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Creative Technology today launched Sound Blaster X1, the ultimate USB DAC and headphone amplifier which offers the heralded Sound Blaster Acoustic Engine technology, together with the multiple award-winning Super X-Fi Headphone Holography first seen in the iconic SXFI AMP. As small as a finger, it serves up a huge treat of multi-channel, high-resolution and immersive audio, with authentic reproductions down to the last detail, powered by a high-end 128dB AKM4377 32-bit DAC and Ti/Burr-Brown INA1620 dual audio operational amplifier.
Sound Blaster X1 is best used with PC and Mac, and with the Creative desktop app, users gain access to the Sound Blaster Acoustic Engine, where they can tap on the full suite of sound processing technologies to enhance their experiences for both work and play.
With Sound Blaster Surround Virtualization, users get to enjoy a phenomenal mesh of depth and range in audio immersion across movies, music and games. CrystalVoice technology caters for a host of smart adjustments during conference calls with features like SmartVolume and Acoustic Echo Cancellation; there is also SmartComms Kit which helps to reduce background noise effectively and auto-mute users when they are not speaking. There are professionally-tuned audio and game presets to further please gamers; Scout Mode detects subtle audio cues and makes them obvious to keep gamers one step ahead of their competitors all the time.
Users also get to enjoy Super X-Fi headphone holography, an acknowledged game changer which redefines headphone listening by recreating the soundstage of a premium multi-speaker system for an expansive experience. Furthermore, ear-mapping via the SXFI app tailors to users' ears and helps them immerse in all their audio, especially movies and games, in the most natural way.
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QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today introduced the high-density NVMe all-flash NAS TS-h1090FU, featuring U.2 NVMe PCIe Gen 4 x4 SSD architecture for high throughput and low latency workloads. With built-in dual-port 25GbE connectivity, PCIe Gen 4 expandability, ZFS reliability, and QNAP’s SSD optimization technologies, the TS-h1090FU provides exceptional performance for IO-intensive file servers, virtualization, collaborative 4K/8K video editing, and efficient data backup/recovery applications. Businesses can retire hybrid arrays and opt for the TS-h1090FU at the same cost as optimal Tier 2 storage applications with an ideal low cost-per-GB.
“QNAP’s all-flash storage lineup offers a great combination of performance, reliability, and capacity, providing businesses with the highest system performance at the lowest storage cost,” said Jason Hsu, Product Manager of QNAP, adding “Running on a ZFS-based OS that is optimized for enterprise storage, the 25GbE-ready TS-h1090FU all-flash NAS demonstrates superior performance with future-proof growth to empower mission critical workloads.”
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Today, Seagate Technology Holdings plc, a world leader in mass-data storage infrastructure solutions, announced two additions to its Nytro® portfolio, the Nytro 5550 SSD and Nytro 5350 SSD. Engineered with Phison technology for high performance, efficiency, and increased storage density in data centers, the new products comprise the Seagate® Nytro 5050 NVMe™ SSD series. Designed to offer more computing with less energy consumption, they provide a cost-effective solution that eliminates bottlenecks, improves quality of service (QoS), and delivers the highest levels of data integrity and security for business applications.
The Nytro 5350 PCIe Gen4 NVMe SSD doubles the read throughput of the latest SAS SSDs, achieving over ten times the bandwidth of SATA to significantly improve QoS. Designed to give data centers more computing power while reducing total cost of ownership (TCO), the drive removes data bottlenecks with blistering up to 7.4GB/s bandwidth and up to 195K IOPS random write speeds and up to 1.7M IOPS random read speeds to provide consistent response times. Perfectly tuned to increase density and boost capacity in ultra-dense environments, Nytro 5350 brings up to 15.36TB in a 15mm form factor and up to 7.68TB in a 7mm form factor with dual ports, supporting both U.2 and U.3 interfaces for active-active high availability. Designed to take on enterprise workloads, Nytro 5350 delivers 1 DWPD at 2.5M MTBF for enhanced endurance.
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Kioxia Corporation, the world leader in memory solutions, today announced the launch of the second generation of XL-FLASH, a Storage Class Memory (SCM) solution based on its BiCS FLASH 3D flash memory technology, which significantly reduces bit cost while providing high performance and low latency. Product sample shipments are scheduled to start in November this year, with volume production expected to begin in 2023.
The second generation XL-FLASH™ achieves significant reduction in bit cost as a result of the addition of new multi-level cell (MLC) functionality with 2-bit per cell, in addition to the single-level cell (SLC) of the existing model. The maximum number of planes that can operate simultaneously has also increased from the current model, which will allow for improved throughput. The new XL-FLASH™ will have a memory capacity of 256 gigabits.
Kioxia’s second generation XL-FLASH™ memory solution is engineered to bring higher performance and lower cost for data centers and enterprise servers and storage systems. In the future, it may also be possible to apply the product using CXL (Compute Express Link). Kioxia will continue to develop cutting-edge technologies and products to meet the needs of the expanding SCM market.
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ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announced the LEGEND 960 PCIe Gen4 x4 M.2 2280 solid state drive (SSD). With the advent of the Web 3.0 and a growing emphasis on the virtual world, the new LEGEND 960 delivers a new level of performance for advanced design applications, such as 3D animation, game design, virtual art, and beyond.
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The ADATA LEGEND 960 gives users a major upgrade in performance with sequential read and write speeds of 7,400/6,800MB per second, and is compliant with NVMe 1.4. This makes it up to 4 times faster than a standard PCIe Gen3 SSD. What’s more, it supports the latest Intel and AMD platforms, desktop and notebook PCs, including Intel® Evo™ certified laptops, and is backward compatible with PCIe 3.0 for added convenience.
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Phison Electronics Corp., a global leader in NAND flash controller and storage solutions, today announced the launch of its X1 controller-based solid-state drive (SSD) platform that delivers the industry’s most advanced enterprise SSD solution. Engineered with Phison’s technology to meet the evolving demands of faster and smarter global data-center infrastructures, the X1 SSD platform was designed in partnership with Seagate® Technology Holdings plc, a world leader in mass-data storage infrastructure solutions.
The X1 SSD customizable platform offers more computing with less energy consumption. With a cost-effective solution that eliminates bottlenecks and improves quality of service, the X1 offers more than a 30 percent increase in data reads than existing market competitors for the same power used.
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Transcend Information, Inc. (Transcend), a leading manufacturer of embedded memory products, has recently introduced a whole series of 112-layer 3D NAND solid-state drives featuring wide-temperature tolerance, operating stably from -40°C to 85°C and demonstrating remarkable endurance. The form factors include 2.5", M.2, and mSATA types, suitable for embedded devices, vehicle systems, and slim servers. With up to 4TB capacity, this rugged solution overcomes the challenges of extreme industrial environments, empowering applications in smart factories, modern infrastructures, and surveillance in the IoT era.
Transcend utilizes 112-layer 3D NAND flash to build wide-temp SSDs, which support the mainstream SATA III interface and the high-speed PCIe interface. With up to 4TB capacity, proven performance is delivered between -40°C and 85°C thanks to an in-house sorting process and rigorous temperature tests which ensure the SSDs can adapt to rapid temperature change and thermal shock. Meanwhile, anti-sulfur technology, Corner Bond, and 30µ” gold fingers are incorporated to enhance key component protection and effectively prolong SSD lifespan. All these features create higher reliability for demanding applications like roadside monitoring systems which are exposed to long hours of high temperatures, or industrial computers that have to ensure non-stop high-speed operation.
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Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers and solid-state storage devices today announces MonTitan, a PCIe Gen5 SSD solution platform perfectly suited for the most challenging Datacenter and Enterprise applications.
Silicon Motion's new MonTitan platform features an entirely new, purpose-built ASIC and FW architecture, optimized for performance and QoS. Its unique Layered FW stack enables the development of customer differentiated solutions with a high degree of flexibility and accelerated time to market, all while reducing engineering cost.
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With the rise of high-performance computing (HPC), the demand for industrial product cooling has increased dramatically due to higher power requirements and heat generation in demanding industrial applications and platforms. In response, TEAMGROUP has adopted the VC (Vapor Chamber) liquid cooling technology, commonly for mobile devices, and introduced the industry's first M.2 SSD VC liquid cooling technology. The VC liquid cooling tube was redesigned from the ground up for PCIe M.2 SSD applications based on the high-speed transfer rates and heat generation patterns of high-speed PCIe M.2 SSD. The result is a liquid-cooled PCIe M.2 SSD with outstanding thermal performance that can sustain high-speed operation in harsh and dynamic industrial environments.
TEAMGROUP's N74V-M80 is an industrial grade VC Cooling M.2 SSD that utilizes proprietary liquid cooling technology (Taiwan Utility Model Patent : M626519). Through the specially designed VC liquid cooling tubes, cooling fluid is pumped to the heat zone of PCIe M.2 SSD controller. Heat is then transferred to the aluminum fin heat sink with a convective design via gas-liquid phase transition to enhance thermal performance. The N74V-M80 combines the functions of heat absorption, conduction, and dissipation to better transfer and regulate thermal energy. TEAMGROUP's industrial control T.R.U.S.T. technology ("T" for Temperature) ensures that its PCIe M.2 SSD products maintain excellent transfer performance over a wide temperature range of -40°C (-40°F) to 85°C (185°F). In addition, the TEAMGROUP N74V-M80 uses TLC Flash and supports the PCIe Gen3x4 interface and NVMe1.3 standard, providing write and read speeds of up to 3,400 and 2,500MB/s, respectively, and is suitable for industrial-grade HPC devices with adequate installation space. It can fully meet the high-speed computing needs while keeping it cool and energy-saving.
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Micron Technology, Inc., today announced that it has begun volume production of the world’s first 232-layer NAND, built with industry-leading innovations to drive unprecedented performance for storage solutions. It features the industry’s highest areal density and delivers higher capacity and improved energy efficiency over previous generations of Micron NAND, to enable best-in-class support of the most data-intensive use cases from client to cloud.
“Micron’s 232-layer NAND is a watershed moment for storage innovation as first proof of the capability to scale 3D NAND to more than 200 layers in production,” said Scott DeBoer, executive vice president of technology and products at Micron. “This groundbreaking technology required extensive innovation, including advanced process capabilities to create high aspect ratio structures, novel materials advancements and leading-edge design enhancements that build on our market-leading 176-layer NAND technology.”
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