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KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) announced another significant technological contribution to cloud data center infrastructures. Today, the company expanded its broad portfolio of client, enterprise and data center SSDs with the addition of the XD6 Series. KIOXIA’s E1.S form factor XD6 SSDs are the first Enterprise and Datacenter SSD Form Factor (EDSFF) E1.S SSDs to address the specific requirements of hyperscale applications, including the performance, power and thermal requirements of the Open Compute Platform (OCP) NVMe Cloud SSD Specification.
Designed to maximize system density, efficiency and simplicity, KIOXIA’s EDSFF E1.x SSDs represent the future of flash storage for servers in cloud and hyperscale data centers. As defined by the EDSFF consortium and leveraging the OCP NVMe Cloud SSD Specification, the flexible, efficient, small form factor E1.S replaces the M.2 form factor and delivers greater density, performance, reliability, and thermal management. E1.S is also designed to be hot pluggable for increased serviceability, which is another benefit over M.2.
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iStorage, the award-winning and trusted global leader of hardware encrypted data storage and cloud encryption devices, is proud to announce the launch of the diskAshur M2. The diskAshur M2 is iStorage's smallest, lightest, fastest and most rugged FIPS compliant encrypted portable SSD and includes connectivity for both USB type A and C ports.
The new diskAshur M2 SSD encrypts data using FIPS PUB 197 validated, AES-XTS 256-bit hardware encryption and uniquely incorporates a Common Criteria EAL4+ ready secure microprocessor, which employs built-in physical protection mechanisms designed to defend against external tamper, bypass physical attacks and more.
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Greenliant has started sampling its DRAM-less NVMe M.2 2280 ArmourDrive solid state drive (SSD) modules to customers requiring data storage with fast access speeds, while using less power than other PCIe-interface SSDs. The new 88 PX Series NVMe M.2 2280 ArmourDrive SSDs use high-quality, industrial 3-bit-per-cell (TLC) 3D NAND flash memory and support a broad range of capacities from 128GB to 2TB.
Forward Insights predicts that the NVMe PCIe SSD market will grow from $10.5B in 2019 to $29.2B in 2024. To address this demand and diverse customer requirements, Greenliant has expanded its NVMe M.2 ArmourDrive portfolio to offer 2280 form factor SSDs both with and without on-board DRAM. The DRAM-less NVMe M.2 2280 ArmourDrive products support the PCIe Gen3x4 interface and can reach up to 2,500/2,100 MB/s sequential read/write performance. Available in commercial (0 to +70 degrees Celsius) or industrial (-40 to +85 degrees Celsius) temperature, DRAM-less NVMe M.2 2280 ArmourDrive SSDs provide high reliability and low latency to a wide variety of applications, including industrial automation, cloud computing, security, networking, broadcasting and transportation.
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OWC, the premier zero-emissions Mac and PC technology company, and a respected provider of Memory, External Drives, SSDs, Mac & PC docking solutions, and performance upgrade kits, announces the new OWC Envoy Pro Elektron USB-C Bus-Powered SSD. This new portable drive puts pro-grade speeds, dust and waterproof ruggedness, and universal compatibility in the palm of your hand.
The OWC Envoy Pro Elektron is the fastest, toughest mini-sized SSD in the universe. Pocket-sized tiny, this USB-C bus-powered drive is crushproof, dustproof, and waterproof for editing/saving personal and work files anywhere at up to 1011MB/s real-world speed. That's like transferring 91 high res photos per second or a 5GB movie in less than five seconds. The sleek, cool running aircraft-grade aluminum storage solution with drive status LED operates silently without a power adapter. With the included USB-C cable and Type-A adapter, the OWC Envoy Pro Elektron is plug and play compatible with Macs or PCs produced over the last decade, current models, and well into the future; as well as iPad Pro and Chromebook tablets.
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Lexar, a leading global brand of flash memory solutions, today announced the Lexar Professional 1066x microSDHC/microSDXC Cards SILVER Series.
Designed for your action cameras, drones, and Android smartphones, the Lexar Professional 1066x microSD UHS-I Card SILVER Series lets you quickly capture and transfer high-quality photos, including Full-HD and 4K UHD video with speeds up to 160MB/s read, and up to 120MB/s write. The card is U3, V30 and A2 rated for high-speed performance. This card gives you the speed and storage you need to capture more adventures on the go.
Capture high-quality images and extended lengths of Full-HD and 4K UHD video with write speeds up to 120MB/s. This card is Class 10, UHS Speed Class 3 (U3) and Video Speed Class 30 (V30) giving you the performance you need to shoot faster and longer.
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Kioxia Corporation, the world leader in memory solutions, today announced it will begin construction of a state-of-the-art fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D Flash memory BiCS FLASH. The construction of Kioxia Corporation’s Fab7 facility is expected to commence in the spring of 2021.
Due to technological innovation, the amount of data being generated, stored and used around the world has increased exponentially. Furthermore, the flash memory market expects further growth driven by cloud services, 5G, IoT, AI and automated driving. As a result, the production of cutting-edge products in Kioxia Corporation’s Fab7 facility will continue to meet the increasing demand for memory around the world.
The Fab7 facility will be built on the north side of Yokkaichi Plant, where land development is underway. In order to secure optimal production of advanced flash memory products, the construction of Fab7 will be divided into two phases, with the first phase of construction scheduled to be completed by the spring of 2022. Kioxia plans to fund the capital investments for the construction of Fab7 from its operating cash flow.
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Toshiba America Electronic Components, Inc. (TAEC) announces the Toshiba MG08-D Series HDDs, designed for a wide variety of business-critical applications, such as email and CRM (Customer Resource Management), data analysis for business intelligence, small-medium business servers, and data-retention and compliance archiving.
Toshiba’s 7th generation air mechanical design provides better power efficiency and a lower component count to deliver better total cost of ownership than its earlier generation models. The new series features 4TB, 6TB and 8TB models, in both SATA and SAS interfaces. The new 4TB models are available in 512e, 4Kn and 512n sector models, and the 6TB and 8TB models are available in 512e and 4Kn sector models, assuring plug-and-play interoperability for applications using prior 4TB models.
“Toshiba’s new MG08-D Series delivers new levels of reliability and power efficiency to enterprise and business-critical server and storage platforms,” said Scott Wright, Director of HDD Marketing for Toshiba America Electronic Components, Inc. “Toshiba’s 7th generation conventional mechanical design utilizes Conventional Magnetic Recording technology to deliver plug-and-play versatility that is compatible with the widest range of applications and operating system environments.”
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- Network Storage
QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today introduced the lightning-fast NVMe all-flash TS-h2490FU. With 24 drive bays for U.2 NVMe Gen 3 x4 SSD, the TS-h2490FU provides up to 472K/205K iSCSI 4K random read/write IOPS with ultra-low latency. Equipped with four 25GbE SFP28 and two 2.5GbE RJ45 LAN ports, five PCIe Gen 4 slots, and 1100W redundant power supplies, the TS-h2490FU provides exceptional hardware and connectivity. The ZFS-based QuTS hero operating system also includes powerful applications for data reduction and SSD optimization, ensuring that SSD performance and lifespan is maximized for mission-critical virtualized workloads and data centers with all-flash investments.
“NVMe revolutionizes storage I/O performance and connectivity for eliminating productivity bottlenecks in modern data centers,” said David Tsao, Product Manager of QNAP, adding “the U.2 NVMe all-flash TS-h2490FU is perfect for I/O-intensive and latency-sensitive applications, and leverages the many advantages of ZFS to multiply SSD performance advantages. After comprehensive evaluation, we also recommend Western Digital Ultrastar® DC SN640 NVMe Data Center SSDs for attaining outstanding performance and reliability with the TS-h2490FU.”
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TerraMaster, a professional brand that specializes in providing innovative storage products including network-attached storage (NAS) devices, launches the F4-210 1GB version, the same 4-bay NAS for personal cloud storage at a more affordable price. The TerraMaster F4-210 is just a portion of the price of an Intel-based NAS device. The F4-210 supports up to 108TB of storage and supports 3.5” SATA hard drives and 2.5” SATA hard drives and solid-state drives.
Cost-Effective Personal Cloud Storage Solution
The TerraMaster F4-210 is perfect for users that are looking for a powerful personal cloud storage solution without a hefty investment. Costing just half the price of an equivalent Intel x86 quad-core processor-based NAS storage, the F4-210 can deliver modest read/write speeds of up to 124MB/s with two WD Red 4TB hard drives in RAID 0. The F4-210 supports various private cloud services including Google Drive, Dropbox, and OneDrive.
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SK hynix and Intel today announced that they have signed an agreement on Oct. 20, Korea Standard Time, under which SK hynix would acquire Intel’s NAND memory and storage business for US $9 billion.
The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain its distinct Intel® Optane™ business.
SK hynix and Intel will endeavor to obtain required governmental approvals, expected in late 2021. Following receipt of these approvals, SK hynix will acquire from Intel the NAND SSD business (including NAND SSD-associated IP and employees), as well as the Dalian facility, with the first payment of US $7 billion. SK hynix will acquire from Intel the remaining assets, including IP related to the manufacture and design of NAND flash wafers, R&D employees and the Dalian fab workforce, upon a final closing expected to occur in March 2025 with the remaining payment of US $2 billion. Per the agreement, Intel will continue to manufacture NAND wafers at the Dalian Memory Manufacturing Facility and retain all IP related to the manufacture and design of NAND flash wafers until the final closing.
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