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- Network Storage
TerraMaster, a professional brand that specializes in providing innovative storage products for home, businesses and enterprises, introduces the F2-423 2-Bay NAS and F4-423 4-Bay NAS. The F2-423 and F4-423 high-performance NAS products are designed for small- and medium-sized businesses. Both deliver exceptional performance with its faster quad-core processor and larger memory support compared to the previous generation F2-422 and F4-422 NAS.
The TerraMaster F2-423 and F4-423 NAS devices are equipped with an Intel Celeron N5105/N5095 quad-core processor with a maximum burst frequency of 2.9GHz. Both are equipped with 4GB DDR4 SODIMM memory, expandable up to 32GB memory (2x 16GB). The F2-423 and F4-423 supports 20TB HDDs, supporting up to 40TB (2x 20TB) and 80TB (4x 20TB) of maximum internal raw storage capacity respectively. Both NAS units also comes with two M.2 NVMe PCIe 3.0 slots that support NVMe SSDs for SSD caching or for M.2 Wi-Fi modules.
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- Flash Memory
SMART Modular Technologies, Inc. (“SMART”), a division of SGH and a global leader in memory solutions, solid-state drives, and hybrid storage products, announces its new SMART Kestral™ PCIe Optane™ Memory Add-in-Card (AIC), which is able to add up to 2TB of Optane Memory expansion on a PCIe-Gen4-x16 or PCIe-Gen3-x16 interface independent of the motherboard CPU. SMART’s Kestral AICs accelerate selected algorithms by offloading software-defined storage functions from the host CPU to the Intel FPGA on the AIC.
SMART’s Kestral memory AICs are ideal for hyperscale, data center, and other similar environments that run large memory applications, and would benefit from memory acceleration or system acceleration through computational storage.
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- Flash Memory
ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces the ADATA SE880 external solid state drive (SSD). This latest external SSD from ADATA supports USB 3.2 Gen2 x2, is equipped with a Type-C port, and delivers read performance of up to 2000 MB/s. This is all packed into an ultra-compact form factor that is smaller than an AirPods case. These attributes make it perfect for content creators and console gamers on the go.
Speed Ahead with USB 3.2 Gen2 x2
The SE880 supports USB 3.2 Gen2 x2 and is capable of delivering transmission speeds of 20 Gb/s. This is two times faster than USB 3.2 Gen 2x1 and four times faster than USB 3.2 Gen 1x1. This allows the SE880 to achieve read/Write speeds of up to 2000MB/s, which is roughly twenty times faster than ordinary external hard drives. This incredible speed offers the ultimate convenience for creators, allowing them to access and edit large files directly on the SE880, doing away with the need to transfer files onto their PC beforehand. The SE880 comes in 500GB and 1TB variants.
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- Network Storage
QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today introduced the 2-bay HS-264 Silent NAS powered by an Intel® Celeron® N5105 quad-core processor. Featuring dual-port 2.5GbE networking, dual 4K HDMI output, 4K media streaming/transcoding, and install-on-demand apps, the HS-264 pairs NAS functionality with a multimedia-focused experience.
The HS-264 supports two 2.5-inch/3.5-inch SATA 6Gbps hard drives or SSDs and has 8 GB memory (not expandable). With two 2.5 Gigabit (2.5G/1G/100M) ports, the HS-264 has huge bandwidth potential for high-speed backup, sharing and streaming - supporting up to 5Gbps under port trunking. Two HDMI output and two USB 3.2 Gen 2 Type-A ports allow connecting to multiple audio/video devices or expansion units, while Intel® AES-NI hardware-accelerated encryption ensures the confidentiality of files and data without impacting system performance.
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Elgato, a leading provider of hardware and software for content creators, today announced the launch of HD60 X, a powerful new external capture card. Sporting state-of-the-art specs and seamless compatibility with the newest generation of game consoles, HD60 X equips anyone to stream and record their gameplay in the highest quality without limitations.
Building on the acclaimed HD60 S+, HD60 X features all-new architecture with rear ports to keep cables out of sight. The palm-sized, plug-and-play device connects to a console and sends video to both a gaming display and PC. You can then play high-fidelity games while livestreaming to Twitch or YouTube in Full HD 1080p60 quality, while simultaneously recording 1080p60 HDR10 footage to your hard drive. Instant Gameview technology syncs your broadcast with your gameplay, allowing you to monitor your capture feed with ultra-low latency.
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- Flash Memory
MSI is launching a new blazing fast model to its SSD product line – SPATIUM M480 PCIe 4.0 NVMe M.2 PLAY, exceeding all performance requirements for PlayStation 5 use. MSI SSDs enhances our company’s identity as a high-performance PC brand by expanding our ecosystem and covering the high-performance storage category. These SSDs are built with high-quality, high-density 3D NAND flash that delivers great performance with up to 7000MB/sec read. On SPATIUM M480 PLAY, the sleek dual finish aluminum heatsink is designed to fit the PlayStation 5. This improves heat-dissipation to sustain transfer speeds across all platforms for professionals, content creators, and gamers. Other performance-improving technologies include DRAM cache buffer and an SLC cache.
SPATIUM M480 PLAY – EXPANDING THE GAME LIBRARY ON PlayStation 5.
SPATIUM M480 PLAY is the optimal product made for console gaming in the SPATIUM lineup with four storage capacities – 500GB, 1TB, 2TB, and 4TB. This brings next-level storage performance to players for PlayStation 5, content creators, and PC gamers. Expanding the storage device on the PS5 is a simple upgrade that allows for lightning-fast save and load times for large game files.
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QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today unveiled the 2U short-depth rackmount TS-873AeU NAS series, including the TS-873AeU and TS-873AeU-RP, with high-performance and energy-efficient AMD Ryzen™ Embedded V1000 series V1500B 4-core/8-thread, 2.2GHz processors. The series is available in 8-bay models with single and redundant power supply options. The TS-873AeU series is suitable for tackling resource-demanding applications and tasks, such as virtual machines, intensive multi-user access, or hybrid cloud applications, making it a cost-efficient solution for businesses that depend on virtualization or VDI applications.
The 2U rackmount TS-873AeU series has a short depth design of only 11.7 inches (297.4 mm) for up to 38% reduction in size, making it an excellent choice for smaller racks, wall-mount AV rack cabinets, and network rack cabinets. Space saved by its short depth design can greatly benefit cabling or ventilation. The TS-873AeU series is ideal for flexible deployment and is especially suitable for installation in locations such as offices, audiovisual rooms, and for applications such as security surveillance recording.
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- Flash Memory
SMART Modular Technologies, Inc. (“SMART”), a division of SGH and a global leader in memory solutions, solid-state drive (SSD) and hybrid storage products announces the next generation of its DuraFlash™ ME2 family of SATA SSD products, which includes industry-standard M.2 2242, M.2 2280, mSATA, Slim SATA and 2.5” form factors. These SSDs are available in both industrial and commercial temperature grades and have versions that implement SMART’s SafeDATA™ power-loss, data-protection technology for graceful handling of power fluctuations and sudden power loss events.
The new ME2 SSDs incorporate the latest generation 3D NAND-technology and SMART Modular’s proprietary NVMSentry™ firmware to deliver high performance SSD products with endurance up to one drive writes per day (DWPD) for five years using JEDEC JESD219A enterprise endurance workload. The new NAND device offers better cost per bit over previous 64-layer and 96-layer NAND generations without sacrificing performance and reliability.
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- Flash Memory
Samsung Electronics and Western Digital today announced that they have signed a memorandum of understanding (MOU) for a unique collaboration to standardize and drive broad adoption of next-generation data placement, processing and fabrics (D2PF) storage technologies. The companies will initially focus on aligning their efforts and creating a vigorous ecosystem for Zoned Storage solutions. These steps will enable the industry to focus on countless applications that ultimately create greater value for customers.
This marks the first time that both Samsung and Western Digital have come together as technology leaders to create widespread alignment and stimulate awareness for important storage technologies. Focusing on enterprise and cloud applications, the partnership is expected to spur a range of collaborations around technology standardization and software development for D2PF technologies like Zoned Storage. With this collaboration, end-users can have confidence that these emerging storage technologies will have support from multiple device vendors as well as from vertically integrated hardware and software companies.
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- Flash Memory
KIOXIA America, Inc. today announced that it has started sampling new Automotive Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. The new lineup utilizes KIOXIA cutting-edge BiCS FLASH™ 3D flash memory and is available in capacities from 64 gigabytes (GB) to 512GB to support the various requirements of evolving automotive applications that elevate driver experiences.
The storage requirements for automotive applications continue to increase as infotainment systems and ADAS in cars become more sophisticated. UFS is well-suited to support the high-performance and density needs of these applications. The new devices support a wide temperature range (-40°C to +105°C), meet AEC-Q100 Grade2 requirements and offer enhanced reliability capabilities that increasingly complex automotive applications require.
The sequential read and write performance of the Automotive UFS Ver. 3.1 device is significantly improved by approximately 2.2x and 6x respectively, over previous generation devices. These performance gains contribute to faster system startup and OTA (Over-the-Air) updates.
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