Toshiba Corporation’s Semiconductor & Storage Products Company announced it will showcase a reference display of the world’s first PCI Express (PCIe) single package SSD, integrating up to 256 GB in a single BGA package, at the 2015 International Consumer Electronics Show (CES), to be held from January 6 to January 9 in Las Vegas, U.S.A.
The “BG Series” SSDs on reference display will be products under development. Utilizing Toshiba’s cutting-edge packaging technology applied in products like e・MMCTM, it is the world’s first PCI Express single package SSD, available in capacities up to 256 GB in a 16 mm x 20 mm x 1.65 mm BGA package. Also to be showcased will be a reference display of the world’s smallest removable module type SSD, which integrates the BGA single package SSD on a single-sided form factor.
The new SSDs incorporate PCI Express, a high speed serial I/O interface for PCs, as physical interface and NVM Express optimized for SSDs as command interface.
The single package type SSDs of the new series weigh below 1 g, reducing weight by approximately 98%, compared to 2.5-inch types widely used in PCs. It also reduces storage space by more than 95%. It can contribute to light-weight mobile PCs and also to longer battery life by increasing available space for battery packs.
