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SK hynix Inc. announced today that it has developed and starts mass-producing the world’s first 128-Layer 1Tb (Terabit) TLC (Triple-Level Cell) 4D NAND Flash, only eight months after the Company announced the 96-Layer 4D NAND Flash last year.
The 128-Layer 1Tb NAND chip offers the industry's highest vertical stacking with more than 360 billion NAND cells, each of which stores 3 bits, per one chip. To achieve this, SK hynix applied innovative technologies, such as “ultra-homogeneous vertical etching technology,” “high-reliability multi-layer thin-film cell formation technology,” and ultra-fast low-power circuit design, to its own 4D NAND technology.
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Today Team Group launches two solid state drives with different features. The internal model, which under Team Group’s gaming brand T-FORCE, is CARDEA II M.2 solid state drive. This solid state drive emphasizes on features like PCIe Gen3 x4 high speed interface and cooling module with patent gaming fin type design. The portable solid state drive PD400 uses the latest generation of high speed USB 3.1 Gen1 interface. It is lightweight, easy to carry and also has three major features: pressure resistant, shock proof, water proof. The two internal and external solid state drives offers solutions for the need of performance and appearance. Consumers not only can possess the latest visual design, but also enjoy the great advance in performance of storage devices.
T-FORCE M.2 PCIe SSD – CARDEA series release the CARDEA II solid state drive with improved performance. The gaming fin type cooling module has patented design (Taiwan Utility Model Patent No. M541645), and has passed rigorous tests and burn-in test. It can be cooled down about 10 degrees in a closed space, and 30 degrees in an open space. The radiating performance can be increased by 15% comparing with traditional cooling module. Module’s superconductivity – thermally conductive adhesive can effectively accelerate the heat transfer process, so the speed performance won’t be affected by high temperature anymore. CARDEA II uses PCIe Gen3 x4 high speed interface and supports the latest NVMe 1.3 protocol. It has a truly outstanding sequential read/write speed of up to 3400/3000 MB/s, and random read/write speed of up to 180K/160K IOPS.
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SK hynix Inc. announced today that it launched a new low-power Non-Volatile Memory express (NVMe) Enterprise SSD (eSSD) with the 72-layer TLC 3D NAND flash that offers best-in-class performance for power as well as Quality of Service.
The product features an in-house NVMe controller on top of the 72-layer 3D NAND technology currently in mass production. With the launch, SK hynix has established itself as a memory producer that designs, develops, and mass-produces all key components, from NAND and DRAM to controllers, in-house, for not only Client but also Enterprise applications.
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Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, participated in the PCI-SIG (Peripheral Component Interconnect Special Interest Group) Compliance Workshop #109 in Burlingame, California, where several prototype and engineering samples of the company’s upcoming PCIe 4.0 NVMe SSDs underwent PCI-SIG FYI Gen 4 testing.
The fourth generation of the PCIe interface, PCIe 4.0, doubles available bandwidth for graphics cards, SSDs, Wi-Fi, and Ethernet cards. The new standard will enable SSDs in particular to provide much higher performance than previous PCIe 3.0 SSDs, especially sequential read performance.
An early participant seeking to enable PCIe 4.0 technologies, Toshiba Memory leverages its technology leadership role and actively collaborates with PCI-SIG and other member companies to accelerate adoption of the new interface standard.
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ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories announces that it has upgraded the endurance rating of its industrial-grade 3D TLC solid state drives (SSD) to 3K P/E cycles, bringing their endurance, reliability, and stability up to par with 2D MLC SSDs. Combined with their ability to operate in a wide range of temperatures (-40° C to 85° C), they are excellent solutions that provide the durability and consistency required by applications such as Artificial Intelligence, Internet of Things (IoT), Intelligent Transportation Systems, surveillance systems, data centers, network operations, defense systems, and energy exploration.
ADATA 3D TLC SSDs Give 2D MLC SSDs a Run for Their Money
The continual improvements in NAND Flash design and manufacturing, as well as the ever-changing demands of the market, have driven 3D NAND to become a popular memory solution across many industries. Despite its growing prominence, 3D NAND has had two major deficiencies, namely the ability to operate in extreme temperatures and achieve higher endurance ratings. To fill this gap, ADATA has upgraded its industrial-grade 3D TLC SSDs to an endurance rating of 3K P/E cycles, which makes them comparable to 2D MLC SSDs. At the same, ADATA 3D TLC SSDs are also designed to operate in a wide temperature range (-40° C to 85° C), delivering a memory solution that is long-lasting, robust, and reliable.
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CORSAIR, a world leader in PC gaming peripherals and enthusiast components, today unveiled the new CORSAIR Force Series MP600 NVMe PCIe Gen4 x4 M.2 SSD, one of the world’s first PCIe 4.0 M.2 SSDs compatible with the new AMD X570 chipset, also revealed today. Unleashed by the PCIe 4.0 ready AMD X570 chipset, the MP600 reaches new heights of enthusiast single-drive storage performance, delivering up to 4950MB/sec sequential read – ten times the performance of many SATA SSDs, and fifty times faster than some hard disk drives.
The MP600’s phenomenal performance stems from the hugely increased bandwidth of PCIe 4.0 (PCI-Express Generation 4), a feature that will be made available to customers for the first time as part of the AMD X570 chipset and 3rd Generation AMD Ryzen™ Desktop Processors. Easily fitting into a PCIe 4.0 x4 M.2 slot, the MP600’s NVMe interface and high-density 3D TLC NAND combine with a Phison PS5016-E16 controller to enable a new level of single-drive SSD performance. Boasting up to 4,950MB/s sequential read and 4,250MB/s sequential write speeds, the MP600 is ready to become the storage center of your new 3rdGen AMD Ryzen Desktop Processor and AMD X570 chipset-based system.
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Galaxy Microsystems Limited, a leading graphics card, storage and peripheral manufacturer, today announces the GALAX HOF (Hall Of Fame) Pro PCIe M.2, one of the world’s first SSD supporting next generation PCIe 4.0 technology. As GALAX’s new flagship, the GALAX HOF Pro PCIe M.2 adopts Phison’s latest PS5016-E16 controller, providing lighting fast performance. The E16 is an 8-channel controller supporting NVMe protocol, it’s built on 28nm process and is the world’s first SSD controller supporting PCIe 4.0 x4 technology.
Easily breaks 4GB/s barrier
As one of the early adopters of E16, the GALAX HOF Pro PCIe M.2 shows extraordinary performance. The 3rd Gen AMD Ryzen Desktop Processor with the AMD X570 chipset is the world’s first PC platform to support PCIe 4.0 connectivity. AMD is leading advanced technologies and was a driving force behind bringing PCIe 4.0 capabilities to market. With this new platform, the GALAX HOF Pro PCIe M.2 achieves up to 4800/4000MB/s sequential read/write speed. Such amazing speed even out-performs the just-announced GALAX HOF PCIe M.2, which is impossible without the advancement of PCIe 4.0 technology. This brings users blazing fast application startup speed and reduced game loading time.
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Transcend Information Inc., a leading manufacturer of storage and multimedia products, proudly presents a new line of solid-state drives made for the high-end embedded market. Made of top-tier 3D NAND and featuring enhanced endurance as well as exceptional thermal tolerance, this latest line-up comprises SSDs in the 2.5” SATA III, PCIe M.2, and SATA III M.2 form factors.
Rated to endure 3K P/E (Program/Erase) cycles, and engineered to withstand extreme operating temperatures from -40°C to 85°C, these SSDs are made to reliably operate with embedded applications, including AIoT (Artificial Intelligence of Things), ITS (Intelligent Transportation Systems), IoV (Internet of Vehicles), and surveillance systems.
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ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces that launch of the XPG SPECTRIX S40G RGB gaming SSD. With sustained read/write speeds of up to 3500/3000MB per second, customizable RGB lighting, and a slew of performance enhancing features, the XPG SPECTRIX S40G is a no brainer for those seeking amazing performance and exceptional reliability.
The S40G supports the NVMe standard and utilizes the high-speed PCIe Gen3 x4 interface to let users enjoy sustained read/write speeds of up to 3500/3000 MB per second. What’s more, sporting next-generation 3D Flash memory it offers a leap forward in capacity, efficiency, and durability. Also with the M.2 2280 specification, it supports the latest Intel and AMD platforms. These capabilities make the S40G ideally suited for gamers, PC enthusiasts, overclockers, and graphics professionals. User can customize the SSD’s look with programmable RGB lighting effects. They can set up patterns, pulse speed, lighting intensity, and more. Control is a snap with XPG’s RGB control software.
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Samsung brings new designer colors to the T5 Portable SSD, adding a refined Rose Gold and bold Metallic Red aluminum finish. The new colors join the original Alluring Blue and Deep Black finishes providing four options for colors and storage capacities. Rose Gold and Metallic Red are available in 500GB and 1TB capacities. The class-leading T5 delivers storage on the go for nearly any device, offering file transfers up to 4.9 times faster than external HDD.
T5 holds up to 2TB of files and it can transfer files quickly with speeds up to 540MBper second. It is the perfect storage companion for photographers, console gamers and professionals, who need on-the-go storage or a reliable backup device that’s compact, lightweight and secure.
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