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Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun volume production of 64-layer, 256Gb V-NAND flash memory for use with an expanding line-up of storage solutions for server, PC and mobile applications.
Since Samsung began producing the industry’s first SSD based on 64-layer 256Gb V-NAND chips in January for key IT customers, it has been working on a wide range of new V-NAND-based mobile and consumer storage solutions. These include embedded UFS memory, branded SSDs and external memory cards, which the company plans to introduce later this year.
To solidify its competitive edge in the memory market, Samsung intends for its volume production of the 64-layer V-NAND chip, which is widely referred to as 4th generation V-NAND, to cover more than 50 percent of its monthly NAND flash production by year end.
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Mushkin Enhanced MFG, an industry-leading designer and manufacturer of high-performance and mission-critical computer products, today unveiled their new and improved mushkin.com website, and announced availability of their new REACTOR ARMOR3D and TRIACTOR 3D SSD Lines.
Featuring Silicon Motion's SM2258 controller the REACTOR ARMOR3D and TRIACTOR 3D are ideal tools for gamers, professionals, and consumers in need of high capacity storage solutions. Providing a complete set of fully loaded features with industry leading capabilities and Mushkin Enhance technologies, including:
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ADATA Technology, a leading manufacturer of high performance DRAM modules, NAND Flash products, and mobile accessories today launched the UC360 and UC370 USB OTG Flash drives. As “on the go” protocol (OTG) USB drives, both models ensure quick, driverless connectivity with virtually any device that features USB. Both are 2-in-1 products, with the UC360 featuring USB-A and Micro USB and the UC370 combining USB-A and USB-C. Data delivery uses USB 3.1 speeds, and both drives are designed for durability and convenience across Windows, Mac OS, Android, and a host of other platforms such as game consoles and smart TVs. Consumers can choose from 16GB, 32GB, and 64GB versions of the new drives.
UC360: compact all-purpose storage
The UC360 manages to fit USB-A and Micro USB connectors on its ultra-compact chassis. It has a convenient strap mount so users can attach it to key chains, bags, belts and other items to prevent loss and make mobility easier. Weighing just 3.8g, the UC360 redefines superlight universal connectivity at up to 5Gbps.
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PLEXTOR, a leading manufacturer of award-winning solid state drives (SSDs) and other high-performance digital storage devices for consumers, unveils its new M8Se NVME SSD series, today. The global launch event being held at the Taipei International Convention Center (TICC) features a live gaming competition participated in by global internet celebrities. The event also highlights the power and performance of PLEXTOR SSD technologies in the PC gaming arena.
Unlike typical press conferences, PLEXTOR opts to live-stream the product launch, gathering gamers from around the world, broadcasting via social media and online platforms and aiming to reach over two million online viewers globally.
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Western Digital Corporation (“Western Digital”), a global data storage technology and solutions leader, today announced the world’s first client solid state drives built with its 64-layer 3D NAND technology. This technology milestone enables the company to deliver new, innovative SSDs with lower power consumption and higher performance, endurance and capacities. This is the latest achievement in a nearly three-decades-long legacy of flash memory industry firsts from the company.
“Delivering 64-layer 3D NAND-based SSDs into the PC segment marks a critical step in our ongoing conversion to this new technology, as well as offers long-term benefits for our customers,” said MIke Cordano, president and chief operating officer, Western Digital. “Between our two, strong brands in SanDisk and WD, and their respective loyal customer bases and distribution channels, these advanced SSDs will appeal to a very broad footprint of the computing population that are seeking the benefits of today’s newest technologies.”
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Toshiba Memory Corporation (hereinafter Toshiba) today launched the XG5 series, a new line of NVM Express (NVMe) SSDs integrating 64-layer, 3D flash memories, with a maximum capacity of 1024GB in a thin single-sided form factor. Sample shipments to OEM customers start today in limited quantities, and Toshiba will gradually increase shipments from the third calendar quarter of this year.
The new SSDs, equipped with Toshiba’s latest 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH, utilize the features of PCI EXPRESS® (PCIe®) Gen3 x 4 lanes and SLC cache to deliver 3000 MB/s sequential read and 2100 MB/s sequential write. They are also more efficient than Toshiba existing products and reduce standby mode power consumption by over 50%, to less than 3mW.
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Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., the independent world leader in memory products, today announced KC1000 NVMe PCIe SSD. Shipping in mid-June, the M.2 NVMe PCIe SSD is over 2x faster than SATA-based SSDs and over 40x faster than a 7200RPM hard-disk drive. KC1000 is built for the power user, providing the ultimate, low-latency performance boost for resource-demanding applications including high-resolution video editing, data visualization, gaming and other data intensive workload environments where traditional storage solutions are unable to keep pace with data demand.
“The demands of today’s performance power users are constantly being put to the test as new data-intensive applications push the boundaries of what can be achieved with even the market’s high performance professional workstations and most powerful gaming rigs,” said Ariel Perez, SSD business manager, Kingston. “KC1000 is the perfect solution to meet the needs of media and design professionals, gaming enthusiasts and anyone who needs ultra-low latency storage performance to end data bottlenecks. This native NVMe device offers one of the industry’s most powerful storage solutions for high-resolution content delivery, virtual reality applications, accelerated game play or a competitive edge for the creative professional on tight deadlines.”
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Transcend Information, a worldwide leader in storage, multimedia, and industrial products, announced that it will be exhibiting at COMPUTEX TAIPEI 2017 from May 30 to June 3 at the Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan. This year, Transcend will highlight five main categories-high speed PCIe and 3D NAND solid-state drives, dashcams and body cameras, Apple upgrade solutions, personal cloud storage devices, and a broad portfolio of embedded storage solutions, and will offer on-site demonstrations at booth I0808.
3D NAND and PCIe SSDs
This year, Transcend will showcase its complete line up of 3D NAND solid-state drives, including 2.5-inch, M.2, and embedded-use SSDs, all of which feature excellent performance, transfer rates, and reliability. Transcend's latest MTE850 PCIe Gen 3 x4 NVMe M.2 SSD, crafted with 3D MLC NAND flash, will also be on display. Thanks to 3D NAND technology and the next-generation PCIe NVMe protocol, the MTE850 SSD achieves never-before-seen transfer speeds and unquestionable reliability, making it perfect for both gaming and enterprise use.
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ADATA Technology, a leading manufacturer of high performance DRAM modules and NAND Flash products, today launched industrial-grade ISSS333 solid state drives in 3D MLC and 3D TLC versions. The ISSS333 range offers robust temperature, vibration, and shock tolerance as required in commercial and industrial applications. At the same time, users tap fast performance via universally-compatible SATA 6Gbps in a standard 2.5” form factor. Compared to mechanical storage, ISSS333 drives deliver vastly increased reliability, speed, and power efficiency.
More options for a growing audience
While SSDs become more popular as industrial and commercial storage, demand diversifies. Consequently, ADATA offers the ISSS333 range in 3D MLC and 3D TLC (multi-level cell and triple-level cell) versions. The use of 3D NAND ensures improved reliability and efficiency compared to older 2D NAND, with the MLC models ranging in capacity from 120GB to 1TB while TLC ISSS333 drives ship in 128GB to 1TB.
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Western Digital Corp., a global data storage technology and solutions leader, today announced the HGST-branded Ultrastar SS300, the company’s highest-performing SAS SSD to date. It is the latest addition to the company’s family of Ultrastar 12Gb/s SAS SSDs, which are used to meet the rigorous data demands of many of the world’s largest companies today. Developed in partnership with Intel, the new Ultrastar SS300 delivers best-in-class random performance, offering speeds of up to 400,000 IOPS random read and up to 200,000 IOPS random write.
“Today, we raise the bar with our newest 12Gb/s SAS SSD, the Ultrastar SS300,” said Ulrich Hansen, vice president of SSD product marketing at Western Digital Corporation. “Built with high-endurance 3D NAND flash memory, the Ultrastar SS300 offers best-in-class speed, outstanding capacity and intelligent power options that enable customers to tailor storage systems and server solutions that are just right for their demanding needs. These benefits are delivered with the same tremendous reliability that has helped to make Ultrastar 12Gb/s SAS SSDs popular around the globe.”
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