ADATA Launches LEGEND 970 PCIe Gen5 SSD
As processors and chipsets move into a new generation, many motherboard manufacturers have launched latest-generation motherboards that have allowed the consumer market to embrace a new generation of PCIe 5.0 Solid-State Drives (SSD). ADATA Technology Co., Ltd., the world's leading memory brand, today launched its LEGEND 970 SSD. The LEGEND 970 can reach maximum sequential read/write speeds of 10,000/10,000MB per second. Its most unique feature is a double-layer aluminum alloy heatsink with built-in micro-fan and surface crystallization that forms a patented active air-cooling system. The surface crystallization improves thermal conductivity, significantly reducing temperatures by 10% compared with fanless heatsinks to maintain stable performance during extended high-speed operation. The LEGEND 970’s R&D, design, and superior cooling mechanism will be the benchmark of a new generation of storage products and it is expected to become the most influential PCIe Gen5 storage solution in the consumer market.
Patent SSD design for robust cooling
ADATA ushers in a new era with its patented heat dissipation solution! From market consensus, it has become commonly accepted that active cooling is required for timely heat dissipation during high-speed PCIe 5.0 data transmission to ensure high temperatures do not affect reading and writing or slow down the system. The LEGEND 970 adopts a double-layer extruded aluminum heatsink design which features dense air ducts to divert hot and cold air. When heat is conducted upward, the rotation of the built-in micro fan circulates the confluence of hot and cold air and quickly expels exhaust heat from both ends of the extruded aluminum fins. At the same time, the LEGEND 970 increases heat dissipation through the addition of "surface crystallization" on the aluminum heatsink surface, increasing overall air contact area and maximizing the heat dissipation efficiency of its air cooling system. This unique "active heat dissipation" design significantly reduces temperatures by 10% compared to fanless heatsinks. More importantly, it can withstand high temperature stress tests and maintain stable performance even after long-term high-speed operation.