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Toshiba Corporation’s Semiconductor & Storage Products Company today announced three distinct families of PCIe (Peripheral Component Interconnect Express) solid state drive (SSD) products using NVMe (Non-Volatile Memory Express) protocol, targeted for various applications including high performance notebooks; thin notebooks, 2-in-1/convertible notebooks and tablets; and server and storage applications. All three SSD product lines are optimized for high performance and low latency and utilize the PCIe interface, which provides point-to-point links with the processor, reducing system bottlenecks. Each SSD family is designed for its target segment with capacity, optimized form factor, and security capabilities. Samples of the Toshiba’s newest lines of NVMe, PCIe SSDs will be available from the fourth quarter (Oct. to Dec.) of 2015.
High Performance Notebooks: The XG3 family of SSDs is the industry’s highest capacity (1024GB) client NVMe SSD available in M.2 Type 2280 form factor and optimally designed for high performance notebooks, 2-in-1 PCs and all-in-one PCs. The XG3 in M.2 Type 2280 form factor supports up to four lanes of PCIe 3.1, which has a maximum interface bandwidth more than six times that of SATA 6Gbits/s. XG3 is also the industry’s first NVMe SSD available in 2.5-inch SATA express form factor. The XG3 SSD family is equipped with Toshiba’s proprietary QSBCTM (Quadruple Swing-By Code) error-correction technology, a highly efficient error correction code (ECC), which helps protect customer data from corruption, improves reliability, and extends the life of Toshiba SSDs. Engineered for power efficiency, the XG3 series also features lower power state modes and is the first Toshiba product, along with the BG1 SSD family, to support the Trusted Computing Group specification, Pyrite (TCG Pyrite).
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Team Group Inc. is continuously dedicated in satisfying our customers’ needs in every respect. Today we announce the release of the elegant and thin Team C153/C155 premium flash drive. The body of the product is built with aluminum unibody case. The surface is abrasive blasted with features like anti-fingerprint and anti-corrosion anodization. It is an example of achieving aesthetic perfection through beautiful craftsmanship.
The exterior design of the C153/C155 is based on golden ratio to provide a chiseled shape. We also reduced the thickness to 7.1mm. The thinnest part at the outer edge is only 2.95mm thick which creates a thin but stereoscopic feel when consumers holding it in hand. In addition, the unique stereoscopic linear design on the product and trendy colors like the premium gold create an urban trend style that goes with today’s modern technology. The strap hole design can go with a strap to perfectly match with consumer’s personal belongings. It helps with avoiding the problem of losing the device, and it can also become a unique stylish accessory. It is a both elegant and efficient device that you must have.
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Silicon Power, the world’s leading provider of memory storage solutions, today announces the launch of its first dual USB drive – Mobile C80 with a USB Type-C connector and a standard USB Type-A connector. Type-C is the next-generation interface that will simplify all formats into one universal interface that will deliver both data and power between devices. Mobile C80 can absolutely fulfill the needs of storage space for Type-C ready smartphones, tablets, and notebooks. Type-C standard enables not only slim designs but also reversible connector which allows users to insert it into their device's port no matter which way up it is. Moreover, Mobile C80 has a USB 3.0 connector to truly bridge various computing devices and makes your digital life easier.
Type-C Interface Rules the Next Generation
The announcements of new Apple MacBook and Chromebook Pixel in March this year have brought attention to USB Type-C interface, and it is gaining rapid support from top-tier PC and consumer electronics manufacturers. However, many users may suffer from relatively few and specific expansion slots of new-generation mobile devices, and it is costly for additional storage space. Mobile C80 delivers up to 64GB of instant capacity for you to transfer and store content. Without constraints of internet signals and different kinds of cables and adapters, C80 promises easier, faster and more stable data transmission. Inheriting from Jewel J80/ Firma F80, Mobile C80 retains the ergonomic circular shape for easy grasp and perfect keychain accessory, but adds a sturdy 360° swivel cap to protect the connector from harm when it is not in use. Moreover, the zinc alloy casing of C80 features sandblasting treatment that enables delicate touch and provides superior resistance to scratches and fingerprints.
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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid state drives (SSDs).
“With the introduction of our 3rd generation V-NAND flash memory to the global market, we can now provide the best advanced memory solutions, with even higher efficiency based on improved performance, power utilization and manufacturing productivity, thereby accelerating growth of the high-performance and the high-density SSD markets,” said Young-Hyun Jun, President of the Memory Business at Samsung Electronics. “By making full use of Samsung V-NAND’s excellent features, we will expand our premium-level business in the enterprise and data center market segments, as well as in the consumer market, while continuing to strengthen our strategic SSD focus.”
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Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced it will be presenting at the upcoming Flash Memory Summit in Santa Clara, CA from August 11th to 13th and will be showcasing an array of SSD solutions at booth #313, including the award winning SM2246EN SATA 6Gb/s SSD solutions, the new products using SM2256, the world's first turnkey SSD controller supporting TLC NAND and the new SM2260 PCIe 3.0 SSD controller.
Products showcasing at Silicon Motion's Flash Memory Summit booth include:
PCIe 3.0 NVMe 1.2 SSD Controller- SM2260
The SM2260 is the first turnkey merchant PCI Express (PCIe) 3.0 Non-Volatile Memory Express (NVMe) 1.2 solid-state drive (SSD) controller solution supporting MLC, TLC and 3D NAND. The SM2260 delivers PCIe-level performance with low power consumption and features four 8 gigabit-per-second (Gbps) lanes (PCIe Gen 3.0 x4) of simultaneous data flow coupled with eight NAND channels. It is designed with fourth-generation NANDXtend technology, enabling the SM2260 to support 1y/1z nm TLC NAND as well as the upcoming 3D NAND technologies from all major NAND suppliers. The SM2260 solution optimizes hardware and software to take full advantage of the NVMe 1.2 SSD standard, offering high performance and reliability while delivering more cost-effective PCIe SSDs for computing systems, ultra-portables and tablets.
