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SanDisk Corporation, a global leader in flash storage solutions, today announced that it has successfully developed its 48 layer second generation 3D NAND, also referred to as BiCS2. Pilot production will commence as planned in the second half of 2015 in the Yokkaichi joint venture facility, with meaningful commercial production targeted for 2016.
“We are very pleased to announce our second generation 3D NAND, which is a 48 layer architecture developed with our partner Toshiba,” said Dr. Siva Sivaram, executive vice president, memory technology, SanDisk. “We utilized our first generation 3D NAND technology as a learning vehicle, enabling us to develop our commercial second generation 3D NAND, which we believe will deliver compelling storage solutions for our customers.”
SanDisk plans to use the second generation 3D NAND technology across a broad range of solutions, from removable products to enterprise SSDs.
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HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the HyperX Predator PCIe SSD. Shipping immediately, HyperX Predator PCIe SSD is the highest-end SSD with the fastest speeds in the HyperX lineup.
HyperX Predator PCIe SSD offers large capacities (240GB, 480GB) and incredible speeds to take systems to the edge. Faster than SATA-based SSDs, the PCIe generation 2.0 x4 interface delivers speeds up to 1400MB/s read and 1000MB/s write for ultra-responsive multitasking and an overall faster system. It is powered by the Marvell 88SS9293 controller.
The M.2 form factor ensures next-generation platform support with an M.2 PCIe slot. An optional half-height, half-length (HHHL) adapter is also available for many existing motherboards without an M.2 socket. The HHHL adapter comes with both standard and low-profile brackets to fit in slim profile desktop builds.
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Toshiba Corporation’s Semiconductor & Storage Products Company today announced the launch of JEDEC e∙MMC Version 5.1 compliant embedded NAND flash memory products supporting “command queuing” and “secure write protection”. The new products integrate NAND chips fabricated with 15nm process technology and are designed for application in a wide range of digital consumer products, including smartphones, tablets and wearable devices. Sample shipment of the 16GB and 64GB products start today, with 32GB and 128GB products to follow.
The new products integrate NAND chips fabricated with Toshiba's cutting-edge 15nm generation process technology with a controller to manage basic control functions for NAND applications in a single package. In October 2014, Toshiba launched the industry’s first e∙MMC products supporting all mandatory features of JEDEC e∙MMC Version 5.1, which was officially issued by JEDEC on February 24, 2015. The new additions to the line-up support two optional features of e∙MMC Version 5.1, “command queuing” and “secure write protection”.
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OCZ Storage Solutions, a Toshiba Group Company and the most awarded solid state drive (SSD) brand of all time, today announced the release of the next generation Vector 180 SSD series along with the all-new SSD Guru storage management solution. Worthy of flagship status, the new Vector 180 features enhanced reliability, technology, storage capacity, and superior customer support all while providing the Vector’s original game-changing performance and endurance it’s known for. The feature-rich SSD Guru software tool not only enables users to do routine monitoring and maintenance, but truly helps them unlock their SSD’s full potential.
Designed to power today’s high-end consumer systems, the Vector 180 series is optimized for hardcore gaming and data-intensive applications thanks to its powerful OCZ Barefoot 3 controller and in-house Toshiba A19nm MLC NAND flash technology. New to this particular Vector release is an advanced reliability protection feature called Power Failure Management Plus (PFM+). In the event of unexpected system power loss or instability, the PFM+ feature helps safeguard the SSD and its at-rest data.
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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced a high-performance mobile memory storage based on Embedded MultiMediaCard (eMMC) 5.0 technology. The new 128-gigabyte (GB), 3-bit NAND-based eMMC 5.0 storage is targeted at the smartphone and tablet mass markets.
“With the introduction of our value-focused, 3-bit NAND-based eMMC 5.0 line-up, we expect to take the lead in the expansion of high-density mobile storage,” said Dr. Jung-Bae Lee, Senior Vice President of Memory Product Planning and Application Engineering Team, Samsung Electronics. “We are continuing to enhance our next-generation embedded mobile memory offerings with improved performance and higher densities to meet increasing customer demand across the mobile industry.”
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