Toshiba Unveils 1TB Single Package NVMe SSD With 96-Layer 3D Flash Memory
Today at CES 2019, Toshiba Memory America, Inc., the U.S.-based subsidiary of Toshiba Memory Corporation, will introduce the fourth generation of its single package ball grid array (BGA) solid state drive (SSD) product line: the BG4 series. Toshiba Memory’s new lineup of ultra-compact NVMe SSDs places both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and server boot in data centers.
“The BGA form factor SSD enables larger amounts of flash to be added to smaller and thinner devices and extends battery life to improve the mobile experience,” said Jeff Janukowicz, research vice president, Solid State Drives and Enabling Technologies at IDC. “NVMe BGA solutions, such as the new Toshiba BG4 series, provide OEMs with a better-than-SATA storage option that boosts demand for client SSD units. In fact, we expect this demand to increase at a 2017-2022 CAGR of 14 percent.”
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