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Micron Technology, Inc., and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.
This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity1 than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.
Planar NAND flash memory is nearing its practical scaling limits, posing significant challenges for the memory industry. 3D NAND technology is poised to make a dramatic impact by keeping flash storage solutions aligned with Moore's Law, the trajectory for continued performance gains and cost savings, driving more widespread use of flash storage.
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OCZ Storage Solutions -- a Toshiba Group Company and leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced a new series of SATA III SSDs to add to its Intrepid 3000 enterprise portfolio. The new Intrepid 3700 SSD Series delivers superior performance and I/O latency responses that dramatically improve application performance and I/O efficiencies, and supports higher storage densities up to 2TB representing OCZ’s largest capacity enterprise SATA SSDs to date.
“Datacenter customers have asked for larger solid state drives that do not make any sacrifices in performance or endurance to address the need to manage the ever growing amounts of data being generated by today’s computing environments,” said Daryl Lang, CTO at OCZ Storage Solutions. “Our new Intrepid 3700 Series is designed to meet these market requirements for an easy to deploy solid state solution that delivers the very best balance of features, endurance, and capacity.”
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SanDisk Corporation, a global leader in flash storage solutions, today announced that it has successfully developed its 48 layer second generation 3D NAND, also referred to as BiCS2. Pilot production will commence as planned in the second half of 2015 in the Yokkaichi joint venture facility, with meaningful commercial production targeted for 2016.
“We are very pleased to announce our second generation 3D NAND, which is a 48 layer architecture developed with our partner Toshiba,” said Dr. Siva Sivaram, executive vice president, memory technology, SanDisk. “We utilized our first generation 3D NAND technology as a learning vehicle, enabling us to develop our commercial second generation 3D NAND, which we believe will deliver compelling storage solutions for our customers.”
SanDisk plans to use the second generation 3D NAND technology across a broad range of solutions, from removable products to enterprise SSDs.
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Toshiba Corporatio today announced development of the world’s first 48-layer three dimensional stacked cell structure flash memory called BiCS, a 2-bit-per-cell 128-gigabit (16 gigabytes) device. Sample shipments of products using the new process technology start today.
The BiCS is based on a leading-edge 48-layer stacking process, which enhances the reliability of write/erase endurance and boosts write speed, and is suited for use in diverse applications, primarily solid state drives (SSD).
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HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the HyperX Predator PCIe SSD. Shipping immediately, HyperX Predator PCIe SSD is the highest-end SSD with the fastest speeds in the HyperX lineup.
HyperX Predator PCIe SSD offers large capacities (240GB, 480GB) and incredible speeds to take systems to the edge. Faster than SATA-based SSDs, the PCIe generation 2.0 x4 interface delivers speeds up to 1400MB/s read and 1000MB/s write for ultra-responsive multitasking and an overall faster system. It is powered by the Marvell 88SS9293 controller.
The M.2 form factor ensures next-generation platform support with an M.2 PCIe slot. An optional half-height, half-length (HHHL) adapter is also available for many existing motherboards without an M.2 socket. The HHHL adapter comes with both standard and low-profile brackets to fit in slim profile desktop builds.
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