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Toshiba’s Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today announced the Toshiba Micro Secure Digital (micro SD) class 10 UHS-I Memory cards and Toshiba TransMemory USB 3.0 Flash Drive.
“Toshiba originally invented and have since perfected NAND flash memory technology, which both of these products utilize,” said Maciek Brzeski, vice president of product marketing and development of branded storage products, Toshiba America Information Systems, Inc., Digital Products Division. “Both of these removable storage solutions offer industry-proven quality and reliability with leading speeds, performance and capacities.”
Toshiba TransMemory USB 3.0 Flash Drives
For consumers who need to drag and drop files quickly and safely between computing devices, Toshiba’s TransMemory USB 3.0 Flash Drives are an efficient ultraportable storage solution that offers high-speed data transfer and secure data protection.
This new line of flash drives provides consumers with a reliable and convenient way to store and transfer photos, videos, music and important digital files while on the go, as they work with any device equipped with USB port. These flash drives not only make it easy to transfer files, but more importantly, they protect consumers’ data against theft and loss. The downloadable password protection security software that comes included with the drives allows users to create public and private partitions to ensure that their critical data is always protected.
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Silicon Power, the world’s leading provider of memory storage solutions launches the brand new designed stainless steel USB flash drive – Touch T03. Along with the trendy Northern Europe style and exquisite metal casing, Touch T03 is designed to be the perfect combination of technology, fashion and extraordinary living style. Featuring the eye-catching look and delicate faceted-body, Touch T03 is more than an ordinary storage device but a great fashion accessory for users to show their charm and taste.
SP Touch T03 stands out with its stunning appearance which delivers great sense of luxury and elegance. Furthermore, Touch T03 is extremely tiny and featherweight that allows an easy and convenient way for carrying and storage. With the application of COB (Chip on Board) technology, Touch T03 ensures great durability and offers high protection for the drive body, promising complete resistance to water, dust and vibration. Moreover, Touch T03 shines with the sleek stainless steel casing with stylish groove design at the end of the body, which can be easily attached to the key rings, purses or bags.
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Micron Technology, Inc., announced today that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples. HMC represents a dramatic step forward in memory technology, and these engineering samples are the world's first HMC devices to be shared broadly with lead customers. HMC is designed for applications requiring high-bandwidth access to memory, including data packet processing, data packet buffering or storage, and computing applications such as processor accelerators. Micron expects future generations of HMC to migrate to consumer applications within three to five years.
An industry breakthrough, HMC uses advanced through-silicon vias (TSVs)—vertical conduits that electrically connect a stack of individual chips—to combine high-performance logic with Micron's state-of-the-art DRAM. Micron's HMC features a 2GB memory cube that is composed of a stack of four 4Gb DRAM die. The solution provides an unprecedented 160 GB/s of memory bandwidth while using up to 70 percent less energy per bit than existing technologies, which dramatically lowers customers' total cost of ownership (TCO).
"The Hybrid Memory Cube is a smart fix that breaks with the industry's past approaches and opens up new possibilities," said Jim Handy, a memory analyst at Objective Analysis. "Although DRAM internal bandwidth has been increasing exponentially, along with logic's thirst for data, current options offer limited processor-to-memory bandwidth and consume significant power. HMC is an exciting alternative."
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V7, a global provider of premier computer accessories worldwide and a division of Ingram Micro Inc., today introduced its V7 Elite 2.5-inch Solid State Drives (SSDs), offering exceptional performance and a thin profile to meet the demands for fast, dependable, compact storage for Ultrabooks, laptops, desktop PCs and servers.
V7 Elite 2.5-inch SSDs are ideal for users of desktop and laptop PCs, and administrators of mass storage servers who desire to boost system responsiveness above and beyond current capacities. Offering many compelling advantages over traditional hard disk drives, solid state drives have rapidly grown in popularity in both the consumer and enterprise information technology sectors. V7 Elite 2.5-inch SSDs capitalize on these technology benefits and offer significant features and functionality to support performance gains for any computing application.
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OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced the latest addition to the popular Deneva 2 Series which now utilizes 19 nanometer (nm) NAND flash. The new models are 2.5-inch, 6Gbps SATA III-based Multi-Level Cell (MLC) drives that implement the Deneva 2 SSD Series feature-set and are built around a smaller NAND flash process geometry. This cutting-edge drive solution also features a completely new power architecture that was designed from the ground up to optimize server back plane functionality, providing enhanced management of in-rush current and power fluctuation. The result is an advanced SSD series that delivers superior storage performance, enterprise-class endurance, reliability and quality, and excellent total cost of ownership for customers.
"Our Deneva 2 has been a popular SSD series among IT professionals not only as an HDD replacement but to dramatically accelerate I/O access of such popular enterprise applications as OnLine Transaction Processing, database warehousing, read intensive data caching and server boot-ups," said Daryl Lang, SVP of Product Management for OCZ Technology. "By implementing new features and the latest NAND flash process geometry we are able to deliver an optimal balance of I/O performance and cost-efficiency to our customers."
