Toshiba America Electronic Components, Inc., (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of a class of e-MMC embedded NAND flash memory products that are among the world's smallest. The new products integrate NAND chips fabricated with Toshiba's cutting-edge 15nm process technology and a controller to manage basic control functions for NAND applications into a single package.
Fully compliant with the latest JEDEC e-MMC standard, the new chips are designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and wearable devices. Sample shipment of the 16 gigabyte (GB) products begins today, with 8GB, 32GB, 64GB, and 128GB products to follow.
By utilizing the 15nm process technology, the new product's package size is approximately 26 percent smaller than comparable Toshiba products and offers faster read/write performance due to improvements in basic chip performance and controller optimization. The read speed is approximately eight percent faster (max.), while the write speed is approximately 20 percent faster (max.).
"With the introduction of 15nm-based e-MMC, Toshiba continues to demonstrate its leadership in NAND Flash and embedded memory solutions targeting mobile and wearable devices," noted Scott Beekman, director of managed NAND memory products for TAEC. "The small 11mm x 10mm package, supporting a wide range of densities, is well-suited for increasingly space limited applications."
Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products.
Key Features
- The JEDEC e-MMC compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products. Additionally, new features among them BKOPS control, Cache Barrier, Cache Flushing Report, and Large RPMB Write, are applied to the new products to enhance usability.
- The 8GB to 64GB products are sealed in a small FBGA package measuring just 11mm x 10mm and are suitable for smartphones, tablet PCs and wearable devices where miniaturization and weight saving are a requirement.
- Embedded in a system, the 128GB products can record up to 16.3 hours of full spec high definition video and 39.7 hours of standard definition video.
