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sTec, Inc., a leading global provider of solid-state storage solutions, today introduced the sTec s260 mSATA solid-state drives (SSDs), whose reliability, small footprint and low power draw make them ideal for embedded storage in rugged, space-conscious environments. The SSDs, which feature a 6Gbps Serial ATA (SATA) interface, are designed to tackle a range of embedded-storage applications, including operating-system booting, data logging, code-storage/application hosting, caching, and fast data backup.
The s260 drives, which comply with the JEDEC-defined MO-300A and MO-300B (mSATA mini) standards, draw just 1.5W, a fraction of the power required by rotating-disk storage. Additionally, they deliver industry-leading reliability through sTec’s patented PowerSafe™ technology and support industrial temperatures, ranging from -40° to 85° C. These features combine to meet the demands of embedded designs in remote and/or space-constrained systems where access is limited, airflow is restricted and heat exacts both performance and durability penalties.
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With the popularity of mobile intelligent devices, business opportunities of relevant applied product peripherals on the market increase steadily. Aiming at consumers’ demands on mobile storage solutions, along with its competitive edge on storage device technology, Apacer launches the AM701 card-reader with OTG (On-The-Go) function that applies to smart phones and tablet PCs supporting OTG. It has not only a delicate and compact body, but also colorful options of blue, green and pink. Featuring both function and style, it enriches the personal mobile smart life inside and out.
“The built-in storage capacity limitation of mobile devices has always been a priority concern for consumers. Apacer’s AM701 card-reader supports read/write of memory cards such as microSD, microSDHC, microSDXC. Upon connection to smart phones or tablet PCs, the storage capacity of such personal mobile devices is enlarged. In addition, it supports the data back-up of smart phones and tablet PCs along with the convenient plug-in-and-play. Thus, data transmission or sharing can be accomplished whenever and wherever possible, without computers or complicated setting steps, which significantly enhance the convenience and availability of intelligent devices.” said Chang, Chia-Kun, Assistant General Manager of Apacer’s Digital Storage Application Unit.
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Silicon Power, the world’s leading provider of memory storage solutions announces its participation in the Intel Developer Forum (IDF) 2013 in San Francisco, USA, at Moscone Center West (Thunderbolt Booth No.186) from September 10th to 12th, 2013.
Silicon Power (SP) has proven great achievements in product design, and also positively expanded its business in worldwide storage markets. With the technical guidance from Intel, SP has now developed various innovative Thunderbolt storage products, including Thunder T11, Thunder T20, Thunder T30 and Thunder T50, and will showcase these products at IDF this year. Under the eye-catching designs, Silicon Power always surprises users with its creativities in digital storage devices, and provides unique image with wide variety of products, as well as competitive quality that bring out the true SP brand spirit – Memory is Personal.
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Apacer, the pioneer in the global memory module industry, introduces the business class AH353 “Golden Wing” USB 3.0 flash drive featuring cost-effectiveness. The AH353 features a sleek and clean design with steady style and satisfies the needs of high-capacity with low profile. It is the best solution for business professionals and mobile users. The AH330 USB 2.0 flash drive will be launched simultaneously, available in three meticulously designed colors: sun struck orange, ocean blue and grape purple that offer a vogue and fascinating digital life.
The Apacer AH353 “Golden Wing” USB 3.0 flash drive is the most compact masterpiece among the same level products and boasts two advantages, compactness and super speed, making the AH353 the prime choice for portable storage products. The read speed is up to 80MB/s, over 10 times faster than that of the USB 2.0 predecessors, which will shorten the file transmission time, and provides the high mobility user experience of USB 3.0.
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OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, will showcase its latest solid state drive storage products at the 2013 Intel Developer Forum (IDF), September 10th through September 12th at Moscone Center, San Francisco. This event is an excellent opportunity for OCZ to connect with customers and partners using the latest Intel® technology by demonstrating its complete portfolio of SSD solutions tailored for big data, cloud computing, and other enterprise applications.
Offering solutions for applications including virtualization, database, and cloud management, OCZ will display a comprehensive lineup of innovative products designed to solve performance, availability, and reliability roadblocks in IT infrastructures. OCZ will unveil the upcoming smaller form factor Z-Drive R4 PCIe SSD, featuring the same exceptional performance but with the ability to be deployed in a much greater range of platforms, including support for the Open Compute Project (OCP). The OCP Foundation is a growing community of engineers around the world whose mission is to design and enable the delivery of the most efficient server, storage, and data center hardware designs for scalable computing, and provides a structure in which individuals and organizations can share their intellectual property.
