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- Hard Disks
Seagate Technology plc, a world leader in data storage solutions, today announced a range of new products at the CES 2018 conference designed to equip the world’s increasingly mobile population with solutions that solve key challenges they face when creating, processing and accessing their data on-the-go.
“Our world is becoming more data-centric, connected and mobile. This means creating, transferring, storing and accessing data quickly and reliably is critical to unlocking the potential of everything – from data created in the field, to data powering self-driving cars, AI personal assistants or virtual and mixed reality experiences,” said Tim Bucher, senior vice president of Seagate consumer solutions. “At Seagate, we’re constantly pursuing innovative ways to address our customer needs so they can gain a competitive edge in whichever field they play.”
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- Flash Memory
At today’s Consumer Electronics Show 2018 (CES 2018), Western Digital unveiled new and breakthrough consumer solutions that address today’s personal content explosion, including voice-activated media streaming via popular Smart Home devices, the world’s smallest 1TB USB flash drive and a portfolio of ultra-mobile, high-performance, wireless and high-capacity flash storage products. Sold under the SanDisk and WD brands, these offerings ensure that personal experiences and memories can thrive for years to come.
Smartphones, drones, action cameras and virtual reality (VR) goggles are capturing and creating rich content that users want to access and share with friends and followers alike. Innovations in multi-lens cameras, 8K video, 5G wireless, VR, augmented reality (AR) and video streaming are enabling more immersive experiences. As a result, consumers are looking for easier ways to capture, preserve, access and share their personal content as it becomes richer and more robust.
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- Flash Memory
Crucial, a leading global brand of memory and storage upgrades, today announced the availability of the Crucial MX500 SSD. The new drive features second generation Micron® 3D NAND technology and is 45 times more energy efficient than a typical hard drive. Available in capacities up to 2TB in the 2.5-inch form factor and up to 1TB in the M.2 form factor, the MX500 has sequential reads/writes up to 560/510 MB/s and random reads/writes up to 95K/90K IOPS.
“This next generation MX500 SSD features a stackable 64-layer, 256-gigabit component. Micron’s floating gate NAND is designed with CMOS Under the Array (CUA), which allows us to minimize the footprint of the die. At 59 square millimeters, it’s among the world’s smallest 256-gigabit die,” said Jon Tanguy, Crucial Senior SSD Product Engineer. “Our engineering team has incorporated this leading-edge NAND technology in an SSD that includes all the advanced features Crucial customers have come to expect to keep their data safe.”
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Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory storage products and technology solutions, announced today the launch of Nucleum, a 7-in-1 Type C USB hub. Nucleum is the ideal hub for newer MacBooks as it provides extra USB-C and USB-A ports as well as HDMI and SD/microSD card slots.
Nucleum, with its multiple ports, is built to handle all of the familiar accessories consumers have such as mice, keyboards and even a second monitor. Users can be more productive as all seven ports can be engaged at the same time. Nucleum users can power up a MacBook® while also running an external hard drive and charging an iPhone® simultaneously.
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- Flash Memory
PATRIOT, a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions today announced the new addition to their performance SSD line, The EVLVR Thunderbolt 3 Portable SSD, offering an evolution in SSD technology.
The EVLVR Thunderbolt 3 Portable SSD outpaces the speeds of traditional external SSDs by three-fold. With outstanding speed delivered by the Phison E8 PCIe controller and Thunderbolt 3 connectivity, the EVLVR can reach up to 1500MB/s in sequential read and up to 1000MB/s in sequential write speeds. On top of being extremely fast, the EVLVR is also power efficient and does not require any external power supply. Thunderbolt™ 3 brings Thunderbolt to USB-C at speeds up to 40 Gb/s, creating one compact port that does it all. With Thunderbolt 3 a single cable now revolutionizes connection technology – simultaneously supporting high-resolution displays and high-performance data devices while also supplying power.
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- Flash Memory
Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory storage products and technology solutions, is set to share its latest and upcoming products at CES. Kingston will have demonstrations highlighting the capabilities of their family of solid-state drives and encrypted USB Flash drives, as well as additions in the consumer lifestyle space with mobile and embedded solutions.
“We’re excited to share what’s to come from Kingston in 2018. CES week provides a great opportunity to showcase the many quality technology solutions that make up the Kingston family,” said Craig Tilmont, director of marketing, Kingston. “From enterprise SSDs, encrypted USBs, consumer mobile products to embedded solutions, we continue to offer customers rock-solid reliability, ultimate security and maximum performance. When guests visit our suite, they will fully understand Kingston’s commitment to offering the most complete family of performance solutions.”
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- Flash Memory
Micron and Intel today announced an update to their successful NAND joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market.
The announcement involves the companies’ mutual agreement to work independently on future generations of 3D NAND. The companies have agreed to complete development of their third generation of 3D NAND technology, which will be delivered toward the end of this year and extending into early 2019. Beyond that technology node, both companies will develop 3D NAND independently in order to better optimize the technology and products for their individual business needs.
Micron and Intel expect no change in the cadence of their respective 3D NAND technology development of future nodes. The two companies are currently ramping products based on their second generation of 3D NAND (64 layer) technology.
Both companies will also continue to jointly develop and manufacture 3D XPoint™ at the Intel-Micron Flash Technologies (IMFT) joint venture fab in Lehi, Utah, which is now entirely focused on 3D XPoint memory production.
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- Flash Memory
Today at International CES 2018, Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, announced the RC100 Series, a new line of NVMe™ (NVM Express™) M.2 solid state drives (SSDs) for the retail, e-tail, system integrator, and channel markets. The new RC100 Series features a powerful yet cost-effective design, making NVMe storage accessible to everyone.
Starting with Toshiba Memory Corporation’s own state-of-the-art 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH™ and in-house developed SSD controller in a single package, the RC100 was built to offer consumers a viable alternative to pricier high-end NVMe SSDs. In addition to affordability, RC100 SSDs are designed for efficiency, delivering a power-optimized storage solution particularly sought after by mobile users looking to increase battery life.
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- Flash Memory
Plugable’s new 480GB external NVME SSD drive hits performance levels not possible before Thunderbolt 3. Connect the drive to a Thunderbolt 3 port to gain 480GB of extra storage with amazing speeds of up to 2400+ MB/sec read and 1200+ MB/sec write, all without the need for an external power connection. These speeds make this external drive a no-compromise performance solution for video editing, backup, and any tasks which demand maximum disk performance.
“Thunderbolt™ 3 is a revolutionary technology,” said Bernie Thompson, CEO of Plugable Technologies. “We’ve created our line of high-end docks, adapters, and drives to show it off.”
“Plugable’s new external drive makes the most of the performance and power provided by Thunderbolt™ 3,” said Jason Ziller, General Manager, Client Connectivity Division at Intel®. “Thunderbolt 3 enables portable drives like this to hit peak performance, all over a single Thunderbolt 3 cable.”
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- Flash Memory
This week at International CES 2018, Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, will be highlighting the use of its industry-leading BiCS FLASH™ 3D memory in several applications – including its new lineup of NVMe SSDs, the RC100 Series.
At CES, TMA is collaborating with its customers and technology partners to take on the future – together. Toshiba was the first company in the world to announce 3D flash memory technology, which effectively addresses the processing, storage and management of the growing volume of data generated worldwide. Recent announcements see the company continuing to lead the industry forward, including the introduction of a 96-layer 512Gb die; the debut of the industry’s first flash memory device with quadruple-level cell (QLC) technology; and the addition of Through Silicon Via (TSV) technology. Already enabling the enterprise, data center, PC and mobile applications of today, TMA’s BiCS FLASH has paved the way for the applications of tomorrow. In everything from artificial intelligence and virtual reality to a growing number of automotive applications (such as infotainment), high performance computing and the ever-expanding “internet of things,” storage density needs will climb higher and higher – and BiCS FLASH was designed with this in mind.
CES – the biggest stage for consumer technology breakthroughs – is the ideal forum for the inventor of NAND flash to introduce its latest innovations. Harnessing the power of its state-of-the-art 64-layer BiCS FLASH 3D memory, TMA’s latest SSD innovation sits right in the sweet spot between SATA SSDs and higher-end NVMe SSDs. The new RC100 Series was designed to address the entire spectrum of computing – and make the benefits of NVMe accessible to the mainstream market.
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