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Other World Computing today introduced the OWC Mercury Helios+E2 Thunderbolt SSD Solution. The bootable ‘all-in-one’ storage performance and expansion solution offers owners of Thunderbolt technology enabled Macs and PCs sustained read/write data throughput up to 617MB/s from up to 960GB of OWC Mercury SSD capacity; two Thunderbolt interfaces for connecting multiple Thunderbolt devices; and two eSATA 6Gb/s expansion ports for connecting up to an additional 32TB or more of external storage/backup capacity.
With the simple connection of a Thunderbolt cable, the Helios+E2 immediately expands the storage performance and expansion capabilities of Thunderbolt enabled iMac, Mac mini, MacBook Air, and MacBook Pro machines as well as PCs. Inside Helios+E2 resides an OWC Mercury Accelsior_E2, the only Mac bootable and supported PCIe SSD. Featuring two custom SandForce Driven Acccelsior SSD ‘blades’, Helios+E2 offers total capacity choices up to 960GB, up to 100K IOPS, and performance beyond even 6G speed with sustained data transfer rates up to 617MB/s read and 524MB/s write. With that level of bootable performance, creative professionals can stop waiting for I/O-intensive apps like Photoshop, Final Cut Pro, or Avid Pro Tools to render, capture or process; as well as experience near instantaneous booting and application launches.
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Are you still spending your quality time waiting for your computer to boot up? Have you experienced lag problems while operating multiple applications? SP/Silicon Power, the world’s leading provider of memory storage solutions, today introduces an addition of the Velox series 2.5” SATA III SSD – Velox V50 to solve your problems. The Velox V50 features the latest controller technology to provide a brand new computer experience in excellent performance and cost effectiveness for those who are about to retire their traditional hard drives.
Different from the other solutions in the market, SP Velox V50 is equipped with a brand new controller, delivering a more stable and more powerful user experiences. Combining with the latest firmware and advanced controller circuit design, Velox V50 is able to maintain a long-standing IOPS performance while using it under extended period.
The new Velox V50 features the SATA III 6Gbps interface, delivers four time faster performance than the traditional hard drives in computer’s boot time as well as in operating multiple programs. Built up with the advanced high speed NAND flash, V50 performs a high data transfer rate up to 530MB/s in read speed and 200MB/s in write speed.
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HGST today announced the industry's fastest and most advanced enterprise-class, multi level cell (MLC) SAS SSD family – the Ultrastar SSD800MH, Ultrastar SSD800MM and Ultrastar SSD1000MR. From the market share leader in enterprise SAS/FC SSDs, these HGST drives are the first to double today's SAS interface speed. Designed for the most demanding applications where "hot" data is accessed frequently, such as high-frequency trading, online banking, cloud computing, online gaming, and big data analytics, HGST's new 12Gb/s SAS SSDs help increase input/output per second (IOPS) and improve response times to mission-critical data in cloud and traditional IT datacenters environments.
Due to their rich SCSI heritage, SAS SSDs and high performance, high capacity hard disk drives (HDDs) will continue to be the building blocks of choice for future generations of high-performance enterprise servers and storage arrays. Leveraging HGST's SSD market success, the new Ultrastar 12Gb/s SAS SSD family combines enterprise-grade, 25nm, highest-endurance, MLC NAND flash memory, industry-leading performance, advanced endurance management firmware and power loss data management techniques to extend reliability, endurance and sustained performance over the life of the SSD.
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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing a 128-gigabit (Gb), 3-bit multi-level-cell (MLC) NAND memory chip using 10 nanometer (nm)-class process technology this month. The highly advanced chip will enable high-density memory solutions such as embedded NAND storage and solid state drives (SSDs).
“By introducing next-generation memory storage products like the 128Gb NAND chip, Samsung is extremely well situated to meet growing global customer needs,” said Young-Hyun Jun, executive vice president, memory sales & marketing, Device Solutions Division, Samsung Electronics. “The new chip is a critical product in the evolution of NAND flash, one whose timely production will enable us to increase our competitiveness in the high density memory storage market.”
Samsung’s 128Gb NAND flash is based on a 3-bit multi-level-cell design and 10nm-class process technology. It boasts the industry’s highest density as well as the highest performance level of 400 megabits-per-second (mbps) data transfer rate based on the toggle DDR 2.0 interface.
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Fusion-io today announced that the ioFX workstation acceleration platform is now available with 1.6 TB of capacity, in addition to the original 420 GB form factor. The high capacity ioFX is ideal for video editing, computer assisted design (CAD), 4K and stereoscopic production, as well as digital intermediate (DI) finishing.
“Digital production is undergoing a resolution revolution as production moves to 4K and beyond, while production budgets and deadlines continue to tighten,” said Vincent Brisebois, Fusion-io Director of Visual Computing. “To overcome these opposing forces, the Fusion ioFX can help digital artists efficiently deliver creative work faster, even when faced with the most demanding production requirements. Fusion-io is proud to collaborate with industry leading software developers and hardware companies to deliver breakthrough acceleration for the tools used by professional artists worldwide.”
