TEAMGROUP To Showcase New Memory And Storage Products At COMPUTEX 2024
Team Group Inc., the world's leading provider of premium storage solutions, returns to COMPUTEX 2024 with the theme "Elevate Gaming, Empower AI." Drawing on years of extensive product development expertise, the global memory leader unveils next-generation, high-specification storage solutions that meet diverse market needs with world-class performance. Throughout COMPUTEX (June 4th-7th), TEAMGROUP will showcase a range of flagship products, including high-specification memory, high-efficiency cooling solutions, large-capacity storage devices, and cutting-edge innovations for industrial automation. This year, with a special focus on the global AI revolution, TEAMGROUP will introduce high-specification PC/NB-compatible products with AI complementarity and solutions that facilitate the rapid development of Edge AI applications, showcasing its sophisticated R&D capabilities. Starting on June 4th, TEAMGROUP (Booth I 0118) is going to hold a booth at the Taipei Nangang Exhibition Center, where a perfect blend of next-generation technologies will be presented to ignite intelligent evolution.
T-FORCE XTREEM DDR5 Fuji White/Diamond Rose OC Desktop Memory Module
TEAMGROUP's gaming brand, T-FORCE, provides gamers around the world with the highest quality and most diverse high-end gaming memory solutions. The T-FORCE XTREEM DDR5 Memory Module reaches new heights this year with an exclusive overclocking performance that unlocks frequencies up to 10,000 MHz, pushing the limits to dominate gaming performance. At COMPUTEX 2024, T-FORCE XTREEM DDR5 Memory Module Fuji White and Diamond Rose colors will make their global debut, designed to meet the personal preferences and setup needs of gamers. T-FORCE XTREEM DDR5 Memory Module features 2 mm thick aluminum alloy fin heat sinks to enhance its thermal capacity, coupled with special heat-conductive silicon to firmly adhere the heat sinks to the memory for optimal heat dissipation. T-FORCE XTREEM DDR5 's two-piece heat spreader is made of solid metal and sandblasted surface treatment, accentuated by the iconic T-FORCE logo badge, exuding confidence, style, and the essence of overclocking prowess.
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