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Sony is increasing the speed and efficiency of their SD card lineup with the new SF-G Series. As performance demands and file sizes continue to increase, the SF-G Series of SD cards offer enhanced features optimized for professional photographers, DSLR and mirrorless camera users and videographers.
With a write speed of up to 299 MB/s, enabled by Sony’s unique firmware, the SF-G Series will be the world’s fastest SD cards. The quick write speed supports maximum performance of digital imaging devices, contributing to longer continuous shooting of high-resolution images with UHS-II supporting cameras. It also contributes to a shorter buffer clearing time so users never miss a critical moment.
Using Sony’s algorithm, the cards prevent the decrease of data-writing speeds and contribute to the camera’s ability of successive high speed shooting.
The cards also feature a read speed of up to 300MB/s. Paired with a memory card reader, the cards can transfer large volumes and file sizes to a computer very quickly, contributing to a more efficient workflow for professionals.
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The SD Association announced today UHS-III, doubling the fastest SD memory card transfer rate up to 624 megabytes per second (MB/s). UHS-III faster speeds help move large amounts of data generated by data-intense Gbps wireless communication, 360-degree cameras, drones, 3D, 4K and 8K videos recorded on SDXC and SDHC memory cards.
Immense storage capacities introduced with SDXC memory cards give users the ability to take more pictures and make unique video features on the latest imaging devices. Fast UHS bus interfaces help users manage that content more quickly. Since it is fully backwards compatible, devices offering UHS-III bus interface will accept the billions of existing SD memory cards in the market today.
“SD memory card capabilities continue to expand, paving the way for new and highly anticipated imaging and video features, from virtual reality to 8K video,” said Brian Kumagai, SDA president. “The SDA remains committed to supporting innovation by consumer electronics manufacturers and to delivering the same performance and interoperability consumers and professional users love about SD memory cards.”
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NGD Systems, a pioneer creating intelligent solid state drives (SSD) for public and private cloud data centers, today announced the availability of the industry’s highest density storage solution. Shipping immediately and currently being qualified at leading OEMs, the Catalina SSD is available in capacities up to 24TB with 3D TLC flash in a PCIe edge card form factor.
“The Catalina is the industry’s highest capacity PCIe NVMe SSD, designed and optimized for applications requiring consistent and low latency mass storage,” said Nader Salessi, founder and chief executive officer of NGD Systems. “We are setting a new metric for energy and storage density to meet a key concern within data center and cold storage applications alike.”
At less than 0.65 watts per terabyte, the new benchmark of the Catalina SSD achieved by using NGD System’s patented Elastic FTL (Flash Translation Layer) algorithm, and the incorporation of its advanced error correction capabilities, which enables 3D TLC NAND flash in enterprise applications. Not only is this watt per terabyte ratio more efficient than that of any other SSD currently shipping, it is also better than the highest capacity Enterprise HDD currently shipping. Optimized for read intensive applications, the Catalina SSD is ideal for use in Content Delivery Networks (CDN), Just a Bunch of Flash drives (JBOFs), and media severs.
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Toshiba Corporation has today unveiled the latest addition in its industry-leading line-up of BiCS FLASH three-dimensional flash memory with a stacked cell structure, a 64-layer device that achieves a 512-gigabit (64-gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology. The new device will be used in applications that include enterprise and consumer SSD. Sample shipments of the chip started this month, and mass production is scheduled for the second half of this calendar year.
Toshiba continues to refine BiCS FLASH, and the next milestone on its development roadmap is the industry’s largest capacity, a 1-terabyte product with a 16-die stacked architecture in a single package. Plans call for the start of sample shipments in April 2017.
For the new 512-gigabit device, Toshiba deployed leading-edge 64-layer stacking process to realize a 65% larger capacity per unit chip size than the 48-layer 256-gigabit (32-gigabytes) device, and has increased memory capacity per silicon wafer, reducing the cost per bit.
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Transcend Information, Inc. (Transcend), a leading manufacturer of storage and multimedia products, is proud to release the Ultimate UHS-I U3M Video Speed Class 30 (V30) microSD memory cards. These MLC-based microSD cards reach blazing-fast transfer speeds of up to 95MB per second and offer optimum protection with capacities up to 128GB, ideal for 4K Ultra HD recording.
Transcend Ultimate microSD cards are manufactured with top-tier MLC NAND flash chips, providing consistent long-life durability and endurance. The newly-released Ultimate UHS-I U3M microSD cards meet the new UHS Video Speed Class 30 (V30) standards of the SD Association, offering minimum sequential write speed of 30MB/s, ideal for 4K video recording. With capacities of up to 128GB and read and write speeds of up to 95MB and 60MB per second, Transcend Ultimate UHS-I U3M microSD cards are perfect for recording fast-paced action and capturing smooth 4K Ultra HD and Full HD videos. Transcend Ultimate microSD cards are designed for use in action cameras, dashcams, smartphones, tablets, digital cameras, and drone cameras.
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ADATA Technology, a leading manufacturer of high performance DRAM modules, NAND Flash products, and mobile accessories today launched the XPG SX950 SSD and its accompanying gaming-styled EX500 drive enclosure. Loaded with up to 960GB of 3D MLC NAND and driven by a SMI controller, the SX950 utilizes a custom ADATA PCB and is backed by an extra-strict chip sorting process to ensure an SSD that can handle prolonged high demand. Performance reaches 560MB/s read and 530MB/s write. Bearing the signature XPG look, the EX500 is aimed at gamers and case modders, boasting a textured enclosure and a vibrant yet aggressive feel. It arrives with a spacer and bracket for easy install on desktops and notebooks. For users that would like to use the SX950 as external storage, the EX500 offers a stylish, durable, and easy-install enclosure that pairs instantly with desktops, notebook! s, and game consoles via high speed USB 3.1.
ADATA is completing its transition to stacked memory, or 3D NAND. This allows for SSDs with bigger capacities without a correlating increase in prices paid by end users. The SX950 uses durable 3D MLC (multi-level cell) NAND Flash and SMI controller. Consumers can choose from 240GB, 480B, and 960GB versions of the SX950. Not only denser (higher capacity), 3D NAND is also roughly 10% faster than 2D NAND and so the SX950 outpaces its predecessor, the SX930 – reaching 560MB/s read and 530MB/s write.
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Toshiba Corporation today announced that it has started construction of a new state-of-the-art semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base.
Fab 6 will be dedicated to production of BiCS FLASH™, Toshiba’s innovative 3D Flash memory. Like Fab 5, construction will take place in two phases, allowing the pace of investment to be optimized against market trends, with completion of Phase 1 scheduled for summer 2018. Toshiba will determine installed capacity and output targets and schedules by closely monitoring the market.
Toshiba will also construct a Memory R&D Center adjacent to the new fab, with completion targeting December 2017. The facility will advance development of BiCS FLASH™ and new memories.
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Western Digital Corp. today announced that it has commenced pilot production of the company's 512 Gigabit (Gb) three-bits-per-cell (X3) 64-layer 3D NAND (BICS3) chip in Yokkaichi, Japan, with mass production expected in the second half of 2017. The first of its kind, the chip is the latest achievement in a nearly three-decades-long legacy of flash memory industry firsts from the storage leader.
"The launch of the industry's first 512Gb 64-layer 3D NAND chip is another important stride forward in the advancement of our 3D NAND technology, doubling the density from when we introduced the world's first 64-layer architecture in July 2016," said Dr. Siva Sivaram, executive vice president, memory technology, Western Digital. "This is a great addition to our rapidly broadening 3D NAND technology portfolio. It positions us well to continue addressing the increasing demand for storage due to rapid data growth across a wide range of customer retail, mobile and data center applications."
The 512Gb 64-layer chip was developed jointly with the company's technology and manufacturing partner Toshiba. Western Digital first introduced initial capacities of the world's first 64-layer 3D NAND technology in July 2016 and the world's first 48-layer 3D NAND technology in 2015; product shipments with both technologies continue to retail and OEM customers.
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Freecom announces the launch in Europe of the mSSD MAXX – a super-fast, compact and stylish SSD for Mac and PC users. The introduction of the high-performing and lightweight SSD completes the line-up for the wider Freecom family of HDD and SSD products which all boast a strong aluminium enclosure with a sleek brushed metal textured appearance.
Available in 512GB, the mSSD MAXX delivers data transfer speeds of up to 700MB/s, making it one of the fastest portable SSDs available in the market.
The storage device weighs just 72g and measures 91mm x 57mm and 10mm (L x W x H) to strike a very appealing balance between pocket-friendly portability and accelerated performance that allows users to dramatically reduce data read and write waiting times.
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Transcend Information, Inc. (Transcend), a leading manufacturer of industrial-grade products, proudly presents the industrial-grade SuperMLC JetFlash 740 USB flash drive. Positioned between its SLC and MLC NAND flash offerings, Transcend’s exclusive SuperMLC technology is a cost-effective solution that offers performance close to that of SLC NAND flash. Compliant with USB 3.1 Gen 1 specifications, the JetFlash 740 boasts excellent performance and endurance at affordable prices, making it ideal for demanding industrial grade applications.
Blazing-Fast Performance up to 120MB/s
Drawing on the strengths of both Single-Level Cell (SLC) and Multi-Level Cell (MLC) NAND flash, Transcend has developed SuperMLC technology by reprogramming the two bits per cell of MLC into one bit per cell, greatly boosting performance. Compliant with USB 3.1 Gen 1 specifications, the transfer speeds of Transcend’s JetFlash 740 USB flash drive can reach up to 120MB/s read and 90MB/s write, double those of MLC flash chips. Transcend’s SuperMLC technology is a great match for industrial applications that demand quality comparable to SLC NAND flash at a cost-effective price.
