Transcend Information, Inc. (Transcend), a leading manufacturer of embedded memory products, has recently introduced a whole series of 112-layer 3D NAND solid-state drives featuring wide-temperature tolerance, operating stably from -40°C to 85°C and demonstrating remarkable endurance. The form factors include 2.5", M.2, and mSATA types, suitable for embedded devices, vehicle systems, and slim servers. With up to 4TB capacity, this rugged solution overcomes the challenges of extreme industrial environments, empowering applications in smart factories, modern infrastructures, and surveillance in the IoT era.

Transcend utilizes 112-layer 3D NAND flash to build wide-temp SSDs, which support the mainstream SATA III interface and the high-speed PCIe interface. With up to 4TB capacity, proven performance is delivered between -40°C and 85°C thanks to an in-house sorting process and rigorous temperature tests which ensure the SSDs can adapt to rapid temperature change and thermal shock. Meanwhile, anti-sulfur technology, Corner Bond, and 30µ” gold fingers are incorporated to enhance key component protection and effectively prolong SSD lifespan. All these features create higher reliability for demanding applications like roadside monitoring systems which are exposed to long hours of high temperatures, or industrial computers that have to ensure non-stop high-speed operation.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers and solid-state storage devices today announces MonTitan, a PCIe Gen5 SSD solution platform perfectly suited for the most challenging Datacenter and Enterprise applications.

Silicon Motion's new MonTitan platform features an entirely new, purpose-built ASIC and FW architecture, optimized for performance and QoS. Its unique Layered FW stack enables the development of customer differentiated solutions with a high degree of flexibility and accelerated time to market, all while reducing engineering cost.

With the rise of high-performance computing (HPC), the demand for industrial product cooling has increased dramatically due to higher power requirements and heat generation in demanding industrial applications and platforms. In response, TEAMGROUP has adopted the VC (Vapor Chamber) liquid cooling technology, commonly for mobile devices, and introduced the industry's first M.2 SSD VC liquid cooling technology. The VC liquid cooling tube was redesigned from the ground up for PCIe M.2 SSD applications based on the high-speed transfer rates and heat generation patterns of high-speed PCIe M.2 SSD. The result is a liquid-cooled PCIe M.2 SSD with outstanding thermal performance that can sustain high-speed operation in harsh and dynamic industrial environments.

TEAMGROUP's N74V-M80 is an industrial grade VC Cooling M.2 SSD that utilizes proprietary liquid cooling technology (Taiwan Utility Model Patent : M626519). Through the specially designed VC liquid cooling tubes, cooling fluid is pumped to the heat zone of PCIe M.2 SSD controller. Heat is then transferred to the aluminum fin heat sink with a convective design via gas-liquid phase transition to enhance thermal performance. The N74V-M80 combines the functions of heat absorption, conduction, and dissipation to better transfer and regulate thermal energy. TEAMGROUP's industrial control T.R.U.S.T. technology ("T" for Temperature) ensures that its PCIe M.2 SSD products maintain excellent transfer performance over a wide temperature range of -40°C (-40°F) to 85°C (185°F). In addition, the TEAMGROUP N74V-M80 uses TLC Flash and supports the PCIe Gen3x4 interface and NVMe1.3 standard, providing write and read speeds of up to 3,400 and 2,500MB/s, respectively, and is suitable for industrial-grade HPC devices with adequate installation space. It can fully meet the high-speed computing needs while keeping it cool and energy-saving.

Micron Technology, Inc., today announced that it has begun volume production of the world’s first 232-layer NAND, built with industry-leading innovations to drive unprecedented performance for storage solutions. It features the industry’s highest areal density and delivers higher capacity and improved energy efficiency over previous generations of Micron NAND, to enable best-in-class support of the most data-intensive use cases from client to cloud.

“Micron’s 232-layer NAND is a watershed moment for storage innovation as first proof of the capability to scale 3D NAND to more than 200 layers in production,” said Scott DeBoer, executive vice president of technology and products at Micron. “This groundbreaking technology required extensive innovation, including advanced process capabilities to create high aspect ratio structures, novel materials advancements and leading-edge design enhancements that build on our market-leading 176-layer NAND technology.”

In another move that delivers next-generation levels of performance to enterprise data centers, Kioxia Corporation today announced that its KIOXIA CM7 series enterprise NVMe™ SSDs are now shipping to select customers. Optimized for the needs of high-performance, highly efficient servers and storage, the KIOXIA CM7 series family is designed with PCIe 5.0 technology in Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S and 2.5-inch form factors.

Having introduced the industry’s first EDSFF drives designed with PCIe 5.0 technology last year, the addition of the KIOXIA CM7 series family expands KIOXIA’s leadership position and allows OEM customers to deliver best-in-class sequential read 14 GB/s performance to end users.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully developed a second generation of its pioneering SmartSSD.

The new proprietary computational storage incorporates data processing functionality within a high-performance SSD. Unlike existing SSDs, Samsung’s SmartSSD can process data directly, thereby minimizing data transfers between the CPU, GPU and RAM. This technology can avoid the bottlenecks that often occur when moving data between storage devices and CPUs, resulting in markedly improved system performance and much higher energy efficiency.

The SmartSSD is playing an increasingly important role, especially with the growth of next-generation technologies such as AI, machine learning and 5G/6G, which require large amounts of data processing.

When it comes to data, everything is growing – quantity, size, format, resolution, use cases, applications, value and more. As people and businesses look for solutions to effectively and efficiently store their data in the zettabyte era, Western Digital® HDDs continue to play a critical role in delivering massive capacity, performance and reliability.

Extending its innovation and technology leadership across its portfolio, Western Digital today announced that it is now shipping new 22TB HDDs targeting three key segments: WD Gold™ HDDs for IT/data center channel customers; WD Red™ Pro for network attached storage (NAS); and WD Purple™ Pro for smart video/surveillance. As highlighted in its What's Next Western Digital Event, these new drives are loaded with industry-firsts, including OptiNAND™ technology, energy-assisted PMR (ePMR), triple-stage actuator (TSA) and HelioSeal® to deliver the industry's highest areal density at 2.2TB per platter, delivering 22TB CMR HDDs for its customers.

"We are thrilled to reach this milestone as HDDs are complex and sophisticated systems," said Ravi Pendekanti, senior vice president of product management and marketing, HDD Business Unit at Western Digital. "From the cloud to the edge, Western Digital's hard drives play a vital role in storing, protecting, capturing and analyzing data that's shaping nearly every aspect of our digital lives. Our technology leadership and expanded portfolio of industry-leading HDDs provide us with a tremendous opportunity to deliver value to our customers today and well into the future."