digital storage and multimedia products, recently announced a new high-speed portable SSD, ESD380C, that comes with a USB 3.2 Gen 2x2 interface, a performance speed of 2,000 MB/s, and up to 2TB of ample storage space, all in an anti-shock, compact design. This strikingly fast, durable, and secured portable SSD brings the performance of creative professionals and gamers to the next level.
The ESD380C features a USB 3.2 Gen 2x2 interface and a Type-C port, bringing the speed up to 2,000 MB/s. The high performance and low latency are capable of saving 4K videos, high-resolution images, and large media files. The ESD380C is housed in an aluminum enclosure, which is durable to protect data stored on the drive and enhances heat dissipation. The Dynamic Thermal Throttling mechanism allows a more stable performance even under demanding operations.
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