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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) 3.0 for next-generation mobile devices. In line with the latest eUFS 3.0 specification, the new Samsung memory delivers twice the speed of the previous eUFS storage (eUFS 2.1), allowing mobile memory to support seamless user experiences in future smartphones with ultra-large high-resolution screens.
“Beginning mass production of our eUFS 3.0 lineup gives us a great advantage in the next-generation mobile market to which we are bringing a memory read speed that was before only available on ultra-slim laptops,” said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. “As we expand our eUFS 3.0 offerings, including a 1-Terabyte (TB) version later this year, we expect to play a major role in accelerating momentum within the premium mobile market.”
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As consumer demand for high-quality content continues to rise, Western Digital Corp. is enabling a bigger, faster experience with new industry-leading solutions that give consumers the best combination of performance and capacity so they can do more with the rich content they capture. At Mobile World Congress, the company is showcasing the world’s fastest 1TB UHS-I microSD flash memory card, the 1TB SanDisk Extreme UHS-I microSDXC card. The new card features higher speed and capacity for capturing and moving massive amounts of high-quality photos and videos on smartphones, drones and action cameras. These impressive levels of capacity and speed give consumers the ability to create all the content they want without worrying about space limitations or long transfer times.
Today’s smartphones and cameras allow consumers to create high-quality content in the palm of their hands, thanks to features like multi-lenses, burst mode capabilities and the 4K resolution. Western Digital continues to deliver the most advanced solutions to ensure consumers can reliably capture and share a special moment or create video content for personal or professional use.
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The SD Association announced today microSD Express, offering the popular PCI Express and NVMe interfaces alongside the legacy microSD interface for backwards compatibility. Like SD Express, microSD Express uses the PCIe interface delivering a 985 megabytes per second (MB/s) maximum data transfer rate and the NVMe upper layer protocol enables advanced memory access mechanism, enabling a new world of opportunities for mobile devices.
microSD Express cards defined in the SD 7.1 specification will be offered in a variety of capacities such as microSDHC Express, microSDXC Express and microSDUC Express. An updated video provides an overview of microSD Express and SD Express.
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ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today launched its ADATA Ultimate SU750 2.5” SATA 6Gb/s solid-state drives (SSD). With next-generation TLC (Triple-Level Cell) 3D NAND Flash and a host of other features, SU750 SSDs deliver terrific value, great performance, and superb reliability to offer users an excellent option for their next upgrade.
Implementing 3D NAND Flash, Ultimate SU750 SSDs features higher storage capacities of 256GB, 512GB, and 1TB. With SLC Caching, the drives can achieve read/write speeds of up to 550/520MB per second to accelerate PC performance. Users will revel in not having to wait around to access files and for programs to load. What’s more, with no mechanical components, SU750 SSDs are more resilient than HDDs. They are more resistant to shock and vibration (1500G/0.5ms), therefore providing better protection of data. Also, SSDs also run silently and consume less power than HDDs.
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Toshiba Memory Corporation, the world leader in memory solutions, today announced the development of a bridge chip that realizes high-speed and large-capacity SSDs. Using developed bridge chips with a small occupied area and low-power consumption, the company has succeeded in connecting more flash memory chips with fewer high-speed signal lines than with the conventional method of no bridge chips. This result was announced in San Francisco on February 20, at the International Solid-State Circuits Conference 2019 (ISSCC 2019).
In SSDs, multiple flash memory chips are connected to a controller that manages their operation. As more flash memory chips are connected to a controller interface, operating speed degrades, so there are limits to the number of chips that can be connected. In order to increase capacity, it is necessary to increase the number of interfaces, but that results in an enormous number of high-speed signal lines connected to the controller, making it more difficult to implement the wiring on the SSD board.
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SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products, today announced the introduction of its N200 line of SATA products. With burst speed and low power consumption, the N200 family is an ideal economic option for NAS/SAN storage systems, x86 server-storage appliances, distributed scale-out servers, telecom and networking routers and switches, industrial control, printers and more.
Built with Triple Level Cell (TLC) 3D NAND technology, the new N200 line of SATA products, consisting of the mSATA (MO-300), the M.2 2242 and 2280, the Slim SATA (MO-297), and the removable 2.5" solid state drive form factors, delivers the advantages of economical, industrial-grade non-volatile memory to embedded computing applications. The N200 SATA products are offered in capacities ranging from 32GB to 1TB, depending on form factor, and all are available in industrial and commercial temperatures.
N200 products offer excellent burst read/write performance, suitable for applications that require lower drive capacity and utilize the drive for boot up code and operating system (OS) code storage. The higher capacity drives are an excellent choice for transaction intensive applications such as x86 server-storage appliances, telecommunications and networking routers and switches, Advanced Telecommunications Computing Architecture (ATCA) computer blades, single board computers for defense, gaming, industrial control applications and printers.
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Plugable, the leading developer of USB, Thunderbolt, Bluetooth and power-related devices, launches the 10Gb USB-C (USB 3.1 Gen 2) NVMe SSD Enclosure, the first high performance NVMe enclosure to feature a completely tool-free, spring-loaded design for inserting and removing a compatible SSD, along with advanced thermal management to maximize performance and device lifespan.
With a sleek and slim profile, a rugged aluminum body for improved heat dissipation, and USB Type-A and Type-C host compatibility, the Plugable USB-C NVMe Enclosure is an optimal solution for safeguarding SSDs when moving from the workplace to the home office and achieving maximum transfer performance speeds on PCs, Macs and Linux devices.
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Today people share their lives through pictures and video taken on their smartphones and cameras, whether that’s incredible moments from a vacation or brief moments of their daily lives. Devices have quickly evolved to allow anyone to become a content creator, capturing and sharing high-resolution and 4K content easily.
Since content is easier than ever to capture, people need the right storage options to help meet their needs, that’s why Samsung is introducing the Samsung 512GB microSDXC EVO Plus. The new memory card delivers more storage in a tiny package, to easily give people the freedom to save more content on their smartphones, cameras, tablets, drones, and more.
The Samsung 512GB microSDXC EVO Plus is equipped with a full-size SD card adapter for multi-device flexibility. Pairing the card with the Samsung Galaxy Note9 creates the optimal solution for today’s content creators, who can now bolster their phone’s storage capacity to 1TB.
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Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in next-generation mobile applications. Just four years after introducing the first UFS solution, the 128-gigabyte (GB) eUFS, Samsung has passed the much-anticipated terabyte threshold in smartphone storage. Smartphone enthusiasts will soon be able to enjoy storage capacity comparable to a premium notebook PC, without having to pair their phones with additional memory cards.
“The 1TB eUFS is expected to play a critical role in bringing a more notebook-like user experience to the next generation of mobile devices,” said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. “What’s more, Samsung is committed to assuring the most reliable supply chain and adequate production quantities to support the timely launches of upcoming flagship smartphones in accelerating growth of the global mobile market.”
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OWC, a leading zero emissions Mac and PC technology company, has released the second generation of their super-fast ThunderBlade external SSD, with a lower price point and improved performance. For creative professionals and prosumers who work to capture and process 4K or 8K video, the updated ThunderBlade Gen 2 can be the difference between staying under budget and on-schedule on a project - or not.
The new ThunderBlade is stackable and runs cooler than the previous iteration, while still maintaining a near-silent environment with its fanless operation, all factors that can be critical in an operation on the go or in a tight space. With dual Thunderbolt 3 ports users can daisy-chain up to five additional ThunderBlades, and by connecting more than one drive with SoftRAID, speeds can be increased up to 3800MB/s. The newest ThunderBlade can complete a 1TB content transfer in under four-and-a-half minutes.
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