Micron Technology, Inc., today announced it has begun volume shipments of the world's first 176-layer QLC NAND SSD. Built with the most advanced NAND architecture, Micron’s 176-layer QLC NAND delivers the industry’s leading storage density and optimized performance for a broad range of data-rich applications. Designed for use cases spanning client and data center environments, Micron’s transformative new NAND technology is now available with the introduction of the Micron 2400 SSD, the world’s first 176-layer PCIe Gen4 QLC SSD for client applications. The new 176-layer QLC NAND will also be incorporated into select Micron Crucial consumer SSDs, and available as a component for system designers.
Micron’s groundbreaking 176-layer QLC NAND provides a layer count and density unprecedented in QLC NAND flash and follows Micron’s delivery of the industry’s first 176-layer TLC NAND. Additionally, Micron’s 176-layer QLC NAND enables 33% higher I/O speed1 and 24% lower read latency2 than Micron’s prior generation solution. Its replacement-gate architecture is the only mass production QLC flash storage that combines charge trap with a CMOS-under-array design. These improvements are driving adoption of QLC SSDs in the client PC market, which is expected to triple QLC adoption by 2023, exceeding 35%, and reaching nearly 80% bit share in 2025.
"Micron’s 2400 SSD builds upon our 176-layer NAND industry leadership to drive the transition to QLC-based storage for the client market,” said Jeremy Werner, corporate vice president and general manager of Micron’s Storage Business Unit. “Furthering our market leadership, we expect the new 2400 PCIe Gen4 SSD will significantly accelerate the adoption of QLC in client devices as it enables broader design options and more affordable capacity."