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Flash Memory

12 August 2015

SanDisk Corporation, a global leader in flash storage solutions, today announced its new CloudSpeed Ultra Gen. II SATA SSD for cloud service provider (CSP) and software-defined storage (SDS) vendor environments. Offering up to 1.6TB of usable capacity, CloudSpeed Ultra Gen. II SATA SSD provides the storage performance and density needed for mixed-use, latency-sensitive transactional workloads—such as e-commerce and collaborative online services. Expanding on SanDisk’s existing portfolio of cloud-focused flash solutions, CloudSpeed Ultra™  Gen. II delivers unmatched price/performance leadership at a little over $0.04 per IOPS versus $3.50 per IOPS typically inherent with conventional SATA HDDs. Additionally, CloudSpeed Ultra Gen. II serves up to 32,000 4K write IOPS with 530MB/sec throughput1, and an 80 microseconds random read write latency - delivering 99.9 percent quality of service (QoS).

“The demand of transaction-oriented applications puts tremendous strain on our cloud service provider customers to architect data center platforms capable of delivering high performance, while keeping infrastructure costs in check,” said John Scaramuzzo, senior vice president and general manager, Enterprise Storage Solutions, SanDisk. “As a trusted provider of flash storage solutions, SanDisk understands the critical need for cloud elasticity in order to raise customer service levels. With CloudSpeed Ultra Gen. II, CSPand SDS companies can provide an exceptional customer experience, while reducing administrative overhead along with the number of servers and software licenses needed to support transaction and analytical databases.”

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Flash Memory

12 August 2015

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is adding three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its industry-leading portfolio of advanced enterprise and data center SSDs. The drives are available now.

“We are providing high-end capabilities and capacities for all of our latest SSDs, something we believe will elicit a high degree of interest from OEMs and computer enthusiasts throughout the world,” said Jim Elliott, corporate vice president, Samsung Semiconductor, Inc. “We understand the performance needs of our customers in a rapidly expanding SSD universe and are determined to meet those needs.”

Designed for OEMs, Samsung’s new SSDs – the PM1633, PM1725 and PM953 all utilize Samsung’s 3-bit MLC (multi-level-cell) V-NAND flash memory, while providing outstanding performance and reliability, as well as high capacities.

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Flash Memory

11 August 2015

Kingston Digital Europe Co LLP, an affiliate of Kingston Technology Company Inc., the independent world leader in memory products, today announced the addition of a 512GB capacity to its line of Class 10 UHS-I SDHC/SDXC cards. The higher capacity card is ideal for DSLR cameras and HD camcorders as it allows users to record more video and shoot more high-density image files without running out of space.

In addition to storing thousands of photos and hours of video , the card provides speeds of 90MB/s read and 45MB/s write. These high speeds support photography in continuous and burst modes, and reduces stutter to ensure video integrity. Class 10 UHS-I SDHC/SDXC cards also allow users to shoot full 1080p HD video and 3D video as well as transfer files faster. In addition to the new 512GB capacity, this card is also available in 16GB, 32GB, 64GB, 128GB and 256GB.

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Flash Memory

11 August 2015

Toshiba Corporation’s Semiconductor & Storage Products Company today announced three distinct families of PCIe (Peripheral Component Interconnect Express) solid state drive (SSD) products using NVMe (Non-Volatile Memory Express) protocol, targeted for various applications including high performance notebooks; thin notebooks, 2-in-1/convertible notebooks and tablets; and server and storage applications. All three SSD product lines are optimized for high performance and low latency and utilize the PCIe interface, which provides point-to-point links with the processor, reducing system bottlenecks. Each SSD family is designed for its target segment with capacity, optimized form factor, and security capabilities. Samples of the Toshiba’s newest lines of NVMe, PCIe SSDs will be available from the fourth quarter (Oct. to Dec.) of 2015.

High Performance Notebooks: The XG3 family of SSDs is the industry’s highest capacity (1024GB) client NVMe SSD available in M.2 Type 2280 form factor and optimally designed for high performance notebooks, 2-in-1 PCs and all-in-one PCs. The XG3 in M.2 Type 2280 form factor supports up to four lanes of PCIe 3.1, which has a maximum interface bandwidth more than six times that of SATA 6Gbits/s. XG3 is also the industry’s first NVMe SSD available in 2.5-inch SATA express form factor. The XG3 SSD family is equipped with Toshiba’s proprietary QSBCTM (Quadruple Swing-By Code) error-correction technology, a highly efficient error correction code (ECC), which helps protect customer data from corruption, improves reliability, and extends the life of Toshiba SSDs. Engineered for power efficiency, the XG3 series also features lower power state modes and is the first Toshiba product, along with the BG1 SSD family, to support the Trusted Computing Group specification, Pyrite (TCG Pyrite).

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Flash Memory

11 August 2015

Team Group Inc. is continuously dedicated in satisfying our customers’ needs in every respect. Today we announce the release of the elegant and thin Team C153/C155 premium flash drive. The body of the product is built with aluminum unibody case. The surface is abrasive blasted with features like anti-fingerprint and anti-corrosion anodization. It is an example of achieving aesthetic perfection through beautiful craftsmanship.

The exterior design of the C153/C155 is based on golden ratio to provide a chiseled shape. We also reduced the thickness to 7.1mm. The thinnest part at the outer edge is only 2.95mm thick which creates a thin but stereoscopic feel when consumers holding it in hand. In addition, the unique stereoscopic linear design on the product and trendy colors like the premium gold create an urban trend style that goes with today’s modern technology. The strap hole design can go with a strap to perfectly match with consumer’s personal belongings. It helps with avoiding the problem of losing the device, and it can also become a unique stylish accessory. It is a both elegant and efficient device that you must have.

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Flash Memory

10 August 2015

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid state drives (SSDs).

“With the introduction of our 3rd generation V-NAND flash memory to the global market, we can now provide the best advanced memory solutions, with even higher efficiency based on improved performance, power utilization and manufacturing productivity, thereby accelerating growth of the high-performance and the high-density SSD markets,” said Young-Hyun Jun, President of the Memory Business at Samsung Electronics. “By making full use of Samsung V-NAND’s excellent features, we will expand our premium-level business in the enterprise and data center market segments, as well as in the consumer market, while continuing to strengthen our strategic SSD focus.”

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Flash Memory

10 August 2015

Silicon Power, the world’s leading provider of memory storage solutions, today announces the launch of its first dual USB drive – Mobile C80 with a USB Type-C connector and a standard USB Type-A connector. Type-C is the next-generation interface that will simplify all formats into one universal interface that will deliver both data and power between devices. Mobile C80 can absolutely fulfill the needs of storage space for Type-C ready smartphones, tablets, and notebooks. Type-C standard enables not only slim designs but also reversible connector which allows users to insert it into their device's port no matter which way up it is. Moreover, Mobile C80 has a USB 3.0 connector to truly bridge various computing devices and makes your digital life easier.

Type-C Interface Rules the Next Generation 
The announcements of new Apple MacBook and Chromebook Pixel in March this year have brought attention to USB Type-C interface, and it is gaining rapid support from top-tier PC and consumer electronics manufacturers. However, many users may suffer from relatively few and specific expansion slots of new-generation mobile devices, and it is costly for additional storage space. Mobile C80 delivers up to 64GB of instant capacity for you to transfer and store content. Without constraints of internet signals and different kinds of cables and adapters, C80 promises easier, faster and more stable data transmission. Inheriting from Jewel J80/ Firma F80, Mobile C80 retains the ergonomic circular shape for easy grasp and perfect keychain accessory, but adds a sturdy 360° swivel cap to protect the connector from harm when it is not in use. Moreover, the zinc alloy casing of C80 features sandblasting treatment that enables delicate touch and provides superior resistance to scratches and fingerprints.

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Flash Memory

10 August 2015

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced it will be presenting at the upcoming Flash Memory Summit in Santa Clara, CA from August 11th to 13th and will be showcasing an array of SSD solutions at booth #313, including the award winning SM2246EN SATA 6Gb/s SSD solutions, the new products using SM2256, the world's first turnkey SSD controller supporting TLC NAND and the new SM2260 PCIe 3.0 SSD controller.

Products showcasing at Silicon Motion's Flash Memory Summit booth include:

PCIe 3.0 NVMe 1.2 SSD Controller- SM2260
The SM2260 is the first turnkey merchant PCI Express (PCIe) 3.0 Non-Volatile Memory Express (NVMe) 1.2 solid-state drive (SSD) controller solution supporting MLC, TLC and 3D NAND.  The SM2260 delivers PCIe-level performance with low power consumption and features four 8 gigabit-per-second (Gbps) lanes (PCIe Gen 3.0 x4) of simultaneous data flow coupled with eight NAND channels. It is designed with fourth-generation NANDXtend technology, enabling the SM2260 to support 1y/1z nm TLC NAND as well as the upcoming 3D NAND technologies from all major NAND suppliers.  The SM2260 solution optimizes hardware and software to take full advantage of the NVMe 1.2 SSD standard, offering high performance and reliability while delivering more cost-effective PCIe SSDs for computing systems, ultra-portables and tablets.

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Flash Memory

06 August 2015

Lite-On, a global leader in the design, development and manufacturing of enterprise and client Solid-State Drives, announces its next generation EP series, the EP2 M.2 with NVMe protocol, at Flash Memory Summit 2015 in Santa Clara, California. As the demand for data storage, server virtualization, virtual desktop infrastructure (VDI), and cloud computing applications increases, companies are looking for ways to consolidate as well as integrate storage solutions that address the need for rigorous workloads.

Lite-On’s NVMe M.2 PCIe SSDs are capable of combating various storage issues in the datacenter environment. The EP2 series enables systems to process large amounts of data-intensive applications. By combining the NVMe protocol with Lite-On’s customized firmware, commands are bypassed and subsequently, result in improvement for multiple queues and higher queue depths. The CPU is also used to its full potential, so that the IOPS will not be bottlenecked by single core limitations.

The EP2 series delivers superior speed with random read and write performance of up to 250K IOPS/25K IOPS. With ultra-low latencies of 35/35 (μs), the EP2 ensures the fastest and most consistent command response times in the industry. The EP2 also features power loss protection (PLP), scalability, end-to-end data protection, low power consumption, high endurance, sustained performance, and customized firmware, which supports mixed-use environments and application workloads such as online transaction processing (OLTP), financial transactions, E-commerce, SQL logging, collaboration and email servers.