Patriot Memory has unveiled the Viper EV330 PCIe M.2 2230 SSD enclosure, specifically designed for users seeking high-speed data transfer, superior heat dissipation, and portability. This enclosure supports the USB 3.2 Gen2 x2 interface, delivering ultra-fast data transfer speeds of up to 20Gbps, enabling users to quickly access and back up large files for both professional applications and everyday needs.

The Viper EV330 enclosure accommodates PCIe NVMe SSDs in the M.2 2230 form factor, making it ideal for storage expansion in high-performance laptops, mini PCs, and mobile devices. The aluminum alloy housing not only provides excellent thermal management but also features silicone shock protection to enhance impact resistance, ensuring stable SSD operation even during mobile use.

Silicon Power (SP) is excited to launch the Endura series, a new SSD lineup featuring four models: E55, E60, ED90, and ES75. Designed with advanced 3D TLC NAND technology, these SSDs offer a comprehensive range of storage solutions catering to diverse user needs, all with the reliability- and performance-geared features that define TLC.

E55: 2.5” SATA III SSD
The E55 delivers robust and stable performance, making it an ideal choice for casual users and system integration builders seeking accessible, dependable storage. With a SATA III 6Gb/s interface and capacities ranging from 512GB to 2TB, it offers broad compatibility for diverse devices and storage needs. Delivering speeds up to 500MB/s read and 450MB/s write —15 times faster than a standard HDD—the E55 combines reliability and familiarity in a versatile, user-friendly solution.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced the sampling of its groundbreaking MonTitan™ SSD Reference Design Kit (RDK) that supports up to 128TB with QLC NAND. Designed on the advanced MonTitan PCIe Gen5 SSD Development Platform. This new offering aims to accelerate enterprise and data center storage AI SSD solutions by providing a robust and efficient RDK for OEMs and partners.

The SSD RDK incorporates Silicon Motion's PCIe Dual Ported enterprise-grade SM8366 controller, which supports PCIe Gen5 x4 NVMe 2.0 and OCP 2.5 data center specifications offering unmatched performance, QoS, and capacity for next-generation large data lake storage needs.

ADATA Technology Co. Ltd., the world's leading brand for memory modules and flash memory, today announced the launch of the SC730 external SSD, the industry's first ultra-compact drive featuring both USB-C and USB-A connectors in a lightweight 7.8g form factor. Designed for seamless multi-platform connectivity, it delivers up to 600MB/s transfer speeds, making it ideal for users on the go. The SC730 also stands out with its eco-conscious design, featuring an exterior casing made from 50% post-consumer recycled (PCR) materials, aligning with ADATA's commitment to ESG sustainability initiatives.

USB-C & USB-A Miniature Form Factor
The SC730's standout feature is its dual-interface design, supporting USB 3.2 Gen2 to achieve 600MB/s read and write speeds. Whether transferring high-resolution media files, gaming data, or large business projects, this SSD ensures a smooth and efficient experience. Measuring only 36mm in length, the SC730 is even smaller than a typical USB flash drive yet delivers the advantages of dual connectivity and high-speed storage, setting a new benchmark for portable storage solutions.

QNAP Systems, Inc. (QNAP) today released QuTScloud c5.2, the latest version of its Cloud NAS operating system. This update introduces Security Center, a proactive security application that monitors Cloud NAS file activities and defends against ransomware threats. Additionally, QuTScloud c5.2 provides extensive optimizations, streamlining operations and management for a more seamless user experience.

QuTScloud Cloud NAS revolutionizes enterprise data storage and management. By deploying a QuTScloud image on virtual machines, businesses can flexibly implement Cloud NAS on public cloud platforms or virtualization environments. With a subscription-based pricing model starting at just US $4.99 per month, users can allocate resources efficiently and optimize costs.

Samsung Electronics America, a world leader in advanced memory technology, today announced the 9100 PRO series solid state drives (SSDs), the newest addition to its consumer SSD lineup. Featuring blazing fast speeds and even more storage capacities, the 9100 PRO and 9100 PRO with Heatsink SSDs are designed to deliver next-gen performance – offering the ultimate storage solution for your digital life.

“From AI-driven creators shaping the future to gamers pushing the limits, we saw a clear need for innovation to support users who need more forward-thinking memory technology as they push the bounds of what’s possible in their work,” said Jim Kiczek, Vice President of Memory Product Marketing at Samsung Electronics America. “The 9100 PRO SSD establishes a new era of performance to help them achieve exactly that. With more storage, even better speeds, improved power efficiency and seamless reliability, the lineup empowers users to continue innovating without storage limitations.”

Kioxia Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4.8Gb/s NAND interface speed, superior power efficiency, and heightened density.

Unveiled at ISSCC 2025, the new 3D flash memory innovation, together with the companies’ revolutionary CBA (CMOS directly Bonded to Array) technology, incorporates one of the latest interface standards, Toggle DDR6.0 for NAND flash memory, and leverages the SCA (Separate Command Address) protocol, a novel command address input method of its interface, and PI-LTT (Power Isolated Low-Tapped Termination) technology, which is instrumental in further reducing power consumption.

Leveraging this unique high-speed technology, the companies expect the new 3D flash memory to achieve a 33 percent improvement in NAND interface speed compared with their 8th generation 3D flash memory currently in mass production, reaching a 4.8Gb/s interface speed. The technology can also deliver enhanced power efficiency of data input/output, reducing power consumption by 10 percent for input and 34 percent for output, thereby achieving a balance of high performance and low power consumption. Previewing the 10th generation 3D flash memory, the companies detailed that by increasing the number of memory layers to 332 and optimizing the floor plan for increased planar density, the technology improves bit density by 59 percent.