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Marvell, a leader in storage, networking and connectivity semiconductor solutions, today announced that it is launching innovative NVM Express (NVMe)-based chipset solutions that will accelerate the time to market for application-optimized data center SSD implementations. These new, highly-versatile building blocks can optimally address current and emerging workload storage requirements, spanning capacity, latency, performance, power and cost, to enable tailored SSD solutions for specific cloud and enterprise workloads.
The proliferation of cloud services and new technologies, such as artificial intelligence and machine learning, is driving various workloads in the data center. These evolving and expanding workloads can have differing storage requirements that emerging SSD form factors are targeted to address. Marvell has developed innovative NVMe chipsets capable of powering the larger Enterprise Data Storage Form Factors (EDSFF), Next Generation Small Form Factors (NGSFF) and various customized form factors, providing the ability to increase storage capacity, performance and overall workload efficiencies.
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LITE-ON Storage, an established leader in the rapidly expanding solid-state drive (SSD) industry, said today it will demonstrate its latest enterprise drives, the NVRAM Hybrid SSD, during the OCP U.S. Summit 2018, kicking off here today.
The new LITE-ON NVRAM Hybrid drive, slated for release this spring, is a compact high-density drive with multi-namespaces. One of the namespaces can be dedicated to NVRAM drive and the other namespace to boot drive, fully utilizing the NAND portion of the drive. This drive has a dual-use feature such that it can serve as boot drive for server with the SSD namespace and as cache with the NVRAM part of the drive, resulting in reduced overall Total Cost of Ownership (TCO) with a better utilization rate.
“Customers tell us they need the most technologically advanced SSDs in their enterprises, but those storage solutions must also make financial sense,” said Darlo Perez, Managing Director, LITE-ON Storage Group. “Our new NVRAM Hybrid SSD is capable of meeting today’s demanding and time-sensitive data center requirements while maximizing TCO.”
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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is rolling out its PM883, the highest density datacenter SATA drive, at eight terabytes (TB). Samsung’s new solid state drive (SSD) offering is the industry’s first datacenter SATA drive to incorporate LPDDR4 DRAM modules and features a 6.0-gigabits-per-second (Gbps) 2.5-inch SATA interface.
The high-performance PM883 is expected to accelerate a transition in many existing enterprise datacenters to SATA-formatted SSD designs, with improved economies of scale through the use of advanced-generation V-NAND technology at higher densities.
“We are thrilled to have the opportunity to enable a high level of storage density with low power consumption, which thanks to the efficiency of our 64-layer V-NAND-based technology, allows us to double the capacity of current SATA storage,” said Jim Elliott, corporate senior vice president, memory sales and marketing, Samsung Semiconductor, Inc. “Our expanded lineup for the PM883 will offer up to 8TB to allow optimal use in existing enterprise and cloud storage systems.”
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Nimbus Data, a pioneer in flash memory solutions, today announced the ExaDrive DC100, the largest capacity (100 terabytes) solid state drive (SSD) ever produced. Featuring more than 3x the capacity of the closest competitor, the ExaDrive DC100 also draws 85% less power per terabyte (TB). These innovations reduce total cost of ownership per terabyte by 42% compared to competing enterprise SSDs, helping accelerate flash memory adoption in both cloud infrastructure and edge computing.
“As flash memory prices decline, capacity, energy efficiency, and density will become the critical drivers of cost reduction and competitive advantage,” stated Thomas Isakovich, CEO and founder of Nimbus Data. “The ExaDrive DC100 meets these challenges for both data center and edge applications, offering unmatched capacity in an ultra-low power design.”
Optimized to Maximize Flash Storage Capacity and Efficiency
While existing SSDs focus on speed, the DC100 is optimized for capacity and efficiency. With its patent-pending multiprocessor architecture, the DC100 supports much greater capacity than monolithic flash controllers. Using 3D NAND, the DC100 provides enough flash capacity to store 20 million songs, 20,000 HD movies, or 2,000 iPhones worth of data in a device small enough to fit in your back pocket. For data centers, a single rack of DC100 SSDs can achieve over 100 petabytes of raw capacity. Data centers can reduce power, cooling, and rack space costs by 85% per terabyte, enabling more workloads to move to flash at the lowest possible total cost of ownership.
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Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, has enhanced its portfolio of solid-state drives (SSDs) for the data center with a new, 3D flash memory-based lineup of PCI Express NVMe and SATA SSDs in multiple form factors. The new CD5, XD5 and HK6-DC SSDs enable infrastructure managers to address performance and workload demands by offering robust performance and reliability with lower operating power for read-intensive applications such as NoSQL databases, big data analytics and streaming media.
“Demand for flash storage in data centers continues to grow rapidly – with capacity shipped into the enterprise expected to increase at a 58 percent CAGR through 2021,” said Jeff Janukowicz, IDC Research Vice President for Solid State Drives and Enabling Technologies. “In order for hyperscale, virtualization, automation/orchestration and software-defined storage applications to thrive, cloud data centers must meet specific workload requirements. Toshiba’s latest data center SSDs are designed to help customers address these demanding environments and realize the most value from their flash storage.”
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COLORFUL Technology Company Limited, professional manufacturer of graphics cards, motherboards and high-performance storage solutions is proud to announce the availability of its limited edition COLORFUL SL300 160G Spring L.E. solid state drive. Featuring an all-new pink frosted aluminum alloy shell, the COLORFUL Season series SSD is set to make a statement for builders who are looking to express themselves and create a stunning build featuring a pink color scheme or just want a snazzy pink SSD for their PC, the COLORFUL SL300 160G Spring L.E. is the only choice.
The COLORFUL SL300 Spring L.E. is based off the highly-commended SL300 series solid-state drives from COLORFUL. These SSDs feature a non-standard capacity due to newer 3D NAND flash specification which is the result of new developments in 3D NAND technology. This allows a large volume single BGA NAND flash chip to be created. For example, the COLORFUL SL300 Plus 160G uses a 4 die wafer array.
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ADATA Technology, a leading manufacturer of high performance DRAM modules, NAND Flash products, and mobile accessories, today launched the XPG SX950U 2.5” SATA 6Gb/s Gaming SSD which utilizes the latest 3D NAND Flash memory and is driven by a high-speed SMI controller to reach large capacities of up to 960GB with significantly higher read/write speeds up to 560/520MB per second. Furthermore, the SX950U is equipped with Intelligent SLC Caching and a DRAM Cache Buffer to provide an optimized and consistent performance. To ensure data integrity and the safety of data transmission, the SX950U features LDPC ECC and RAID Engine technologies, enhancing the stability of the system and extending the SSD’s lifespan. For PC enthusiasts and gamers in pursuit of the optimal gaming experience, the SX950U is the ideal choice for improving system performance at an affordable price.
High Speed with Great Stability
The SX950U Gaming SSD applies the latest generation of 3D NAND Flash, providing higher reliability and performance in comparison to previous 2D NAND SSDs. With large capacities of up to 960GB, gamers can store more games and data on the SX950U. The SSD employs an SMI controller, along with intelligent SLC Caching and DRAM Cache Buffer, and is rated at maximum transfer speeds of 560MB/s for reads and 520MB/s for writes. Thanks to the features of the SX950U, gamers will be able to launch and load games faster than ever.
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Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today its new series of ‘Canvas’ Flash memory cards. Canvas will offer three different variations in both SD and microSD cards: Select, Go, and React to suit consumers’ needs.
With the Canvas line of memory cards, users and creators can choose the best storage medium available. The cards are designed to provide the reliability, flexibility and performance needed for any project. Along with tested durability, users will have the confidence to bring Canvas cards wherever their imagination takes them.
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Today, Intel announced the Intel Optane SSD 800P, the latest addition to the growing Intel Optane technology family of products. The 800P joins the Intel Optane SSD 900P, designed for enthusiasts and professional users, and Intel Optane memory, an acceleration solution to speed up slower storage, like hard disk drives and SATA SSDs. Intel Optane technology delivers an unparalleled combination of high throughput, low latency, high quality of service and industry-leading endurance.
Intel Optane SSD 800P enables fast system boot, speedy application load times and smooth multitasking. It is ideal for use as a standalone SSD, in a dual drive setup or in a multiple SSD RAID configuration (PCH-based or CPU-based), offering performance and flexibility to users. The drive also supports lower-power states, allowing it to operate in devices like laptops and 2 in 1 devices, as well as desktop systems. The 800P excels with low queue depth random workloads, where most client system activity takes place, and offers uncompromising responsiveness and throughput. The 800P is available in 58GB and 118GB capacities in the M.2 2280 form factor using an NVMe PCIe 3.0 x2 interface.
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The new Verbatim ToughMAX USB 2.0 Drive has been made with KyronMAX compounds, a metal replacement thermoplastic material which is able to withstand seriously punishing conditions and has been used in the most demanding of applications from fighter jets to mountain bikes.
KyronMAX™ compounds are manufactured by Piper Plastics which, like Verbatim, is a group company of Mitsubishi Chemical. This incredible material has been adopted by many industries including aerospace, medical, industrial and automotive, and has a tensile strength to weight ratio that is higher than steel.
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