Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announces the release of Kingston FURY Impact DDR5 SODIMMs. Perfect for the gamer or PC enthusiast who want the latest cutting-edge performance from their laptop or small form factor machine.

Kingston FURY Impact DDR5 is fifty percent faster than DDR4 to provide a boost in gaming, rendering, and multitasking, while its low power consumption and increased efficiency keeps your system cool at 1.1V. Available in Intel® XMP 3.0 Certified SODIMM kit capacities up to 64GB, Kingston FURY Impact DDR5 packs all the enhanced features of DDR5 into a slim, compact form factor. With innovative Plug N Play overclocking technology and on-die ECC, it automatically supports 4800MT/s at lower latencies than standard DDR5-4800. Thus, improving system performance without having to enable a profile and maintains data integrity while hitting extreme speeds.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces a very exciting addition to its SSD family, the XPG ATOM 30 SSD Kit, which comes with a 1TB ATOM 30 PCIe Gen 3x4 SSD and 250GB SU670 SATA III SSD, makes it easy to upgrade both the home and office computer. That’s two SSDs in one value filled pack!

ATOM 30 PCIe Gen 3x4 M.2 2280 Solid State Drive
The ATOM 30 utilizes PCIe Gen3 x4 and NVMe 1.3 to deliver sustained read and write speeds of up to 2,500/2,000 MB per second. Its M.2 2280 specification supports the latest Intel and AMD platforms, including desktop PCs and laptops. It is equipped with SLC caching and HMB technology (Host Memory Buffer) for seamless productivity. Its maximum 4K random read/write is up to 180K/200K IOPS for effortless multitasking.

Continuing to lead the way forward for UFS technology, KIOXIA America, Inc. today announced sampling of the industry’s first Universal Flash Storage (UFS) embedded flash memory devices supporting MIPI M-PHY® v5.0. The new lineup utilizes the company’s BiCS FLASH™ 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB. The new devices deliver high speed read and write performance and are targeted to a variety of mobile applications, including leading-edge smartphones.

The new KIOXIA devices are next-generation UFS (MIPI M-PHY 5.0), which has a theoretical interface speed of up to 23.2Gbps per lane (x2 lanes = 46.4Gpbs) in HS-GEAR5 mode. Sequential read and write performance of the 256GB device is improved by approximately 90 percent and 70 percent, respectively, over previous generation devices. Also, random read and write performance of the 256GB device is improved by approximately 35 percent and 60 percent, respectively, over previous generation devices. This next generation of UFS provides significant increases in performance, enabling next-generation smartphones and other products to enhance their capabilities and end user experiences in the 5G era and beyond.

TerraMaster, a professional brand that specializes in providing innovative storage products for home, businesses and enterprises, updates the TOS 5 system with a new User Interface (UI) design making it 300% more responsive compared to the previous version. The updated lighter and smoother TOS 5 with new UI offers easier and improved user experience.

The new TerraMaster TOS 5 system with redesigned UI will be available for global beta testing in March 2022.

New TOS 5 Features

300% Response Time Improvement
Aside from the redesigned UI, the updated TOS 5 system features a new caching technology that will speed up data transfer between server and database. This resulted in a significant improvement in response time by up to 300% compared to the previous version.

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announced that its Premier Extreme SDXC SD7.0 Express Card, equipped with an SMI SM2708AB controller, is the world’s first branded SD Express Card to pass SD Association’s SD Express Verification Program (SVP). This verification status affirms that the SD Express Card meets SDA’s rigorous interface standards for performance and reliability. The Premier Extreme SDXC Express Card will allow users to take full advantage of the latest SD Express-enabled laptops from all the major PC brands.

“Due to their compact form factors, SD cards have been and continue to be a mainstay of creators, creative professionals, and general users despite their lesser capabilities when compared to other storage devices,” said Ibsen Chen, Director of Product Marketing at ADATA. “However, with the SVP verified ADATA Premier Extreme SDXC SD7.0 Express Card, we are giving users an SD Card that meets the standards of a modern world where high-quality content and fast data transfer rates are the norms.”

Leading memory provider TEAMGROUP has released a variety of DDR5 memory and applied its advanced R&D capabilities to conduct Intel XMP3.0 certification testing for its next-gen memory modules. After rigorous testing of ASRock, ASUS, Biostar, GIGABYTE and MSI motherboards with Intel processors, TEAMGROUP announced today that all of its T-FORCE DDR5 gaming memory have received Intel XMP3.0 certification, ensuring that gamers can enhance the performance of their processors using T-FORCE's overclockable DDR5 memory. With just an easy single click, users will be able to fully experience the incredible performance of T-FORCE gaming memory with XMP's easy-to-use overclocking profiles.

TEAMGROUP's DDR5 product series strictly uses high-quality, specially selected ICs to provide gamers with stable and compatible memory. Its T-FORCE overclocking memory modules have all passed XMP3.0 certification tests, including frequencies of 4,800MHz, 5,200MHz, 6,000MHz, 6,200MHz and 6,400MHz, making T-FORCE the DDR5 memory brand with the most specification variety under Intel’s XMP3.0 certifications. To meet the demand for high-frequency, low-latency overclocking, TEAMGROUP created a proprietary DDR5 thermal module that enables T-FORCE DDR5 memory to operate smoothly and stably when overclocked to its very limits.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today released the flagship dual-CPU, NVMe all-flash storage TDS-h2489FU. Powered by Intel® Xeon® Silver 4300 processors (16 or 32 Cores) and featuring twenty-four U.2 NVMe Gen 4 x4 SSD bays, the TDS-h2489FU provides over 1 million iSCSI 4K random read IOPS with ultra-low latency. Besides exceptional hardware and connectivity (including two 25GbE SFP28 ports, four 2.5GbE RJ45 LAN ports, two PCIe Gen 4 slots, and 1200W redundant power supplies) the TDS-h2489FU uses the ZFS-based QuTS hero operating system that provides powerful data reduction and SSD optimization tools, maximizing all-flash investments for HPC, virtualization, file servers, and 4K/8K multimedia applications.

“The all-flash TDS-h2489FU drives high I/O performance and low latency with server-grade Xeon processors and U.2 NVMe Gen 4 x4 storage”, said Jason Hsu, Product Manager of QNAP, adding “capable of empowering mission-critical, latency-sensitive workloads out-of-the-box, with flexible PCIe Gen 4 expansion, the TDS-h2489FU can be further configured to meet extended mix-use applications and data transfer needs.”