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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is adding three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its industry-leading portfolio of advanced enterprise and data center SSDs. The drives are available now.
“We are providing high-end capabilities and capacities for all of our latest SSDs, something we believe will elicit a high degree of interest from OEMs and computer enthusiasts throughout the world,” said Jim Elliott, corporate vice president, Samsung Semiconductor, Inc. “We understand the performance needs of our customers in a rapidly expanding SSD universe and are determined to meet those needs.”
Designed for OEMs, Samsung’s new SSDs – the PM1633, PM1725 and PM953 all utilize Samsung’s 3-bit MLC (multi-level-cell) V-NAND flash memory, while providing outstanding performance and reliability, as well as high capacities.
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Kingston Digital Europe Co LLP, an affiliate of Kingston Technology Company Inc., the independent world leader in memory products, today announced the addition of a 512GB capacity to its line of Class 10 UHS-I SDHC/SDXC cards. The higher capacity card is ideal for DSLR cameras and HD camcorders as it allows users to record more video and shoot more high-density image files without running out of space.
In addition to storing thousands of photos and hours of video , the card provides speeds of 90MB/s read and 45MB/s write. These high speeds support photography in continuous and burst modes, and reduces stutter to ensure video integrity. Class 10 UHS-I SDHC/SDXC cards also allow users to shoot full 1080p HD video and 3D video as well as transfer files faster. In addition to the new 512GB capacity, this card is also available in 16GB, 32GB, 64GB, 128GB and 256GB.
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Team Group Inc. is continuously dedicated in satisfying our customers’ needs in every respect. Today we announce the release of the elegant and thin Team C153/C155 premium flash drive. The body of the product is built with aluminum unibody case. The surface is abrasive blasted with features like anti-fingerprint and anti-corrosion anodization. It is an example of achieving aesthetic perfection through beautiful craftsmanship.
The exterior design of the C153/C155 is based on golden ratio to provide a chiseled shape. We also reduced the thickness to 7.1mm. The thinnest part at the outer edge is only 2.95mm thick which creates a thin but stereoscopic feel when consumers holding it in hand. In addition, the unique stereoscopic linear design on the product and trendy colors like the premium gold create an urban trend style that goes with today’s modern technology. The strap hole design can go with a strap to perfectly match with consumer’s personal belongings. It helps with avoiding the problem of losing the device, and it can also become a unique stylish accessory. It is a both elegant and efficient device that you must have.
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Toshiba Corporation’s Semiconductor & Storage Products Company today announced three distinct families of PCIe (Peripheral Component Interconnect Express) solid state drive (SSD) products using NVMe (Non-Volatile Memory Express) protocol, targeted for various applications including high performance notebooks; thin notebooks, 2-in-1/convertible notebooks and tablets; and server and storage applications. All three SSD product lines are optimized for high performance and low latency and utilize the PCIe interface, which provides point-to-point links with the processor, reducing system bottlenecks. Each SSD family is designed for its target segment with capacity, optimized form factor, and security capabilities. Samples of the Toshiba’s newest lines of NVMe, PCIe SSDs will be available from the fourth quarter (Oct. to Dec.) of 2015.
High Performance Notebooks: The XG3 family of SSDs is the industry’s highest capacity (1024GB) client NVMe SSD available in M.2 Type 2280 form factor and optimally designed for high performance notebooks, 2-in-1 PCs and all-in-one PCs. The XG3 in M.2 Type 2280 form factor supports up to four lanes of PCIe 3.1, which has a maximum interface bandwidth more than six times that of SATA 6Gbits/s. XG3 is also the industry’s first NVMe SSD available in 2.5-inch SATA express form factor. The XG3 SSD family is equipped with Toshiba’s proprietary QSBCTM (Quadruple Swing-By Code) error-correction technology, a highly efficient error correction code (ECC), which helps protect customer data from corruption, improves reliability, and extends the life of Toshiba SSDs. Engineered for power efficiency, the XG3 series also features lower power state modes and is the first Toshiba product, along with the BG1 SSD family, to support the Trusted Computing Group specification, Pyrite (TCG Pyrite).
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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid state drives (SSDs).
“With the introduction of our 3rd generation V-NAND flash memory to the global market, we can now provide the best advanced memory solutions, with even higher efficiency based on improved performance, power utilization and manufacturing productivity, thereby accelerating growth of the high-performance and the high-density SSD markets,” said Young-Hyun Jun, President of the Memory Business at Samsung Electronics. “By making full use of Samsung V-NAND’s excellent features, we will expand our premium-level business in the enterprise and data center market segments, as well as in the consumer market, while continuing to strengthen our strategic SSD focus.”
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