Toshiba Introduces XG6 Series NVMe SSDs With 96-Layer 3D Flash Memory
Today Toshiba Memory America, Inc., the U.S.-based subsidiary of Toshiba Memory Corporation, has introduced a new lineup of solid state drives (SSDs) that are based on its 96-layer, BiCS FLASH™ 3D flash memory. The first SSD to use this breakthrough technology, the new XG6 series is targeted to the client PC, high-performance mobile, embedded, and gaming segments – as well as data center environments for boot drives in servers, caching and logging, and commodity storage.
As the inventor of flash memory and the first to introduce the concept of 3D flash memory, Toshiba Memory is driven to continually push the boundaries of what is possible – and move the technology forward. Its 3-bit-per-cell (triple-level cell, TLC) BiCS FLASH technology improves the performance, density and efficiency of SSDs. And its innovative 96-layer stacking process combines with advanced circuit and manufacturing technology to achieve a capacity increase of approximately 40 percent per unit chip size over 64-layer 3D flash memory.
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