OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced that it has initiated a beta test program for its Linux® Acceleration (LXL) Software development and invites its enterprise SSD customers to participate. The new OCZ LXL Software is a fast caching storage solution for OCZ's portfolio of enterprise SSDs and designed specifically for Linux-based physical and virtual environments.

OCZ's unique LXL Software provides a new integrated approach for making application-optimized data cache selections while minimizing I/O access times to SSD flash. It achieves this type of dynamic cache selection optimization by splitting the caching policy engine between the core mechanism running in the Linux kernel and an advanced statistical out-of-band analysis module that optimally determines which data needs to be placed in the cache and stores the data locally in OCZ enterprise-SSDs. The LXL software supports a wide range of OCZ enterprise solid state solutions across multiple interfaces (i.e. Z-Drive R4 PCIe Series, the Talos 2 SAS Series and the Deneva 2 SATA Series).

"By enabling intelligent direct pass caching, all data requests to and from the SAN are streamlined, reducing external traffic by up to 90 percent, as out-of-band communication with the data path provides very high selection efficiencies and ultra-low latency," said Dr. Allon Cohen, Vice President of Software and Solutions for OCZ Technology. "This innovative LXL architecture avoids the data-path processing penalties typically associated with selectively caching data and enables tighter integration of the data path from application to SSD flash. This beta program will allow OCZ to work closely with our partners to demonstrate and explore the benefits that this software delivers when paired with our SSD hardware to form a total solution for Linux-based environments."

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kingmax_ui-06.jpgContinuing its pursuit of data storage innovation, KINGMAX is excited to announce the December 17th launch its remarkably compact, ultra fast COB USB 3.0 Flash drive. The UI-06 features high read and write rates and is built to last thanks to the waterproofing and dustproofing capabilities of PIP technology. The hardware is protected by smudge-resistant sandblasted metallic casing and is available in blue or gray.

Market trends and user demands call for portable storage with faster transfer rates, ever more secure data storage, higher capacities and heady design. As a leading manufacturer of COB technology, KINGMAX has combined faster components and dynamic compatibilities to create the powerful, pocket-sized UI-06. Highly efficient COB packaging techniques use only 8.8% of the space of a traditional SMT-type USB and with a peak read speed of 85MB/s and a maximum write speed of 22MB/s.

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Samsung Electronics Co. Ltd., a world leader in advanced semiconductor solutions, announced today that it acquired privately held NVELO, Inc., a Santa Clara, Calif.-based pioneer of storage software. By intelligently managing and optimizing the use of SSDs in the storage subsystem, SSD caching has become an attractive solution for both consumer and enterprise computing platforms. The timely integration of NVELO's flagship storage technology into Samsung's best-in-class SSD technologies will give Samsung customers access to an ever-evolving and more diversified portfolio of NAND storage solutions suitable for a broad range of computing platforms.

"The acquisition of NVELO will enable us to extend our ability to provide SSD related storage solutions to customers. We are pleased with this transaction as the employees of NVELO share our vision to take SSD storage into the next-generation of performance and reliability," said Young-Hyun Jun, executive vice president of Flash product & technology, Device Solutions, Samsung Electronics.

"The NVELO team is excited to join the Samsung family," said Jiurong Cheng, president and CEO, NVELO. "We look forward to accelerating storage innovation in close cooperation with Samsung storage experts as we help to deliver fully integrated SSD solutions to the market."

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Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., the independent world leader in memory products, today announced a new 128GB capacity addition to the Wi-Drive product line. The 128GB Wi-Drive allows even more sharing on Wi-Fi enabled devices and is a perfect addition to the existing 32GB and 64GB capacities. With integrated Wi-Fi and four hours of battery life, Kingston Wi-Drive offers easy file sharing and pocket-sized portable storage for Wi-Fi enabled devices such as Apple iPad®, iPhone®, iPod touch®, Android devices, Kindle Fire and more.

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The free Wi-Drive App* is available for Apple devices in the App Storesm, for Android OS devices in the Google Play App Store and for Kindle Fire in the Amazon App Store. The device allows simultaneous data access and file sharing for up to three users on their preferred mobile device. Thanks to a variety of Android-based devices and their versatile user experience, users can access and share their files via web browser or the Wi-Drive App.

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bitmicro_maxio_pcie_ssd.pngBiTMICRO announced today that it has completed the first production units of its maxIO PCIe SSD, its new enterprise-class solid state drive.

MaxIO SSDs feature BiTMICRO’s recently announced Talino Architecture, which integrates their Quad-Core Talino ASIC, delivering 400,000 random 4KB IOPS on a single controller. Talino handles data processing without wasting critical server resources.

“These first maxIO SSDs begin BiTMICRO’s entry into the enterprise market,” states Zophar Sante, VP of Marketing and Sales. “For over a decade we have designed and manufactured SSDs for highly demanding defense and industrial customers. We’re leveraging our experience with mission-critical applications to deliver new feature-rich, high performance and extremely durable SSDs to the enterprise.”

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silicon_power_elite_sdxc_uhs-1.pngSilicon Power, the world’s leading provider of memory storage solutions today announces a brand new series of flash cards - the Elite UHS-1 series. The Elite UHS-1 series contains a complete product roadmap ranging from SDHC, SDXC to microSDHC and microSDXC, ready for all types of devices such as DSLR, Smartphones, tablets and camcorders. With the combination of the large capacity up to 64GB and the remarkable transmission rate reaching at 50MB per second in reading, the Elite UHS-1 series is the ideal gadget for high-speed consecutive picture taking, extended length of Full-HD videos and images, as well as massive storage for all your cherish memories.

SP Elite UHS-1 series is compliant with the SDA Memory Card Standard Version 3.0.1 and the Ultra High Speed Class 1 specification (UHS-1). Compared to SD 2.0, the Elite series presents a tremendous improvement in terms of transmission performance in reading and writing. By offering a whole new photographic experience in high-speed photo shooting and video capturing, the Elite UHS-1 series is your perfect selectoin for DSLR, camcorders, smartphones and tablets users.

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team_group_ultra_l1_ssd.pngSolid state drive (SSD) is gradually making its way to become the mainstream in 3C product market.  Team Group Inc., one of the leading memory manufacturers in the world, is making improvement in SSD product development by launching the ultra-thin Team Ultra L1 SSD.  As thin as 7mm, the Team Ultra L1 SSD is the most lightweight and compact model which can be installed directly onto new generation of Ultrabooks for faster booting and read/write speed.  Combined with the inherent advantage of shock resistance and stability of SSD, it signifies significant improvement of computer performance and durability.

Team Ultra L1 SSD is provided with SATA III 6Gb/s high-speed interface.  The compact profile and special titanium color finishing highlight the product’s high quality and the sense of modern technology. The continuous read and write speeds go as high as 550MB/s and 520MB/s, respectively. The random write-in speed for small files of 4K reaches up to 80,000 IOPS, not only fast but stable.  In addition, the integration of Dura Write and RAISE (Redundant Array of Independent Silicon Elements) provides support for S.M.A.R.T. and full compatibility with Win7 Trim commands.  It gives the hard drive a boost of burst random writing and effective improvement of computer’s ability to respond and multiplexing performance, making the hard drive a storage solution of extreme speed for consumers.

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lacie_xtremkey_usb3.jpgToday, LaCie expands its industrial-strength storage line with the faster, stronger XtremKey USB 3.0. Designed for users who want to push the limits with their technology, the robust LaCie XtremKey can challenge the most severe conditions.

The LaCie XtremKey received multiple awards for its innovative, rock-solid design. With wear-resistant screw threads and a rubber O-ring, the LaCie XtremKey is waterproof up to 200 meters. "The unique design is inspired by a waterproof screwing closure and thick metal casing," said product line manager Luc Pierart. "When the seam is sealed, the aerodynamic key can withstand extra ordinary circumstances."

Like its predecessor, the latest LaCie XtremKey features a protective cap made of thick ZAMAC metal alloy. Its strength can withstand severe shock, dizzying drops, and the relentless pressure of a 10-ton vehicle. It also survives bone chilling temperatures down to -30°C, and scorching heat up to 200°C.

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VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced its two latest USB 3.0 device controllers, the VIA VL752 and VIA VL753 SuperSpeed USB 3.0 to NAND flash controllers. The VIA VL752 and VIA VL753 deliver enhanced performance using the latest NAND flash technologies including 19nm, 20nm and 21nm geometries and have been certified by the USB Implementers Forum (USB-IF) for SuperSpeed operation, ensuring high quality, seamless interoperability, and effortless backwards compatibility.

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The two-channel the VIA VL752 and single-channel VIA VL753 offer data transfer speeds up to 280MB/s, flexible bad block management, support for the latest 200MHz DDR NAND Flash, and a robust ECC engine for greater data integrity. The package sizes from the previous generation of VIA Superspeed USB to NAND flash controllers have been reduced to a QFN68 8 x 8mm package for the VIA VL752 and a QFN48 6 x 6mm package for the VIA VL753 to enable the smallest form-factor designs.

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transcend_cf170_compactflash.pngTranscend Information, Inc., a worldwide leader in storage and multimedia products, today announced the addition of Industrial use microSDHC Class 10 and CF170 CompactFlash memory cards to its industrial memory card product line. Ideal for use in small form factor devices with demanding performance and capacity requirements, Transcend's MLC-based microSDHC Class 10 and CF170 memory cards are the most reliable high speed, high volume compact storage solution.

Manufactured using brand-name MLC NAND Flash chips, Transcend's Industrial use microSDHC cards guarantee superior performance and long-term stability over their consumer-grade TLC counterparts. Combining advanced Flash technology with the top-of-the-line Class 10 speed rating, these cards provide impressive read/write speeds of up to 20 MB/16 MB per second, losing nothing in transfer performance despite their tiny dimensions. Thanks to their fast data transfer rates, enhanced reliability, and available capacities of up to 32 GB, Transcend's Industrial use microSDHC Class 10 cards are the perfect OEM/bundle pack accessory for compact non-stop applications, including the latest digital cameras, DV recorders, mobile phones, and portable vehicle navigation systems.

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