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Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has shipped more than 100 million overclockable modules. In 2002, Kingston entered the enthusiast market with a line of high-performance memory modules under the Kingston HyperX name. Over the next 19 years Kingston grew the HyperX name within the enthusiast and gaming space until its sale of the peripheral line to HP in 2021. Continuing the incredible success of the HyperX memory products, Kingston rebranded its high-performance component lines into Kingston FURY, investing resources and knowledge from its core business to create the next generation of enthusiast products. Today, the engineering expertise behind the numerous overclocking records and awards continues into a new era of leading-edge, high-performance, enthusiast and gaming solutions.
Since its inception, Kingston has taken pride in its testing innovations and industry-leading product reliability. Back in 2005, Kingston was granted a U.S patent on a proprietary, first of its kind, dynamic burn-in tester. This ensured the utmost reliability in server memory modules used in the world’s largest data centers. Earlier this year, Kingston broadened its portfolio by adding the Kingston FURY Renegade Pro DDR5 RDIMM which provides overclockable server-class DDR5 memory for creators, engineers, and data science professionals to meet the requirements of the latest applications. Its award-winning line of Kingston FURY Beast DDR5 and Renegade DDR5 memory modules also received a makeover with the introduction of white heat spreaders to empower users to choose the color that best fits their individual style.
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AMD today announced the AMD Alveo™ MA35D media accelerator featuring two 5nm, ASIC-based video processing units (VPUs) supporting the AV1 compression standard and purpose-built to power a new era of live interactive streaming services at scale. With over 70% of the global video market being dominated by live content, a new class of low-latency, high-volume interactive streaming applications are emerging such as watch parties, live shopping, online auctions, and social streaming.
The Alveo MA35D media accelerator delivers the high channel density, with up to 32x 1080p60 streams per card, power efficiency and ultra-low-latency performance critical to reducing the skyrocketing infrastructure costs now required for scaling such compute intensive content delivery. Compared to the previous generation Alveo U30 media accelerator, the Alveo MA35D delivers up to 4x higher channel density, 4x max lower latency in 4K and 1.8x greater compression efficiency to achieve the same VMAF score – a common video quality metric.
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T-FORCE, the gaming sub-brand of TEAMGROUP, has launched the blazing-fast VULCAN SO-DIMM DDR5 Memory for laptop gamers looking to upgrade to next-generation DDR5 memory. The VULCAN Memory delivers incredible performance with a simple installation and comes in a range of large capacities, making it the perfect choice for boosting one's gaming experience as well as productivity. Thanks to its ultra-thin graphene heat spreader that enhances cooling; it keeps laptops stable during intensive gaming and allows players to seize victory at the most critical moments.
Following the release of DDR5 desktop memory, the new generation of extremely-fast RAM from T-FORCE has swept the PC hardware world. Today, T-FORCE is launching its first VULCAN SO-DIMM DDR5 Memory designed specifically for gaming laptops. Offering a max clock rate of 5,200MHz and featuring an ultra-thin graphene heat spreader, gamers will experience shorter load times and faster boot-up speeds while still maintaining low laptop temperatures. With up to 64GB of capacity, players will enjoy unimpeded gaming and use work applications simultaneously. The new release of VULCAN SO-DIMM brings a whole new level of performance and user experience.
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G.SKILL International Enterprise Co., Ltd., the world’s leading brand of performance overclock memory and PC components, is announcing an extreme performance DDR5 memory kit based on the latest 24GB module capacity, with a specification of DDR5-8000 CL38-48-48 at 48GB (24GBx2) under the flagship Trident Z5 RGB series, and setting a new bar for extreme overclocked memory with 24GB capacity modules.
Extreme Overclocked Memory Speed DDR5-8000 at 48GB (24GBx2)
Always exploring the limits of DDR5 memory speed, G.SKILL's R&D team has successfully reached an astonishing DDR5-8000 CL38-48-48 at 48GB (24GBx2) kit capacity with the new 24GB capacity modules. Refer to the screenshot below to see this memory kit in action with the ASUS ROG Maximus Z790 Apex motherboard and Intel® Core™ i9-13900K processor, reaching an incredible 123.76GB/s read, 120.75GB/s write, and 118.02GB/s copy speed in the AIDA64 memory bandwidth benchmark.
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CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced new high-speed 7000MT/s 48GB (2x 24GB) VENGEANCE RGB DDR5 and VENGEANCE DDR5 memory kits, as well as the general availability of its massive 192GB (4x 48GB) DDR5-5200 kits. CORSAIR has worked closely with motherboard manufacturer ASUS to ensure that these new kits work flawlessly across its full range of 700 series motherboards, making them an ideal high-speed companion for the latest 13th Gen Intel® Core™ processors.
These new memory kits are compatible with all Intel® 700 series motherboards, but the close working relationship between ASUS and CORSAIR demonstrates both company’s commitment to delivering optimal performance and compatibility for customers. Rigorous testing of these new VENGEANCE DDR5 memory kits ensures they work across the full range of ASUS motherboards, including at the new higher DDR5-7000 speeds.
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The world’s leading memory brand and Intel endorsed partner, ADATA Technology Co., Ltd. today announced the launch of the first overclocked DDR5 5600 R-DIMM memory module compatible with the latest generation of Intel Xeon W-3400 and Intel Xeon W-2400 processors. Intel recently released NEW Intel Xeon W processors that will replace the previous generation Intel Core™ X-Series processors for the HEDT/Workstation segment. In addition to rock solid stability and performance provided by Xeon W processors, Intel has added support for overclocking to optimize for high-performance workloads.
Therefore, ADATA leads the industry and is taking the initiative in expanding workstation applications by launching overclockable DDR5 5600 R-DIMM memory.
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CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced massive new capacities for its DDR5 memory kits, thanks to new 24GB and 48GB UDIMM modules. For the first time from CORSAIR, PC builders can choose from 192GB (4x 48GB), 96GB (2x 48GB), or 48GB (2x 24GB) memory kits. Available in either VENGEANCE RGB DDR5 or VENGEANCE DDR5 kits, these new high capacities are ideal for the most demanding, high-capacity applications such as 8K video editing, as well as DRAM-heavy AI and deep learning workloads. Motherboards with just two memory slots, including Micro ATX and Mini-ITX builds, where space is tight but large capacities are needed also benefit.
CORSAIR VENGEANCE RGB DDR5 and VENGEANCE DDR5, already top choices for performance enthusiasts, are optimized for the latest gaming PCs and workstations and at these new capacities give custom PC enthusiasts the option to build with memory configurations that weren’t possible until now. Both 96GB and 48GB kits are available immediately in both RGB and non-RGB flavors, running at 5,600MT/s and 5,200MT/s and support Intel XMP 3.0 memory overclocking to ensure owners can easily run their memory at the intended speeds.
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World-leading memory brand, TEAMGROUP, has announced new breakthroughs in the TEAMGROUP ELITE U-DIMM DDR5 Standard Memory. To ensure compatibility with next-generation platforms, TEAMGROUP has pioneered the first high-performance 6,400MHz spec per JEDEC definitions for consumers to enjoy upgraded performances with ease in the DDR5 generation.
To ensure a stable performance of 6,400MHz and above of the DDR5, TEAMGROUP has adopted the new CKD (client clock driver) components designed to strengthen, buffer, and steadily output high-frequency signals from the CPU to DDR5 memory kits, effectively ensuring high frequencies while supporting reliable high-speed transmissions. TEAMGROUP is dedicated to R&D and working simultaneously with motherboard manufacturers for rigorous compatibility testing, offering high-quality and highly compatible memory products for desktops and laptops to consumers around the world, fulfilling user demands for PC, laptops, or other small systems.
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SK hynix Inc. announced today that it will showcase a number of its core and brand-new products at the CES 2023, the most influential tech event in the world taking place in Las Vegas from Jan. 5th through Jan. 8th.
The products, introduced under the theme of the "Green Digital Solution," as part of the SK Group's "Carbon-Free Future" campaign, are expected to attract Big Tech customers and experts given the significant improvement in performance and energy efficiency compared with the previous generation as well as the effect of lessening the impact on the environment.
Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy. SK hynix is confident that its products to be displayed at the CES 2023 will meet customers' such needs with outstanding performance per watt and performance.
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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry’s first 12-nanometer (nm)-class process technology, as well as the completion of product evaluation for compatibility with AMD.
“Our 12nm-range DRAM will be a key enabler in driving market-wide adoption of DDR5 DRAM,” said Jooyoung Lee, Executive Vice President of DRAM Product & Technology at Samsung Electronics. “With exceptional performance and power efficiency, we expect our new DRAM to serve as the foundation for more sustainable operations in areas such as next-generation computing, data centers and AI-driven systems.”
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