Samsung Electronics Starts Mass Production Of Industry's First 3-bit 3D V-NAND Flash Memory
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 3-bit multi-level-cell (MLC) three-dimensional (3D) Vertical NAND (V-NAND) flash memory, for use in solid state drives (SSDs).
“With the addition of a whole new line of high density SSDs that is both performance- and value-driven, we believe the 3-bit V-NAND will accelerate the transition of data storage devices from hard disk drives to SSDs,” said Jaesoo Han, Senior Vice President, Memory Sales & Marketing, Samsung Electronics. “The wider variety of SSDs will increase our product competitiveness as we further expand our rapidly growing SSD business.”
The 3-bit V-NAND is Samsung’s latest second generation V-NAND device, which utilizes 32 vertically stacked cell layers per NAND memory chip. Each chip provides 128 gigabits (Gb) of memory storage.
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